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Epoxy resin adhesive for bonding rubber materials and formula thereof

A technology of epoxy resin and rubber material, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of thixotropy in pot life, insufficient toughness of adhesive, difficult to control room temperature curing, etc., to improve weather resistance and High and low temperature resistance, good mechanical properties and adhesive properties, the effect of intense molecular motion

Pending Publication Date: 2020-08-11
湖北航泰科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the prior art, the present invention provides an epoxy resin adhesive for bonding rubber materials and its formula, which solves the problems of insufficient toughness of the adhesive, difficult control of room temperature curing, pot life, thixotropy, permeability, and weather resistance. and environmental resistance, the adhesive can be better applied to the use scene inside the rocket engine

Method used

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  • Epoxy resin adhesive for bonding rubber materials and formula thereof
  • Epoxy resin adhesive for bonding rubber materials and formula thereof
  • Epoxy resin adhesive for bonding rubber materials and formula thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] A kind of epoxy resin adhesive formula that is used for rubber material bonding of the present invention, comprises A component, B component and hydrophilic silica, the quality of described A component, B component and hydrophilic silica The ratio is 100:40-55:1-8, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0055] The mass ratio of component A, component B and hydrophilic silica in this example is 100:40:6. In another embodiment it is 100:50:1 and in another embodiment it is 100:55:8.

[0056] The viscosity of the A component is 120000cps, and the density is 1.07g / cm 3 , Epoxy value 0.35mol / 100g, it is light yellow transparent viscous liquid.

[0057] The viscosity of the B component is 7800cps, and the density is 0.95g / cm 3 , the amine value is 380mgKOH / 100g, it is light brown transparent viscous liquid.

[0058] The A component includes 86.2 parts by mass of linear organosili...

Embodiment 2

[0078] A kind of epoxy resin adhesive formula that is used for rubber material bonding of the present invention, comprises A component, B component and hydrophilic silica, the quality of described A component, B component and hydrophilic silica The ratio is 100:40-55:5-7, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0079] The mass ratio of component A, component B and hydrophilic silica in this example is 100:45:7.

[0080] The viscosity of the A component is 150000cps, and the density is 1.06g / cm 3 , Epoxy value 0.33mol / 100g, it is light yellow transparent viscous liquid.

[0081] The viscosity of the B component is 7800cps, and the density is 0.95g / cm 3 , the amine value is 360mgKOH / 100g, it is light brown transparent viscous liquid.

[0082] The A component includes 82 parts by mass of linear organosilicon-modified epoxy and 18 parts by mass of hyperbranched epoxy to obtain a reactio...

Embodiment 3

[0102] A kind of epoxy resin adhesive formula that is used for rubber material bonding of the present invention, comprises A component, B component and hydrophilic silica, the quality of described A component, B component and hydrophilic silica The ratio is 100:40-55:5-7, the A component is a polysiloxane modified epoxy resin body, and the B component is a low molecular weight polyamide curing agent.

[0103] The mass ratio of component A, component B and hydrophilic silica in this example is 100:53:5. In another embodiment it is 100:53:7.

[0104] The viscosity of the A component is 110000cps, and the density is 1.02g / cm 3 , Epoxy value 0.31mol / 100g, it is light yellow transparent viscous liquid.

[0105] The viscosity of the B component is 8300cps, and the density is 1.00g / cm 3 , amine value 400mgKOH / 100g, light brown transparent viscous liquid.

[0106] The A component includes 90 parts by mass of linear silicone-modified epoxy and 10 parts by mass of hyperbranched epox...

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Abstract

The invention discloses an epoxy resin adhesive for bonding rubber materials. The adhesive comprises a component A, a component B and hydrophilic white carbon black, the mass ratio of the component Ato the component B to the hydrophilic white carbon black is 100: 40-55: 1-8, the component A is a polysiloxane modified epoxy resin body, and the component B is a low-molecular-weight polyamide curingagent. The low-molecular-weight polyamide curing agent is one or more of Zhenjiang Danbao 650, Wuxi phoenix 650 and Shuntian polyamide epoxy curing agent 650; the hydrophilic white carbon black is American Cabot hydrophilic fumed silica M-5 12 nano silicon dioxide, Germany Wacker white carbon black N20 hydrophilic fumed silica, Yuanjiang YJ No.2, Cabot CAB-O-SIL TS-530, Degussa A380 fumed silica, and Evonik AEROSIL 200. The bonding force is high. According to the formula, the molecular equivalent radius of bead-chain hyperbranched polymer with the same molecular weight is small, such that the molecular motion is violent, the permeability is strong, and the adhesion to the nitrile rubber is strong.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an epoxy resin adhesive used for bonding rubber materials and a formula thereof. Background technique [0002] Both the heat insulation layer of the rocket engine casing and the heat insulation layer of the grain are nitrile rubber, and the process needs to bond the two layers of nitrile rubber surfaces. The current process is to apply glue on the thermal insulation layer of the grain column first, and then push the grain column into place to bond the grain column and the thermal insulation layer of the shell. The glue in the bonding process is not easy to apply and scrape on the surface of the drug column to be bonded, and the glue hangs seriously, resulting in a large amount of actual glue application workload, uneven distribution of the glue on the drug column surface, and a period of glue application operation window. Short, time-consuming overall charge bonding process and other pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08K7/26
Inventor 黄驰胡铭杰廖俊吕爱民
Owner 湖北航泰科技有限公司
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