Polyamide film and preparation method thereof

Abstract

The invention provides a polyamide film. The polyamide film sequentially comprises a first surface layer, a first nylon layer, a core layer, a second nylon layer and a second surface layer. The firstsurface layer and the second surface layer are independently prepared from the following raw materials: 77 wt%-87 wt% of polyamide resin, 10 wt%-15 wt% of a nylon graft copolymer and 3 wt%-8 wt% of anylon master batch. The first nylon layer and the second nylon layer are independently prepared from the following raw materials: 55 wt%-78 wt% of polyamide resin, 12 wt%-25 wt% of a combined additiveand 10 wt%-20 wt% of amorphous nylon. The core layer comprises a polymer formed by in-situ copolymerization of nylon 6, nylon 66, adipic acid polyether amine salt and montmorillonite. According to the polyamide film, multi-layer compounding is adopted, each layer adopts polyamide resin as a matrix which is matched with other components, so the toughness of the film is improved, and the cold stamping performance of the film is further improved.

Description

technical field [0001] The invention belongs to the technical field of flexible packaging, and in particular relates to a polyamide film and a preparation method thereof. Background technique [0002] Due to its advantages of miniaturization, thinness, light weight and large capacity, soft-pack lithium-ion batteries are favored in the fields of new energy vehicles and 3C digital consumer electronics products. At present, soft-pack lithium-ion batteries use aluminum-plastic composite film as their outer packaging material, which is mainly composed of five layers: an outer polyamide layer, an adhesive, an intermediate layer of aluminum foil, an adhesive, and an inner heat-sealing layer. [0003] With the continuous development of the pharmaceutical industry, the traditional blister packaging method is difficult to ensure that the quality of the drug will not change during its service life due to the limited barrier properties of the PVC hard sheet. In response to this problem...

AI Technical Summary

Problems solved by technology

The existing method one is to thicken the polyamide layer, and the other is to improve the composition of the polyamide layer. Although the former method can meet the toughness requirements, it causes a waste of materials, so the latter method is usually used, such as patent CN103319883A describes a high-toughness polyamide, the mass percentage of the required proportioning substances is: polyamide: 60-70%, glass fiber: 20-40%, acrylate ultrafine particles: 2.00-5.00%, bisphenol A Epoxy resin: 1~3%

Although this method improves the toughness of polyamide to a certain extent, with the development of the outer packaging field, the requirements for the toughness of packaging materials are getting higher and higher, which makes it difficult for the toughness of the polyamide film improved by the predecessors to meet the requirements.

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