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Method for preparing specific conductive metal pattern on surface of polyimide film

A polyimide film, polyimide film technology, applied in conductive pattern formation, microlithography exposure equipment, photolithography process exposure devices, etc., can solve the problem of poor adhesion between metal wires and polymer substrates, spraying High cost of printing ink preparation, side etching of remaining metal lines, etc., to achieve the effect of improving the utilization rate of raw materials, solving the problem of low processing accuracy and low energy consumption

Inactive Publication Date: 2020-07-17
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problems in the preparation of flexible circuit boards by the subtractive method are that the remaining metal lines are severely corroded, and the metal waste rate is high, energy consumption is large, and pollutant emissions are large.
However, the additive method generally has problems such as high preparation cost of jet printing ink, poor adhesion between the metal wire and the polymer substrate, and low processing accuracy.

Method used

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  • Method for preparing specific conductive metal pattern on surface of polyimide film
  • Method for preparing specific conductive metal pattern on surface of polyimide film
  • Method for preparing specific conductive metal pattern on surface of polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1 A method of preparing a specific conductive metal pattern on the surface of a polyimide film

[0037] In the preparation of photosensitive polyamic acid film, the synthetic route of photosensitive polyamic acid solution is as follows:

[0038]

[0039] 1. Preparation of photosensitive polyamic acid film

[0040] The preparation method is carried out in the following order of steps:

[0041] S1. Under the protection of an inert gas (such as nitrogen), mix 18.4g of 4,4'-biphenylenediamine and 110.9g of biphenylenediamine containing a photosensitive structure into a device equipped with a mechanical stirring device, and then add Add 1556.1g of anhydrous N-methylpyrrolidone (NMP) to the equipment;

[0042] S2. After stirring and dissolving the diamine monomer at 20°C, add 43.6 g of pyromellitic anhydride to the reaction solution at one time;

[0043] S3, continue to stir and react for 24 hours to obtain a photosensitive polyamic acid solution;

[0044] S4. ...

Embodiment 2

[0061] Example 2 A method for preparing a specific conductive metal pattern on the surface of a polyimide film

[0062] In the preparation of photosensitive polyamic acid film, the synthetic route of photosensitive polyamic acid solution is as follows:

[0063]

[0064] 1. Preparation of photosensitive polyamic acid film

[0065] The preparation method is carried out in the following order of steps:

[0066] S1. Under the protection of an inert gas (such as nitrogen), mix 20.0g of 4,4'-biphenyl ether diamine and 59.1g of biphenyl ether diamine containing a photosensitive structure into the equipment equipped with a mechanical stirring device, Then add 1108.8g of anhydrous N,N-dimethylformamide (DMF) to the equipment;

[0067] S2. After stirring and dissolving the diamine monomer at 18°C, add 44.1 g of 3,3',4,4'-biphenyldianhydride to the reaction solution at one time;

[0068] S3, continue stirring and reacting for 20 hours to obtain a photosensitive polyamic acid soluti...

Embodiment 3

[0084] Example 3 A method for preparing a specific conductive metal pattern on the surface of a polyimide film

[0085] In the preparation of photosensitive polyamic acid film, the synthetic route of photosensitive polyamic acid solution is as follows:

[0086]

[0087] 1. Preparation of photosensitive polyamic acid film

[0088] The preparation method is carried out in the following order of steps:

[0089] S1. Under the protection of an inert gas (such as nitrogen), mix 10.8g of p-phenylenediamine and 62.7g of p-phenylenediamine containing a photosensitive structure into the equipment equipped with a mechanical stirring device, and then add 1220.4g to the equipment Anhydrous N,N-dimethylformamide (DMF);

[0090] S2. After stirring and dissolving the diamine monomer at 25°C, add 62.1 g of 4,4'-oxydiphthalic anhydride to the reaction solution at one time;

[0091] S3, continue stirring and reacting for 23 hours to obtain a photosensitive polyamic acid solution;

[0092]...

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Abstract

The invention discloses a method for preparing a specific conductive metal pattern on the surface of a polyimide film, which sequentially comprises the following steps of: (1) performing exposure treatment on a photosensitive polyamide acid film, and immersing the photosensitive polyamide acid film into an organic solution containing a chemical plating catalyst to perform exposure region development, (2) carrying out imidization reaction on the developed photosensitive polyamide acid film to prepare a polyimide film material, and (3) carrying out chemical plating treatment on the polyimide film to prepare the polyimide film material containing the specific conductive metal pattern on the surface. According to the preparation method provided by the invention, the catalyst required by chemical plating can be efficiently deposited on the surface of the photosensitive polyamide acid thin film, synchronous thermal activation is achieved along with the thermal imidization process of the photosensitive polyamide acid thin film, and the imidized thin film can be directly subjected to subsequent metal plating patterning by adopting a chemical plating method. The method is used for continuous and efficient industrial production of polyimide electronic circuit materials.

Description

technical field [0001] The invention belongs to the technical field of preparation of functional polymer materials, in particular to a method for preparing a specific conductive metal pattern on the surface of a polyimide film. Background technique [0002] Polyimide film has great application value in the electronic and electrical manufacturing industry. As one of engineering plastics, polyimide is seldom used alone as a material, and more often it is combined with metal wires and used in electronic products in the form of flexible circuit boards. In the prior art, there are mainly two methods for preparing polyimide flexible circuit boards: subtractive method and additive method. The subtractive method to prepare flexible circuit boards refers to covering the surface of the polymer film with a thin metal layer, and then coating a positive or negative photoresist on the thin metal layer, and then curing the photoresist in a specific area by photolithography. The uncured p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/06C08J7/12C08J5/18C08L79/08C08G73/10G03F7/20H05K3/10
CPCC08G73/1007C08G73/1042C08G73/1067C08J5/18C08J7/06C08J7/12C08J2379/08G03F7/20H05K3/10
Inventor 陈旭东钟世龙洪炜
Owner SUN YAT SEN UNIV
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