Conductive silver paste for laser cutting, low-temperature curing superfine spherical silver powder and preparation method of conductive silver paste and the low-temperature curing superfine spherical silver powder

A conductive silver paste, laser cutting technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, circuits, etc., can solve the problems of complex process, poor conductivity, low efficiency, etc., and achieve uniform particle size , Narrow particle size distribution, powerful effect
CN111243779AInactive Publication Date: 2020-06-05广东四维新材料有限公司
8 Cites 1 Cited by

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
广东四维新材料有限公司
Publication Date
2020-06-05
Estimated Expiration
Not applicable · inactive patent
Patent Text Reader

Abstract

The invention relates to conductive silver paste for laser cutting, low-temperature curing superfine spherical silver powder and a preparation method of the conductive silver paste and the low-temperature curing superfine spherical silver powder. The conductive silver paste for laser cutting is characterized by comprising the following components in parts by weight: 10-40 parts of a resin material, 0.5-5 parts of blocked isocyanate or amino resin, 20-80 parts of a solvent, 0.1-1 part of a fluorine-containing chlorine compound conductive additive, 0-2 parts of a dispersing agent and 55-60 partsof low-temperature cured superfine spherical silver powder. The conductivity of the conductive silver paste for laser cutting is greatly improved, and then the conductive silver paste can be appliedto laser cutting.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to an electronic paste, in particular to a preparation method for laser cutting conductive silver paste, low-temperature curing ultrafine spherical silver powder and each other. Background technique

[0002] Low-temperature curing silver paste is used for various substrates that can only withstand low-temperature baking. The substrate is generally plastic film (board) or paper film (board), and the material of plastic film (board) is generally PET, PI, PC, etc.; low-temperature curing silver paste can be used in computer keyboards, membrane switches, touch screens and other electronic products. Strict requirements; the existing low-temperature curing silver paste for screen printing can generally only print lines with a width of 60 microns and a line spacing of 60 microns (commonly known as 60 / 60 lines), which cannot meet the current market requirements for electronic products ( Thin lines with a width of 20-25 microns can meet t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More