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Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive and 5G copper-clad plate prepared from same

A polyphenylene ether, acrylic technology, applied in the direction of circuit substrate materials, electrical components, printed circuits, etc., can solve problems such as lowering the dielectric constant, and achieve the effects of low dielectric constant, good processability, and improved crosslinking density.

Active Publication Date: 2020-07-31
SHUNDE POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned solutions can reduce the dielectric constant to a certain extent, but with the development of 5G technology, the dielectric constant of the existing solutions needs to be further reduced to meet the requirements for high-frequency and high-speed 5G signal transmission in the future.

Method used

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  • Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive and 5G copper-clad plate prepared from same
  • Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive and 5G copper-clad plate prepared from same
  • Acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive and 5G copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034](1) Synthesis of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0035] In solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol and catalyst A, react at a temperature of 20°C for 2 hours, then add 2,6-dimethyl-1,4-benzenediol was reacted for 3 hours, and by precipitation method, a low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin was obtained, and its structure was shown in the following formula; solvent B, 2,6-di The weight ratio of (trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-dimethyl-1,4-benzenediol is: 100:50 :200:10:1:10.

[0036]

[0037] In the structural formula, x is 5, y is 20, z is 1, and n is 6.

[0038] The solvent B is tetrahydrofuran, and the catalyst A is cuprous chloride-di-n-butylamine.

[0039] (2) Synthesis of low molecular weight acrylic acid modified fluorine-containing polyphenylene ether:

[0040] Th...

Embodiment 2

[0052] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0053] In solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol and catalyst A, react at a temperature of 40°C for 4 hours, then add 2,6-Dimethyl-1,4-benzenediol was reacted for 3 hours, and by precipitation method, a low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin was obtained, and its structure was shown in the following formula; wherein solvent B, 2,6- Two (trifluoromethyl) phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-dimethyl-1, the weight ratio of 4-benzenediol is: 100: 80:400:20:3:20.

[0054]

[0055] In the structural formula, x is 8, y is 40, z is 2, n is 20;

[0056] The solvent B is cyclohexanone, and the catalyst A is cuprous bromide-N,N-dimethylbutylamine.

[0057] (2) Preparation of low molecular weight acrylic acid modified fluorinated polyphenylene ether:

...

Embodiment 3

[0069] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0070] In solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol and catalyst A, react at a temperature of 60°C for 6 hours, then add 2,6-Dimethyl-1,4-benzenediol was reacted for 5 hours, and by precipitation method, a low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin was obtained, and its structure was shown in the following formula; wherein solvent B, 2,6- Two (trifluoromethyl) phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-dimethyl-1, the weight ratio of 4-benzenediol is: 100: 90:700:50:6:30.

[0071]

[0072] In the structural formula, x is 9, y is 70, z is 5, and n is 50;

[0073] The solvent B is chloroform, and the catalyst A is copper bromide-diethylamine.

[0074] (2) Preparation of low molecular weight acrylic acid modified fluorinated polyphenylene ether:

[0075] Th...

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Abstract

The invention relates to an acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive and a 5G copper-clad plate prepared from the same. The acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive is characterized by comprising low-molecular-weight acrylic acid modified fluorine-containing polyphenyl ether, a crosslinking agent, an initiator, a flame retardant, a polymerization inhibitor, a silane coupling agent, a filler and a solvent A. The 5G copper-clad plate prepared from the acrylic acid modified low-dielectric fluorine-containing polyphenyl ether mixed adhesive is beneficial to transmission of high-frequency and high-speed 5G signals and can be applied to the field of next-generation high-frequency and high-speed plates. The multifunctional double-bond acrylic-terminated fluorine-containing polyphenyl ether can further improve the crosslinking density of the copper-clad plate coating and improve the comprehensive mechanical strength of the copper-clad plate.

Description

technical field [0001] The invention relates to an acrylic modified low-dielectric fluorine-containing polyphenylene ether mixed adhesive, in particular to an acrylic modified low-dielectric fluorinated polyphenylene ether mixed adhesive and the preparation thereof for a low-dielectric high-frequency high-speed 5G copper clad board. Background technique [0002] With the development of communication technology, especially the arrival of the 5G era, the amount of data transmitted by signals is increasing, and the low-latency characteristics require large amounts of data and high-speed transmission. Therefore, the performance of high-frequency and high-speed printed circuit boards is becoming more and more important. The higher, in order to reduce the transmission loss of high frequency, the electrical insulator with excellent electrical characteristics has become the research focus in the field of copper clad laminates. [0003] The most widely used copper clad laminate mater...

Claims

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Application Information

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IPC IPC(8): C08F283/08C08F222/14C08F222/20C08F2/44C08K3/36C08K5/5435C08K5/523C08K7/18C08K5/548C08K5/03C08K3/22C08K5/5425C08K5/136C08G65/48C08G65/38H05K1/03
CPCC08F283/085C08F2/44C08K3/36C08K5/5435C08K5/523C08K7/18C08K5/548C08K5/03C08K3/22C08K5/5425C08K5/136C08G65/485C08G65/38H05K1/0373C08K2003/2227C08F222/1006
Inventor 唐秋实刘锋陈燕舞林雯雯陈海明
Owner SHUNDE POLYTECHNIC