Electroplating solution for diamond cutting line and preparation method of electroplating solution

A diamond cutting wire and solution technology, applied in the field of electroplating, can solve the problems of loss of cutting ability, easy falling off of diamond particles, pinholes in the coating, etc., and achieve the effect of increasing the anode current density, promoting normal dissolution, and improving the toughness of the coating.

Inactive Publication Date: 2020-08-28
信丰崇辉科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the electroplating solution used in electroplating is prone to anodic polarization during the electroplating process, which reduces the anode current density, and the main salt concentration fluctuates greatly during the electroplating process. At the same time, the plating layer formed by electroplating is prone to fine Unevenness and pinholes lead to insufficient holding force of the coating on the diamond, and the diamond particles are easy to fall off during cutting, resulting in loss of cutting ability

Method used

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  • Electroplating solution for diamond cutting line and preparation method of electroplating solution

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Experimental program
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Effect test

Embodiment 1

[0029] The invention provides an electroplating solution for a diamond cutting wire, comprising the following concentration of solutes: main salt 300g / L, conductive salt 20g / L, complexing agent 3ml / L, stress reliever 8ml / L, electroplating stabilizer 25ml / L L, coating refiner 8ml / L, anode activator 5ml / L, diamond powder 10g / L, other additives 35ml / L, appropriate amount of buffer, and the solvent used for the solute is water;

[0030] The main salt is nickel sulfamate;

[0031] The conductive salt is any one of NaCl or KCl, which can greatly increase the conductivity of the solution, and will not complexate the discharge metal ions;

[0032] Complexing agent is K 4 P 2 o 7 or Na 4 P 2 o 7 Any one of them can improve the dispersing ability and covering ability of the plating solution;

[0033] The stress reliever is coumarin, which can reduce the internal stress of the coating and improve the toughness of the coating;

[0034] Buffer is H 3 BO 3 or Na 2 HPO 4 Any one ...

Embodiment 2

[0046] The invention provides a kind of electroplating solution for diamond cutting wire, comprising the following concentration of solute: main salt 400g / L, conductive salt 25g / L, complexing agent 4ml / L, stress reliever 10ml / L, electroplating stabilizer 28ml / L L, coating refiner 12ml / L, anode activator 8ml / L, diamond micropowder 13g / L, other additives 40ml / L, buffering agent amount, and the used solvent of this solute is water;

[0047] The main salt is nickel sulfamate;

[0048] The conductive salt is any one of NaCl or KCl, which can greatly increase the conductivity of the solution, and will not complexate the discharge metal ions;

[0049] Complexing agent is K 4 P 2 o 7 or Na 4 P 2 o 7 Any one of them can improve the dispersing ability and covering ability of the plating solution;

[0050] The stress reliever is coumarin, which can reduce the internal stress of the coating and improve the toughness of the coating;

[0051] Buffer is H 3 BO 3 or Na 2 HPO 4 Any...

Embodiment 3

[0063] The invention provides a kind of electroplating solution for diamond cutting wire, comprising the following concentration of solute: main salt 500g / L, conductive salt 30g / L, complexing agent 5ml / L, stress reliever 12ml / L, electroplating stabilizer 30ml / L L, coating refiner 15ml / L, anode activator 10ml / L, diamond powder 15g / L, other additives 45ml / L, appropriate amount of buffer, and the solvent used for the solute is water;

[0064] The main salt is nickel sulfamate;

[0065] The conductive salt is any one of NaCl or KCl, which can greatly increase the conductivity of the solution, and will not complexate the discharge metal ions;

[0066] Complexing agent is K 4 P 2 o 7 or Na 4 P 2 o 7 Any one of them can improve the dispersing ability and covering ability of the plating solution;

[0067] The stress reliever is coumarin, which can reduce the internal stress of the coating and improve the toughness of the coating;

[0068] Buffer is H 3 BO 3 or Na 2 HPO 4 A...

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Abstract

The invention discloses an electroplating solution for a diamond cutting line and a preparation method of the electroplating solution, and particularly relates to the technical field of electroplating. The electroplating solution comprises a solute with the following concentration: main salt 300-500 g / L, conductive salt 20-30 g / L, a complexing agent 3-5 ml / L, a stress relieving agent 8-12 ml / L, anelectroplating stabilizer 25-30 ml / L, a plating layer refiner 8-15 ml / L, an anode activator 5-10 ml / L, diamond micro-powder 10-15 g / L, other auxiliaries 35-45 ml / L, and a buffering agent, wherein a solvent used by the solute is water. According to the technical scheme, the anode polarization phenomenon is eliminated or reduced in the electroplating process by using the anode activator, then the normal dissolution of the anode is promoted, thus the current density of the anode is improved, meanwhile, the soluble anode is used for conducting electricity and controlling the distribution of current on the surface of a cathode, discharge metal ions can be supplemented into the plating solution, and in addition, a leveling agent and a wetting agent are used for solving the problem that a plating layer formed by electroplating easily have tiny unevenness and pinholes.

Description

technical field [0001] The invention relates to the technical field of electroplating, and more specifically, the invention relates to an electroplating solution for a diamond cutting wire and a preparation method thereof. Background technique [0002] Solar photovoltaic power generation is one of the rapidly developing forms of sustainable energy utilization. It has developed rapidly in the United States, the European Union, Japan and China in recent years. At present, the most widely used photovoltaic power generation is crystalline silicon solar cells. Reducing the cost of solar power generation has always been the development goal of the photovoltaic industry. The open truncation of silicon ingots requires the use of diamond cutting wires for cutting and truncation, and the cutting life of diamond cutting wires directly affects the cost of power generation. [0003] The traditional nickel plating method is to fix the diamond particles on the surface of the stainless st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/12C25D7/06C25D5/54
CPCC25D3/12C25D5/54C25D7/0607
Inventor 郑建国罗小平
Owner 信丰崇辉科技有限公司
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