Al-rich corundum structure Al-Cr-O thin film and preparation method thereof
A technology of al-cr-o and corundum, which is applied in the field of Al-rich corundum structure Al-Cr-O film and its preparation, can solve the problem of reducing stability and reliability, difficult practical application, and reducing corundum structure Al-Cr-O Deposition temperature and other issues, to achieve the effect of small friction coefficient and good thermal stability
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Embodiment 1
[0027] Deposition of Al-corundum Al-Cr-O Thin Films on W9Mo3Cr4V High Speed Steel
[0028] (1) Customized Φ60*3mm Al 70 Cr 30 and pure Cr target, installed on the corresponding target station, adjust the target base distance to 80mm.
[0029] (2) Cut the W9Mo3Cr4V high-speed steel quenched + 560°C and tempered three times into Φ15×5mm size, polished to a mirror surface, ultrasonically cleaned in acetone and absolute ethanol for 15min, dried and placed on the sample stage.
[0030] (3) Pre-evacuate to 10Pa, turn on the infrared baking system and heat to 150°C, and then evacuate to 5×10 -4 Pa, turn off the bake, heat the substrate to 550°C, and continue vacuuming to 5×10 -4 Pa.
[0031] (4) Introduce Ar gas, adjust the air pressure to 1.0Pa, maintain the temperature at 550°C, use a DC power supply to sputter a pure Cr target, and the target power density is 5.3W / cm 2 , the sputtering time is 20min, and a Cr transition layer of 0.5-0.6um is obtained.
[0032] (5) Turn the...
Embodiment 2
[0037] Deposition of Al-corundum Al-Cr-O Thin Films on W9Mo3Cr4V High Speed Steel
[0038] (1) Customized Φ60*3mm Al 70 Cr 30 and pure Cr target, installed on the corresponding target station, adjust the target base distance to 80mm.
[0039] (2) Cut the W9Mo3Cr4V high-speed steel quenched + 560°C and tempered three times into Φ15×5mm size, polished to a mirror surface, ultrasonically cleaned in acetone and absolute ethanol for 15min, dried and placed on the sample stage.
[0040] (3) Pre-evacuate to 10Pa, turn on the infrared baking system and heat to 150°C, and then evacuate to 5×10 -4 Pa, turn off the bake, heat the substrate to 550°C, and continue vacuuming to 5×10 -4 Pa.
[0041] (4) Introduce the Ar body, adjust the air pressure to 1.0Pa, maintain the temperature at 550°C, use a DC power supply to sputter a pure Cr target, and the target power density is 5.3W / cm 2 , the sputtering time is 20min, and a Cr transition layer of 0.5-0.6um is obtained.
[0042] (5) Tur...
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