Inner electrode slurry and inner electrode layer for producing multilayer ceramic capacitor

An internal electrode and slurry technology, applied in fixed capacitor electrodes, laminated capacitors, capacitors, etc., can solve problems such as cracking and product delamination, achieve low sintering temperature, reduce sintering internal stress, and meet the effect of high capacity

Inactive Publication Date: 2020-07-24
广东海之源新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem of product delamination and cracking caused by internal defects due to internal stress when using large-capacity and small-size MLCC products in the prior art, and proposes a slurry for internal electrodes and inner electrode layers for making multilayer ceramic capacitors

Method used

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  • Inner electrode slurry and inner electrode layer for producing multilayer ceramic capacitor
  • Inner electrode slurry and inner electrode layer for producing multilayer ceramic capacitor
  • Inner electrode slurry and inner electrode layer for producing multilayer ceramic capacitor

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preparation example Construction

[0035] A preparation method of internal electrode slurry, which is used to prepare the above-mentioned internal electrode slurry; the preparation method of the internal electrode slurry is as follows: step DF1 and step DF2.

[0036] Step DF1: mixing the organic solvent and the polymer resin, heating to 90° C., and maintaining at 90° C. for 4 hours to obtain an organic vehicle.

[0037] Step DF2: mixing copper-nickel alloy powder, ceramic powder, organic additives and organic vehicle to obtain internal electrode slurry.

[0038] The internal electrode slurry includes the following components by mass percentage: 55-65% of copper-nickel alloy powder, 5-10% of ceramic powder, 25-35% of organic solvent, 2.6-5.8% of polymer resin and 0.1-2.7% of organic additive %.

[0039] The preparation method of the above-mentioned internal electrode slurry firstly prepares the organic vehicle, and then mixes the copper-nickel alloy powder, ceramic powder, organic additive and organic vehicle, ...

Embodiment 1

[0042] 1. Preparation of internal electrode slurry

[0043] S1, preparation of organic additives

[0044] Siloxane was dissolved in dibutanol to prepare an organic additive with a concentration of 0.2 g / L.

[0045] S2, preparation of internal electrode slurry

[0046] (1) Preparation of organic carrier

[0047] Select terpineol as the organic solvent, and ethyl cellulose as the polymer resin; mix terpineol and ethyl cellulose, then heat to 90° C., and stir at 90° C. for 2 hours to dissolve the ethyl cellulose to obtain organic carrier.

[0048](2) Mix copper-nickel alloy powder, ceramic powder, organic additive and organic carrier to obtain internal electrode slurry; wherein, the copper-nickel ratio of copper-nickel alloy powder is: copper 30%, nickel 70%; surface area is 2.6m 2 / g, particle size D 50 90 <0.8μm, the mass percentage of copper-nickel alloy powder is 60%, the mass percentage of ceramic powder is 4%, the mass percentage of organic solvent is 30.6%, the mass p...

Embodiment 2

[0058] 1. Preparation of internal electrode slurry

[0059] S1, preparation of organic additives

[0060] Siloxane was dissolved in dibutanol to prepare an organic additive with a concentration of 0.2 g / L.

[0061] S2, preparation of internal electrode slurry

[0062] (1) Preparation of organic carrier

[0063] Select terpineol as the organic solvent, and ethyl cellulose as the polymer resin; mix terpineol and ethyl cellulose, then heat to 90° C., and stir at 90° C. for 2 hours to dissolve the ethyl cellulose to obtain organic carrier.

[0064] (2) Mix copper-nickel alloy powder, ceramic powder, organic additive and organic carrier to obtain internal electrode slurry; wherein, the copper-nickel ratio of copper-nickel alloy powder is: copper 70%, nickel 30%; surface area is 2.6m 2 / g, particle size D 50 90 <0.8μm, the mass percentage of copper-nickel alloy powder is 60%, the mass percentage of ceramic powder is 4%, the mass percentage of organic solvent is 30.6%, the mass ...

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Abstract

The invention discloses inner electrode slurry and an inner electrode layer for producing a multilayer ceramic capacitor, and belongs to the field of electrode manufacturing. The internal electrode slurry comprises a copper-nickel alloy powder, a spherical powder is selected as the copper-nickel alloy powder, and a specific surface area ranges from 1.5 m<2>/g to 3.5 m<2>/g; and granularity D50 ofthe copper-nickel alloy powder is less than 0.3 micron, and the granularity D90 is less than 0.8 micron. The slurry further comprises a ceramic powder, an organic solvent, polymer resin and an organicadditive. The polymer resin and the organic solvent can ensure that required patterns can be completely and uniformly printed by the inner electrode slurry; and the inner electrode slurry can meet use requirements of a high-capacity and small-size multilayer ceramic capacitor.

Description

technical field [0001] The invention relates to the technical field of electrode production, in particular to an internal electrode slurry and an internal electrode layer for preparing a multilayer ceramic capacitor. Background technique [0002] Judging from the market development in recent years, miniaturization and high capacity are the future development direction of MLCC; When dimensioning MLCC products, it is very easy to have internal defects due to internal stress, leading to problems such as product delamination and cracking, and product reliability is difficult to guarantee. Contents of the invention [0003] The purpose of the present invention is to solve the problem of product delamination and cracking caused by internal defects due to internal stress when using large-capacity and small-size MLCC products in the prior art, and proposes a kind of internal electrode slurry And for the preparation of inner electrode layers of multilayer ceramic capacitors. [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/008H01G4/30
CPCH01G4/0085H01G4/30
Inventor 胡愿防伍家伟梁小敏
Owner 广东海之源新材料科技有限公司
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