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A kind of low temperature rapid curing epoxy resin adhesive for relay and its preparation method

An epoxy resin glue, fast curing technology, used in the field of chemical materials, can solve the problem that the relay cannot be used for a long time at a higher temperature, reduce the curing temperature and curing time, etc., achieve excellent mechanical properties, reduce curing temperature and curing The effect of long time, low temperature storage time

Active Publication Date: 2022-06-14
DONGGUAN HUARTONG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to, aiming at the above-mentioned deficiencies in the prior art, provide a kind of low-temperature fast-curing epoxy resin adhesive for relays, overcome the defect that relays cannot be used for a long time at higher temperatures, and use liquid imidazole metal complexes to Rapid curing of epoxy resin at low temperature has the advantages of rapid curing at low temperature, storage stability, and good mechanical properties. It greatly reduces the curing temperature and curing time, greatly improves production efficiency, reduces the risk of component damage, and meets the requirements of the relay production process.

Method used

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  • A kind of low temperature rapid curing epoxy resin adhesive for relay and its preparation method

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Embodiment 1

[0023] Embodiment 1: The present embodiment provides a low-temperature fast-curing epoxy resin adhesive for relays and a preparation method thereof, including step S1: preparing 1-cyanoethyl-2-ethyl-4-methylimidazole and metal Copper compound liquid metal complex curing agent (1C2E4MI) n.Cu(NO3)2: the specific steps include adding 1C2E4MI (16.3g, 0.1mol) and acetone (500ml) into a reaction vessel with a condensation recovery device, magnetic Stir well; dissolve copper nitrate (2.7g, 0.02mol) in acetone (50ml) and slowly add the blue copper nitrate-acetone solution to the 1C2E4MI-acetone solution, control the drop rate to 10ml / min, and stir while adding dropwise , after obtaining 1C2E4MI-acetone-copper nitrate solution, it was heated to 50 ° C, reacted for 3 hours and kept stirring, and the acetone was condensed and reclaimed. After the reaction, the solution was cooled to room temperature, and the by-product solid product was separated out. After filtering, the filtrate was dis...

Embodiment 2

[0025] Embodiment 2: A low-temperature fast-curing epoxy resin adhesive for relays and its preparation method provided in this embodiment are basically the same as those in Embodiment 1, except that 45 g of epoxy resin E51 and 12 g of polypropylene glycol are weighed. Diglycidyl ether, 8g liquid metal complex curing agent (1C2E4MI) n.Cu(NO3)2.

Embodiment 3： Embodiment 1 and ， and Embodiment 1，：50gE44、5g 2 2 、5gCTBN、33g1250、1.5g。 comparative example 1

[0026] Embodiment 3: A low-temperature fast-curing epoxy resin adhesive for relays and its preparation method provided in this embodiment are basically the same as those in Embodiment 1, except that 50 g of epoxy resin E44 and 5 g of polypropylene glycol are weighed. Diglycidyl ether, 5g of carboxy-terminated CTBN, 33g of 1250-mesh silicon micropowder, and 1.5g of white carbon black. Comparative Example 1: A low-temperature fast-curing epoxy resin adhesive for relays and its preparation method provided in this example, weigh 50 g of epoxy resin E44 and 10 g of carboxyl-terminated CTBN and mix them evenly, and mechanically stir for 10 minutes; 5g of 1C2E4MI and 0.5g of antioxidant BHT were added to the epoxy resin / carboxy-terminated CTBN mixture in turn, and mechanically stirred for 20 minutes; 32g of 600-mesh active aluminum hydroxide and 2.5g of bentonite were added to the above mixture, and mechanically stirred for 60 minutes. Finally, hollow defoaming takes 20-40 minutes to...

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Abstract

The invention discloses a low-temperature fast-curing epoxy resin adhesive for relays and a preparation method thereof, comprising the following components in parts by weight: 35-60 parts of epoxy resin, 10-30 parts of toughening agent, 5 parts of curing agent -20 parts, 0.2-1.5 parts of stabilizer, 20-40 parts of filler, 1-3 parts of thixotropic agent; the curing agent is 1-cyanoethyl-2-ethyl-4-methylimidazole and metal copper The complex liquid metal complex is made from the following materials: 1-cyanoethyl-2-ethyl-4-methylimidazole, acetone, copper nitrate acetone solution. Compared with the prior art, the present invention overcomes the defect that the relay cannot be used at a higher temperature for a long time, and uses liquid imidazole metal complexes to quickly cure epoxy resin at low temperature, and has low-temperature rapid curing, storage stability, and mechanical properties Good and other advantages, greatly reducing the curing temperature and curing time, greatly improving production efficiency, reducing the risk of component damage, and meeting the requirements of the relay production process.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a low-temperature fast-curing epoxy resin adhesive for relays and a preparation method thereof. Background technique [0002] The curing temperature of the one-component epoxy resin adhesive is mostly between 110-150 ℃, and the curing time is about 120mm. The curing temperature is high and the curing time is long, which cannot meet the technological requirements of the relay. Imidazole and its modified substances are a kind of very important anion polymerized epoxy resin curing agent, with less dosage, long pot life, medium temperature curing, low volatility, low toxicity or non-toxicity, and they should also be widely used. Compared with the crystalline imidazole curing agent, the liquid imidazole curing agent has the advantages of better mixing with resin, higher reactivity, lower reaction temperature, etc. disadvantages. [0003] In view of this, it is indeed nece...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08C07F1/08C08G59/50
CPCC09J163/00C09J11/04C09J11/06C09J11/08C07F1/005C07F1/08C08G59/5093
Inventor 钟群东吴启华钟群璋朱志通
Owner DONGGUAN HUARTONG ELECTRONICS
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