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A method that improves the performance of the film through cross -linking

A film and performance technology, applied in the field of improving film performance, can solve the problems of chemical stability and mechanical properties of polyimide films, such as insufficient thermal expansion resistance, and achieve clear conception, tear resistance and thermal expansion resistance. boosted effect

Active Publication Date: 2022-08-05
江苏环峰电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the chemical stability, mechanical properties and thermal expansion resistance of the polyimide film are not good enough in the prior art, and to provide a method for improving the performance of the film through crosslinking

Method used

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  • A method that improves the performance of the film through cross -linking
  • A method that improves the performance of the film through cross -linking
  • A method that improves the performance of the film through cross -linking

Examples

Experimental program
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Effect test

Embodiment 1

[0036] A method for improving film performance through cross-linking. The cross-linking agent is introduced into the molecular chain of polyimide by means of copolymerization, and the cross-linking agent is induced to cross-link during the film-forming process of the polyimide; wherein, the cross-linking agent is cross-linked. The structural formula of the joint agent is:

[0037]

[0038]The copolymerization process is as follows: firstly, TMAc, diamine and cross-linking agent in a molar ratio of 100:98:2 are mixed, reacted at a temperature of 0 °C for 1 h, then reacted at a temperature of 25 °C for 3 h, and then reacted to the reaction Pyridine and acetic anhydride were added to the system and reacted for 24 hours. Finally, the obtained product was separated out in isopropanol solution, pulverized, washed with isopropanol for 3 times, and dried under vacuum to obtain white powder, in which pyridine and acetic anhydride were mixed. The molar addition amount is 2 times and ...

Embodiment 2

[0046] A method for improving film performance through cross-linking. The cross-linking agent is introduced into the molecular chain of polyimide by means of copolymerization, and the cross-linking agent is induced to cross-link during the film-forming process of the polyimide; wherein, the cross-linking agent is cross-linked. The structural formula of the joint agent is:

[0047]

[0048] The copolymerization process is as follows: firstly, TMAc, diamine and cross-linking agent in a molar ratio of 100:92:8 are mixed, reacted at a temperature of 2 °C for 2 h, then reacted at a temperature of 28 °C for 2 h, and then reacted to the reaction Pyridine and acetic anhydride were added to the system and reacted for 20 hours. Finally, the obtained product was precipitated in isopropanol solution, pulverized, washed three times with isopropanol, and dried in vacuum to obtain a white powder, in which pyridine and acetic anhydride were mixed. The molar addition is 2 times and 6 times ...

Embodiment 3

[0053] A method for improving film performance through cross-linking. The cross-linking agent is introduced into the molecular chain of polyimide by means of copolymerization, and the cross-linking agent is induced to cross-link during the film-forming process of the polyimide; wherein, the cross-linking agent is cross-linked. The structural formula of the joint agent is:

[0054]

[0055] The copolymerization process is as follows: firstly, the molar ratio of TMAc, diamine and cross-linking agent is mixed, and the reaction is carried out at a temperature of 3 °C for 1 h, then at a temperature of 30 °C for 1 h, and then to the reaction Pyridine and acetic anhydride were added to the system to react for 12 hours, and finally the obtained product was precipitated in isopropanol solution, pulverized, washed with isopropanol for 5 times, and vacuum-dried to obtain a white powder, in which pyridine and acetic anhydride were mixed. The molar addition is 1 and 3 times the molar ad...

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Abstract

The invention relates to a method for improving film performance through cross-linking. The cross-linking agent is introduced into the molecular chain of the polymer by means of copolymerization, and cross-linking of the cross-linking agent is initiated during the film-forming process of the polymer; The structural formula of the cross-linking agent is as follows: The method for improving the performance of the film by cross-linking of the present invention is simple and easy to implement, and the effect is remarkable. After the cross-linking, the film is insoluble in concentrated sulfuric acid, concentrated nitric acid, concentrated hydrochloric acid, phosphoric acid, and acetic acid. , the sodium hydroxide aqueous solution that the concentration is 20wt%, the potassium hydroxide aqueous solution that the concentration is 20wt%, N-methylpyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylformamide Sulfoxide, ethyl acetate, acetone, methanol and isopropanol; after cross-linking, the basic breaking work of the film is 38-49 KJ / m 2 ; After cross-linking, the thermal expansion coefficient of the film is less than 3.0ppm / k.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and relates to a method for improving film performance through cross-linking. Background technique [0002] Due to its rigid chemical structure, polyimide (PI) has outstanding mechanical properties, high thermal stability, strong solvent resistance, and a certain degree of hydrophilicity (mainly because the imide bond can interact with water. forming hydrogen bonds), has attracted much attention in recent years as functional materials and separation membrane materials. [0003] As a high-performance special engineering plastic film, polyimide film has stable and excellent physical properties, chemical properties and electrical properties in a wide temperature range, especially high thermal and cold stability and glass transition temperature. High-tech fields such as aerospace and microelectronics are widely used. In the international market, polyimide films are mainly used for H-class, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12C08J5/18C08L79/08
CPCC08G73/126C08J5/18C08J2379/08
Inventor 张振宇
Owner 江苏环峰电工材料有限公司