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A kind of encapsulation paste based on multidimensional nanomaterial and preparation method thereof

A nanomaterial and paste technology, applied in the fields of nanotechnology, nanotechnology, nanotechnology for materials and surface science, can solve problems such as inability to find, bond strength and fracture resistance cannot meet the needs of use, and achieve The effect of mild execution conditions, improved shear strength, and simple process

Active Publication Date: 2021-06-22
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] During the research and development process, it was found that in related technologies, no matter the packaging paste made of gold, silver, copper or other metal materials, the bonding strength and fracture resistance have not been able to meet the needs of use, and those skilled in the art have never been able to find effective solution

Method used

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  • A kind of encapsulation paste based on multidimensional nanomaterial and preparation method thereof
  • A kind of encapsulation paste based on multidimensional nanomaterial and preparation method thereof
  • A kind of encapsulation paste based on multidimensional nanomaterial and preparation method thereof

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preparation example Construction

[0033] During the research and development and practical application, the applicant found that the sintering effects of nano-metals with different forms are different. The bonding strength is about 9 MPa, which is lower than that of zero-dimensional nanoparticle paste, which is due to the weaker ability of nanowires to form interconnected networks during sintering than nanoparticles. After repeated verification by a large number of experiments, based on the size effect and shape effect, the enhancement of low activation energy and high surface energy diffusion at the nanoscale, the sintering temperature is significantly reduced, and the sintering rate is greatly improved. In order to be able to combine different forms of nano-metals such as zero-dimensional nanoparticles, one-dimensional nanowires or nanotubes, and two-dimensional nanosheets and other multi-dimensional nanometals to provide packaging paste materials with better sintering performance. At the same time, in order...

Embodiment 1

[0052] In a preferred embodiment of the present invention 1, the following steps are used to prepare the packaging paste:

[0053] Use dry etching to form several holes with a diameter of 10nm on the surface of nano-silver wire and nano-silver sheet, configure an ascorbic acid solution with a mass concentration of 0.5wt%, and soak the nano-silver particles, etched nano-silver wire and etched respectively with ascorbic acid solution. After etching the nano-silver sheet for 24 hours, the mass ratio of the ascorbic acid solution to the above-mentioned nano-silver materials was 5:2; after that, the soaking solution was centrifuged, separated, washed, and dried, and the cleaned nano-silver particles, nano-silver wires, Nano-silver flakes are mixed at a mass ratio of 8:3:4, and the mixed nano-silver material is mixed with adipic acid, phenolic resin, and terpineol at a mass ratio of 0.8:0.05:0.01:0.2, and the mixture is ultrasonicated for 20 minutes, shaken Rotary steaming under red...

Embodiment 2

[0055] In a preferred embodiment of the present invention 2, the following steps are used to prepare the packaging paste:

[0056] Use dry etching to form several holes with a diameter of 40nm on the surface of nano-silver wire and nano-silver sheet, configure an ascorbic acid solution with a mass concentration of 0.5wt%, and soak the nano-silver particles, etched nano-silver wire and etched respectively with ascorbic acid solution. After etching the nano-silver sheet for 24 hours, the mass ratio of the ascorbic acid solution to the above-mentioned nano-silver materials was 5:2; after that, the soaking solution was centrifuged, separated, washed, and dried, and the cleaned nano-silver particles, nano-silver wires, Nano-silver flakes are mixed at a mass ratio of 8:3:4, and the mixed nano-silver material is mixed with adipic acid, phenolic resin, and terpineol at a mass ratio of 0.8:0.05:0.01:0.2, and the mixture is ultrasonicated for 20 minutes, shaken Rotary steaming under red...

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Abstract

The present invention provides a packaging paste based on nano-materials and a preparation method thereof, the nano-materials include at least two nano-metals of different dimensions, including the following preparation steps: the first step: in the first nano-metal wire, and / Or etching holes on the surface of the first nano-metal sheet to form a second nano-metal wire, and / or the second nano-metal sheet, the diameter of the hole is 10nm to 40nm; the second step: using the first solvent to clean the first nano-metal particle , the second nano metal wire, and / or the second nano metal sheet, to obtain the second nano metal particle, the third nano metal wire, and / or the third nano metal sheet; the third step: mixing the second nano metal particle, the second nano metal particle The three nanometer metal wires and / or the third nanometer metal sheet obtain a first mixture, and mix the first mixture with a second solvent to obtain a second mixture; the fourth step: concentrate the second mixture to obtain an encapsulation paste. The method has simple process and mild execution conditions, and is suitable for mass production at low cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor interconnection materials, in particular to a packaging paste based on multidimensional nanomaterials and a preparation method thereof. Background technique [0002] In emerging fields such as flexible electronic packaging, there is a growing demand for lead-free solders. The soldering temperature of traditional Sn-based lead-free solders usually exceeds 200°C, which is not conducive to flexible packaging on heat-sensitive organic substrates such as polymers and paper. sintered interconnection. [0003] The low-temperature packaging and interconnection process can effectively solve the above technical problems, and some solutions can be realized through the advantages of nano-metal materials in nano-sintering. In the nanosintering process, relying on the driving force from high surface energy, nanomaterials are sintered together by diffusion to form an encapsulation paste. [0004] During ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B13/00H01B1/02B23K37/00B82Y30/00B82Y40/00
CPCB23K37/00B82Y30/00B82Y40/00H01B1/02H01B13/00
Inventor 唐宏浩张卫红黄显机叶怀宇张国旗
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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