Conductive silver paste for laser cutting, low-temperature curing superfine spherical silver powder and preparation method of conductive silver paste and the low-temperature curing superfine spherical silver powder

Abstract

The invention relates to conductive silver paste for laser cutting, low-temperature curing superfine spherical silver powder and a preparation method of the conductive silver paste and the low-temperature curing superfine spherical silver powder. The conductive silver paste for laser cutting is characterized by comprising the following components in parts by weight: 10-40 parts of a resin material, 0.5-5 parts of blocked isocyanate or amino resin, 20-80 parts of a solvent, 0.1-1 part of a fluorine-containing chlorine compound conductive additive, 0-2 parts of a dispersing agent and 55-60 partsof low-temperature cured superfine spherical silver powder. The conductivity of the conductive silver paste for laser cutting is greatly improved, and then the conductive silver paste can be appliedto laser cutting.

Description

technical field [0001] The invention relates to an electronic paste, in particular to a preparation method for laser cutting conductive silver paste, low-temperature curing ultrafine spherical silver powder and each other. Background technique [0002] Low-temperature curing silver paste is used for various substrates that can only withstand low-temperature baking. The substrate is generally plastic film (board) or paper film (board), and the material of plastic film (board) is generally PET, PI, PC, etc.; low-temperature curing silver paste can be used in computer keyboards, membrane switches, touch screens and other electronic products. Strict requirements; the existing low-temperature curing silver paste for screen printing can generally only print lines with a width of 60 microns and a line spacing of 60 microns (commonly known as 60 / 60 lines), which cannot meet the current market requirements for electronic products ( Thin lines with a width of 20-25 microns can meet t...

AI Technical Summary

Problems solved by technology

[0002] Low-temperature curing silver paste is used for various substrates that can only withstand low-temperature baking. The substrate is generally plastic film (board) or paper film (board), and the material of plastic film (board) is generally PET, PI, PC, etc.; low-temperature curing silver paste can be used in computer keyboards, membrane switches, touch screens and other electronic products. Strict requirements; the existing low-temperature curing silver paste for screen printing can generally only print lines with a width of 60 microns and a line spacing of 60 microns (commonly known as 60/60 lines), which cannot meet the current market requirements for electronic products ( Thin lines with a width of 20-25 microns can meet the requirements); while screen printing technology can print lines with a width of 25 microns and a line spacing of 25 microns (commonly known as 25/25 lines), but using the existing low-temperature curing silver When the paste is printed, the line spacing cannot reach 25 microns, because the two lines may be connected due to the diffusion of the silver paste, and the two lines will be turned on and short-circuited after curing, so the existing low-level cured silver paste cannot be used for electronic components that are grouped and wired. middle

[0003] In order to solve the above problems, laser c