Adhesive composition, packaging film, and organic electronic device containing packaging film
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHINA LUCKY FILM CORP
- Publication Date
- 2020-09-01
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Abstract
Description
technical field
[0001] The present invention relates to the field of materials. Specifically, the present invention relates to an adhesive composition, an encapsulating film, and an organic electronic device including the encapsulating film. Background technique
[0002] Organic electronic devices refer to devices that use holes and electrons to generate alternating currents of organic material layers, including photovoltaic devices, rectifiers, transistors, and organic light-emitting diodes (OLEDs).
[0003] Taking an organic light emitting diode (OLED) as an example, an organic light emitting diode generally includes a layer made of a functional organic material present between a pair of electrodes comprising a metal or a metal oxide. Oxygen permeating into the OLED may cause oxidation of the electrodes, and moisture permeating into the OLED may cause corrosion of the electrodes or decomposition of organic materials. In addition, oxygen or moisture may cause separation b...