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Gas sensor chip structure based on calcium silicate substrate and preparation method thereof

A technology of gas sensor and chip structure, which is applied in the field of MEMS processing to achieve the effect of small thermal conductivity, small heat loss and high yield

Active Publication Date: 2020-09-22
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the above-mentioned defects in the prior art, the object of the present invention is to provide a gas sensor chip structure and preparation method based on a calcium silicate substrate. The present invention solves the incompatibility between low power consumption and low process complexity of the gas sensor chip. The problem is that the structure is simple, and the complexity of the manufacturing process is greatly reduced while maintaining the characteristics of low power consumption. There is no need to process the back of the substrate, which improves the yield, local high temperature, and the periphery is close to normal temperature, easy to package

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  • Gas sensor chip structure based on calcium silicate substrate and preparation method thereof
  • Gas sensor chip structure based on calcium silicate substrate and preparation method thereof
  • Gas sensor chip structure based on calcium silicate substrate and preparation method thereof

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Embodiment Construction

[0053] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, where the schematic embodiments and descriptions of the present invention are used to explain the present invention, but not to limit the present invention.

[0054] Such as figure 1 , shown in Fig. 2 (a), Fig. 2 (b), the present invention is based on the gas sensor chip structure of calcium silicate substrate, comprises calcium silicate substrate 1, test electrode 2, temperature measuring resistance 3, sensitive material 4, heating Wire 5, heating wire lead plate 6, temperature measuring resistance lead plate 7, test electrode lead plate 8; heating wire 5 and sensitive material 4 are respectively stacked in the center above calcium silicate substrate 1; test electrode 2 with a comb-like structure Set above the sensitive material 4, the temperature measuring resistor 3 is set on both sides of the heating wire 5 and the sensitive material 4; the...

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Abstract

The invention discloses a gas sensor chip structure based on a calcium silicate substrate and a preparation method thereof, a calcium silicate material is used as a substrate, a heating wire is sputtered on the substrate, the center of the heating wire coincides with the calcium silicate substrate to form a three-order hyperbolic spiral shape, and then a temperature measuring resistor, a sensitivematerial and a test electrode are sputtered on the calcium silicate substrate material in sequence. After the heating wire is powered on, calcium silicate has an extremely low heat conductivity coefficient, so that heat is greatly sputtered and dissipated in a heat conduction mode, and the gas sensitive material can be heated to a specified working temperature by using a smaller voltage. The structure is simple, the complexity of the manufacturing process is greatly reduced while the low-power-consumption characteristic is kept, the back face of the substrate does not need to be machined, theyield is increased, the local high temperature is achieved, the periphery is close to the normal temperature, and packaging is easy.

Description

technical field [0001] The invention relates to MEMS (Micro-Electro-Mechanic System) processing technology, in particular to a gas sensor chip structure with calcium silicate material as a base and a preparation method thereof. Background technique [0002] Generally, a single gas sensor has poor selectivity to different gases, so an arrayed gas sensor can be used in conjunction with an appropriate signal processing circuit to achieve the purpose of detecting certain gases, thereby improving the selectivity of the gas sensor. However, the increase in the number of gas sensors will lead to an increase in the power consumption of the entire detection system, which will greatly reduce its application range. Therefore, reducing the power consumption of gas sensors is an inevitable trend. [0003] At present, the gas sensor chip structure is based on silicon, because of its high thermal conductivity, the heat loss is large. The commonly used method to reduce power consumption i...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81B7/02G01N27/12
CPCB81C1/00015B81B7/02G01N27/12B81B2201/02
Inventor 王海容田鑫雷伟涛王久洪吴欣雨金成赵玉龙
Owner XI AN JIAOTONG UNIV