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High thermal conductor and preparation method thereof

A technology of high thermal conductivity and thermal conductivity film, applied in the direction of semiconductor devices, chemical instruments and methods, semiconductor/solid-state device components, etc. problem, to achieve the effect of low density, adjustable thickness and simple method

Inactive Publication Date: 2020-08-07
HARBIN INST OF TECH AT WEIHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the thermal conductive film is combined with the polymer, due to the low thermal conductivity and poor temperature resistance of the polymer itself, the heat transfer between the graphite film layers is slow, and it cannot be used as a heat dissipation material in a high temperature environment.
In addition, the method of compounding the thermally conductive film by using adhesives and other methods may greatly affect the thermal conductivity of the thermally conductive film, which weakens the original high thermal conductivity of the thermally conductive film.

Method used

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  • High thermal conductor and preparation method thereof
  • High thermal conductor and preparation method thereof
  • High thermal conductor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1. S101, cutting: prepare 20 reduced graphene oxide films with the same size (9cm×9cm×35μm);

[0034] 2. S102, stacking: stacking the cut graphene film layer by layer to make a graphene film laminate;

[0035] 3. S103, pressurization: place the graphene film laminate in a vacuum hot-press furnace, the size of the upper and lower pressure heads is 10cm×10cm×1cm, and there are arrayed square protrusions on the surface, the height of the protrusions is 5 μm, and the protrusions The side length is 2mm×1mm, the protrusion density is 10 pieces / square centimeter, the vacuum degree is 0.02MPa, and a pressure of 60MPa is applied in the direction perpendicular to the surface of the heat-conducting film laminate, and the pressurization time is 1h to obtain the final High thermal conductivity.

[0036] The density of the high heat conductor formed in this example is 1.96g / cm 3 , the thickness is about 0.5mm, and the plane thermal conductivity is 900W / (m·K). This embodiment shows ...

Embodiment 2

[0038] 1. S101, cutting: prepare 20 pyrolytic graphite films with the same size (30cm×10cm×30μm);

[0039] 2. S102, stacking: stacking 20 prepared graphite films to form a graphite film stack;

[0040] 3. S103, pressurization: place the graphite film laminate in a rolling mill, the size of the upper and lower rolls is φ10*20, and the surface is continuous hemispherical protrusions, the height of the protrusions is 10 μm, the rolling pressure is 100 MPa, and the rolling pressure is 100 MPa. The number of times of manufacturing is 10 times to obtain the final high thermal conductivity body.

[0041] The density of the high heat conductor formed in this example is 1.89g / cm 3 , the thickness is about 0.5mm, and the plane thermal conductivity is 800W / (m·K). This embodiment shows that the high thermal conductor prepared by the present invention has the advantages of low density, adjustable thickness, high temperature resistance, and high thermal conductivity.

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Abstract

The invention provides a high thermal conductor and a preparation method thereof, wherein the high thermal conductor is formed by taking a high-thermal-conductivity film as a raw material and generating concave-convex interlocking micro-deformation between the thermal-conductivity films. The method is simple and reliable, is free of an adhesive layer, is high in operability and tight in combination of the heat conduction films, and can be applied to various system heat conduction films. The thermal conductor prepared by the method has the advantages of small density, adjustable thickness, highlongitudinal heat conductivity, better mechanical property, stronger interlayer binding force and the like, and can be widely applied to heat management of electronic products.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a high heat conductor and a preparation method thereof. Background technique [0002] Existing patent documents: 1) Application for patent CN 105692601 A, accepted, a method for preparing graphene block material and obtained graphene. [0003] 2) Patent application CN 109246977 A, accepted, a preparation method of high thermal conductivity graphite composite material. [0004] 3) Patent application CN 104669702 A, accepted, a composite block of graphite heat-conducting film and its manufacturing method. [0005] With the rapid development of the integrated circuit industry, the volume of electronic devices continues to shrink, but the number of transistors is increasing, the chip integration level is getting higher and higher, and the heat flux density is also increasing. High-power electronic components will generate a lot of heat. If effective thermal management measures ar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B5/02B32B5/26B32B3/30B32B7/022B32B7/027B32B33/00B32B37/10B32B37/06B32B38/00H01L23/373
CPCB32B3/30B32B5/02B32B5/26B32B9/007B32B9/04B32B33/00B32B37/06B32B37/10B32B38/0004B32B38/0012B32B2262/106B32B2307/302B32B2307/306B32B2307/50B32B7/022B32B7/027H01L23/3735
Inventor 王华涛田聪吴亚金吴绪磊钟博
Owner HARBIN INST OF TECH AT WEIHAI
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