Copper-nickel alloy foil and electro-deposition preparation method thereof
A copper-nickel alloy and copper-nickel technology, which is applied in the field of copper-nickel alloy foil and its electrodeposition preparation, can solve the problems of edge tearing, uneven distribution of copper-nickel elements, low yield and the like
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Embodiment 1
[0031] A method for preparing copper-nickel alloy foil provided by the first embodiment of the present invention includes the following steps.
[0032] At a temperature of 50°C and a current density of 3000-4000A / m 2Under condition, use 100g / L sulfuric acid, 85g / L divalent copper ion, 30g / L divalent nickel ion, the electrolytic solution of 0.01g / L chloride ion is made into copper-nickel alloy foil by electrochemical deposition on the cathode roller surface, described The electrolyte contains composite additives and complexing agents, wherein the composite additives include 0.5g / L hydrolyzed collagen (molecular weight between 2000-4000 Daltons), 100ppm 2-propene-1-sulfonic acid sodium salt, 5ppm fatty amine polyoxygen Vinyl ether, 10ppm ethoxylated propynyl alcohol; complexing agents include 10g / L sodium citrate, 20g / L glycine; compound additives are injected into the electrolyte through a metering pump at 5L / h;
[0033] The surface of the copper-nickel alloy foil prepared in ...
Embodiment 2
[0035] Compared with Example 1, the difference is that the complexing agent uses triethanolamine. The alloy foil prepared in this example has a nickel content of only 0.8%.
Embodiment 3
[0037] Compared with Example 1, the difference is that the amount of PME is 30ppm, and the alloy foil prepared in this example has a surface roughness of 1.55um. The test shows that the adhesion is only 68N / m (102N / m in Example 1).
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