Needle-shaped alumina carrier

An alumina carrier and alumina technology, which is applied in the field of catalyst carrier preparation and gas-solid phase reaction, can solve the problems of few acupuncture alumina preparation methods and few acupuncture alumina anodes.

Active Publication Date: 2020-07-31
天津泽希新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In simple terms, the polystyrene template is prepared first, then coated on the surface to obtain α-alumina, porous α-alumina is obtained, and then coated on its surface to obtain γ-alumina, the α-γ-alumina can effectively maintain The shape of the polystyrene template, that is, the spherical macroporous structure, currently the alumina prepared on the market is mostly a spherical structure, and there are few preparation methods for needle-shaped alumina, and the needle-shaped alumina is in the gas-solid phase reaction. The anode is also less

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A needle-shaped alumina carrier, comprising the steps of:

[0055] (1) Pretreatment of silicon-based materials: Cut the monocrystalline silicon wafer to a suitable size, and then undergo ultrasonic cleaning with ethanol, acetone, and deionized water to remove oil stains. The number of cleanings is once, and then soak in 10wt% hydrofluoric acid for 10 minutes to remove The oxide layer was washed with deionized water and dried under an inert atmosphere;

[0056] (2) Chemical deposition of Ag particles on the silicon surface: the chemical deposition solution is an aqueous solution of silver nitrate and hydrofluoric acid, the volume ratio of AgNO3:HF:H2O is 1:2:4, and the temperature is 30 o C, the time is 1min;

[0057] (3) Ag particles catalyze the corrosion of silicon materials to obtain corrosion holes: the corrosion solution is an aqueous solution of hydrofluoric acid and hydrogen peroxide, the concentration of HF is 0.3M, and the concentration of H 2 o 2 The concen...

Embodiment 2

[0064] A needle-shaped alumina carrier, comprising the steps of:

[0065] (1) Pretreatment of silicon-based materials: Cut the monocrystalline silicon wafers to a suitable size, then undergo ultrasonic cleaning with ethanol, acetone, and deionized water to remove oil stains, repeat the cleaning times twice, and then soak in 12.5wt% hydrofluoric acid Remove the oxide layer for 10 minutes, wash with deionized water, and dry under an inert atmosphere;

[0066] (2) Chemical deposition of Ag particles on the silicon surface: the chemical deposition solution is an aqueous solution of silver nitrate and hydrofluoric acid, the volume ratio of AgNO3:HF:H2O is 1:2.5:6, and the temperature is 32.5 o C, the time is 1.5min;

[0067] (3) Ag particles catalyze the corrosion of silicon materials to obtain corrosion holes: the corrosion solution is an aqueous solution of hydrofluoric acid and hydrogen peroxide, the concentration of HF is 0.35M, and the concentration of H 2 o 2 The concentra...

Embodiment 3

[0074] A needle-shaped alumina carrier, comprising the steps of:

[0075] (1) Pretreatment of silicon-based materials: Cut the monocrystalline silicon wafers to a suitable size, then undergo ultrasonic cleaning with ethanol, acetone, and deionized water to remove oil stains, repeat the cleaning times 3 times, and then soak in 15wt% hydrofluoric acid for 10 minutes Remove the oxide layer, wash with deionized water, and dry under an inert atmosphere;

[0076] (2) Chemical deposition of Ag particles on the silicon surface: the chemical deposition solution is an aqueous solution of silver nitrate and hydrofluoric acid, the volume ratio of AgNO3:HF:H2O is 1:3:8, and the temperature is 35 o C, the time is 2min;

[0077] (3) Ag particles catalyze the corrosion of silicon materials to obtain corrosion holes: the corrosion solution is an aqueous solution of hydrofluoric acid and hydrogen peroxide, the concentration of HF is 0.45M, and the concentration of H 2 o 2 The concentration i...

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Abstract

The invention provides a needle-shaped aluminum oxide carrier. Porous silicon is adopted as a template, the surface is coated with aluminum oxide and roasted, and the silicone template is removed withfluorine gas to obtain the needle-shaped aluminum oxide carrier. The needle distribution of the needle-shaped aluminum oxide is 20-40 pieces / [mu]m<2>; the needle tips are 15-25 nm, the distance between every two adjacent needle tips is 130-150 nm, the aluminum oxide needle height is 5-8 [mu]m, the specific surface area is 10-13 m<2> / g, the aluminum oxide carrier is prepared by a template method,and silver or silver fluoride particles are attached to the vicinity of the tips of the aluminum oxide.

Description

technical field [0001] The invention relates to a needle-punched alumina carrier, which belongs to the field of catalyst carrier preparation, and is especially suitable for the field of gas-solid phase reaction. [0002] technical background [0003] As a very important catalyst carrier and adsorbent, alumina is widely used in industry. In addition to the excellent properties of ordinary alumina, porous alumina also has outstanding characteristics such as high specific surface area, large pore size, and ordered mesopores, which has become a research hotspot in recent years. [0004] There are many preparation methods for traditional porous alumina materials, such as substitution method and foaming method (generally, bubbles are generated by foaming agent or decompression to form some disordered macropores, but the distribution of pore size and pore type is uneven, which is limited. ) and the template method. Among them, the template method has attracted much attention and f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01J23/50B01J27/12B01J32/00B01J35/10B01J37/08
CPCB01J23/50B01J27/12B01J35/1014B01J37/082Y02P70/50
Inventor 王永芝
Owner 天津泽希新材料有限公司
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