Solid-state filling adhesive with heat conduction function, and preparation method thereof

A filling, solid-state technology, applied in the direction of adhesives, epoxy resins, adhesive types, etc., can solve the problem that solid-state fillers do not have thermal conductivity, and achieve good thermal conductivity, reduce agglomeration, and improve the effect of thermal conductivity.

Inactive Publication Date: 2020-07-24
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An object of the present invention is to solve the problem that the existing solid filler does not have thermal conductivity by providing a solid filler with heat conduction function. The solid filler provided by the invention has good thermal conductivity and can dissipate heat from Most of the heat is exported to the outside world to ensure the stability of the chip

Method used

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  • Solid-state filling adhesive with heat conduction function, and preparation method thereof
  • Solid-state filling adhesive with heat conduction function, and preparation method thereof
  • Solid-state filling adhesive with heat conduction function, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A solid filler with thermal conductivity, consisting of the following raw materials in parts by weight:

[0029]

[0030] Wherein, the modified graphene surface has oxygen-containing groups; the modified filler includes graphene with a particle size of 300nm, alumina and silicon powder with a particle size of 0.2 μm, and the mass ratio of graphene, aluminum oxide and silicon powder is 1:5:4; The surface of the modified epoxy resin is modified with nanostructured core-shell rubber particles.

[0031] The preparation method of the solid filler with heat conduction function comprises the following steps:

[0032] S1. Add graphene, alumina and silicon micropowder into ethanol solvent for reaction and dissolution according to the number of parts. The reaction temperature is 35-45° C., and the reaction time is 3-5 hours. After the reaction is completed, wash and dry to obtain a modified filler;

[0033] S2, take another graphene, ethanol, sodium hydroxide and cationic sur...

Embodiment 2

[0036] A solid filler with thermal conductivity, consisting of the following raw materials in parts by weight:

[0037]

[0038]

[0039] Wherein, the modified graphene surface has oxygen-containing groups; the modified filler includes graphene with a particle size of 400nm, alumina and silicon powder with a particle size of 0.5 μm, and the mass ratio of graphene, aluminum oxide and silicon powder is 2:5:3; The surface of the modified epoxy resin is modified with nanostructured core-shell rubber particles.

[0040] The preparation method of the solid filler with heat conduction function comprises the following steps:

[0041] S1. Add graphene, alumina and silicon micropowder into ethanol solvent for reaction and dissolution according to the number of parts. The reaction temperature is 35-45° C., and the reaction time is 3-5 hours. After the reaction is completed, wash and dry to obtain a modified filler;

[0042]S2, take another graphene, ethanol, sodium hydroxide and c...

Embodiment 3

[0045] Different from Example 1, the bisphenol A diglycidyl ether resin in this example is 80 parts, and the modified epoxy resin is 20 parts.

[0046] The rest are the same as in Embodiment 1, and will not be repeated here.

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Abstract

The invention provides a solid-state filling adhesive with a heat conduction function. The solid-state filling adhesive is prepared from the following raw materials in parts by weight: 60-80 parts ofan epoxy resin, 20-30 parts of a modified epoxy resin, 8-10 parts of phosphorus oxychloride, 12-20 parts of modified graphene, 30-40 parts of a modified filler, 4-10 parts of a curing agent, and 3-5 parts of a dispersant, wherein the surface of the modified graphene is provided with an oxygen-containing group, the modified filler comprises graphene, aluminum oxide with a particle size of 0.1-0.5 [mu]m and silicon micro-powder, and the surface of the modified epoxy resin is modified with core-shell rubber particles with a nano structure. Compared with the prior art, the solid-state filling adhesive disclosed by the invention has the advantages that through the combined action of various substances such as the modified graphene, the phosphorus oxychloride, the modified epoxy resin, the epoxyresin and the modified filler, the solid-state filling adhesive has good heat-conducting property, and the problem that the existing solid-state filling adhesive does not have the heat-conducting property is solved.

Description

technical field [0001] The invention relates to the field of fillers, in particular to a solid filler with heat conduction function and a preparation method thereof. Background technique [0002] In recent years, with the development of new technologies and materials, flip-chip technology is also undergoing continuous transformation and development. In order to further reduce costs and enhance the reliability of packaging, the research on fillable materials for flip chips has gradually become a hot issue in the study of electronic packaging technology. As an important part of electronic packaging materials, underfill crosslinking agents can The chip and the substrate are bonded together to reduce the relative movement during the thermal cycle, increase the fatigue life of the solder joints, and buffer and release the stress generated on the solder joints. [0003] Underfill adhesives are divided into flow type underfill adhesives and non-flow type underfill adhesives. Liqu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04
CPCC08K2003/2227C08K2201/003C08K2201/014C08L2203/206C08L2205/025C09J11/04C09J163/00C08L63/00C08K13/06C08K9/10C08K3/042C08K3/22C08K3/36
Inventor 刘准亮石爱斌黄伟希刘伟康
Owner 东莞市新懿电子材料技术有限公司
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