A circuit and method for detecting the temperature of a semiconductor chip
A semiconductor and circuit technology, applied in the field of circuits for detecting the temperature of semiconductor chips, can solve the problems of large volume, semiconductor chip area occupation, and low temperature detection performance
Active Publication Date: 2020-07-31
杭州优智联科技有限公司
View PDF5 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] In the current existing circuits for detecting, collecting and processing the temperature of semiconductor chips, bipolar junction transistor devices are usually used, resulting in large volume; or MOS tubes or resistors are used, but the temperature detection performance is low; and At present, the most commonly used Wheatstone bridge and Wien bridge architectures require more high-precision operational amplifiers or comparators, and also require an external clock as the sampling clock of the ADC, thus occupying A large proportion of the area in the semiconductor chip
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.
[0033] Conventionally, temperature is an important factor affecting the performance of semiconductor chips, any type of semiconductor chips, such as but not limited to microprocessor chips, memory chips, communication chips, digital signal processing (DSP) chips, power chips, amplifier chips, Field Programmable Gate Array (FPGA), logic chips, etc., will be affected by temperature in terms of their working performance. Therefore, almost all of the semiconductor chips mentioned above will be distributed with circuits for temperature detection, thus forming the temperature of the semiconductor chip. sensor. It should be pointed out that, usually, if figure 1 As shown, there is not only a single temperature sensor or temperature detection circuit 102 in a single semiconductor chi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The embodiment of the present invention discloses a circuit and method for detecting the temperature of a semiconductor chip; the circuit may include a temperature sensing area; wherein, the temperature sensing area includes: a phase-voltage converter configured to: based on the phase - a thermistor within the voltage converter to convert the input phase signal to a temperature-dependent differential voltage signal; a signal conversion sub-circuit configured to convert the temperature-dependent differential voltage signal to a temperature-dependent voltage signal; a voltage-controlled oscillator VCO configured to generate a clock signal based on the control of the voltage signal; wherein the frequency of the clock signal is based on the control of the voltage signal to be correlated with temperature; a frequency-phase generator, A phase signal for input to the phase-to-voltage converter is generated based on the input clock signal.
Description
technical field [0001] Embodiments of the present invention relate to the technical field of integrated circuits (IC, Integrated Circuit), and in particular to a circuit and a method for detecting the temperature of a semiconductor chip. Background technique [0002] Semiconductor chips, which are miniaturized and assembled circuits based on advanced packaging technology, are usually manufactured on the surface of semiconductor wafers. In the manufacturing, testing and final user environment of the semiconductor chip, it is necessary to detect the current real-time working temperature, so that the semiconductor chip can self-adjust the working parameters to ensure the working performance of the semiconductor chip. Conventionally, almost all semiconductor chips need a temperature sensor (temp sensor). For example, there are usually dozens of temperature sensors in the core processor chip. Therefore, the area occupied by the temperature sensor in the semiconductor chip is very...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G01K7/16G01R31/28
CPCG01K7/16G01R31/2851
Inventor 董宗宇
Owner 杭州优智联科技有限公司