A kind of polyamide film and preparation method thereof

Abstract

The present invention provides a kind of polyamide film, comprises first surface layer, first nylon layer, core layer, second nylon layer and second surface layer successively; Raw materials are prepared: 77wt% to 87wt% polyamide resin, 10wt% to 15wt% nylon graft copolymer and 3wt% to 8wt% nylon masterbatch; the first nylon layer and the second nylon layer are independently composed of the following components: The raw materials are divided into: 55wt%-78wt% polyamide resin, 12wt%-25wt% combined additives and 10wt%-20wt% amorphous nylon; the core layer consists of nylon 6, nylon 66, adipate polyetheramine In situ copolymerization of salt and montmorillonite. The polyamide film of the invention adopts multi-layer composite, and each layer is based on polyamide resin, and other components are combined to improve the toughness of the film and further improve the cold stamping performance of the film.

Description

A kind of polyamide film and preparation method thereof technical field The invention belongs to technical field of flexible packaging, be specifically related to a kind of polyamide film and preparation method thereof. Background technique [0002] Relying on the advantages of miniaturization, thinning, light weight and large capacity, soft-pack lithium-ion batteries are widely used in new energy vehicles. And 3C digital consumer electronic products and other fields are favored. At present, soft-pack lithium-ion batteries use aluminum-plastic composite films as their outer layers. The packaging material is mainly composed of five layers: the outer polyamide layer, the adhesive, the middle layer of aluminum foil, the adhesive, and the inner heat-sealing layer. With the continuous development of the pharmaceutical industry, the traditional blister packaging method is very limited due to the limited barrier performance of the PVC rigid sheet. It is difficult to guarante...

AI Technical Summary

Problems solved by technology

The existing method one is to thicken the polyamide layer, and the other is to improve the composition of the polyamide layer. Although the former method can meet the toughness requirements, it causes a waste of materials, so the latter method is usually used, such as patent CN103319883A describes a high-toughness polyamide, the mass percentage of the required proportioning substances is: polyamide: 60-70%, glass fiber: 20-40%, acrylate ultrafine particles: 2.00-5.00%, bisphenol A Epoxy resin: 1~3%

Although this method improves the toughness of polyamide to a certain extent, with the development of the outer packaging field, the requirements for the toughness of packaging materials are getting higher and higher, which makes it difficult for the toughness of the polyamide film improved by the predecessors to meet the requirements.

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