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Coating structure and preparation method thereof

A solution and silver layer technology, applied in the field of coating structure and its preparation, can solve the problems of high-frequency and high-speed transmission of signals, loss and other problems, and achieve the effects of cost reduction, low operating temperature, corrosion resistance and friction resistance.

Pending Publication Date: 2020-10-16
深圳市化讯半导体材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The present invention aims at depositing a layer of palladium on the nickel layer by means of deposition, and then depositing a layer of gold by means of replacement in the existing process nickel-palladium-gold. Due to the magnetism of the nickel layer, it will be damaged during high-frequency high-speed signal transmission. Cause loss and attenuation, resulting in the problem that the high-frequency and high-speed transmission of signals cannot be satisfied. The purpose of the present invention is to provide a coating structure and its preparation method

Method used

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  • Coating structure and preparation method thereof
  • Coating structure and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] The experimental substrate in this embodiment adopts copper-clad laminate, and the test samples are prepared according to the technological process in Table 1:

[0079] Table 1

[0080] serial number Process name temperature / ℃ time / min 1 degreasing 40 4 2 pure water wash room temperature 0.5 3 microetch 25 2 4 pure water wash room temperature 0.5 5 Prepreg 40 1 6 Preparation of silver layer 50 3 7 pure water wash room temperature 0.5 8 Preparation of palladium layer 52 10 9 pure water wash room temperature 0.5 10 Preparation of gold layer 80 8 11 pure water wash room temperature 0.5

[0081] The process of preparing the silver layer in process flow 6 of Table 1 is as follows: the copper-clad laminate obtained in process flow 5 is placed in a chemical silver solution to obtain a silver layer, the pH of the chemical silver solution is 8.5, and silver ammonia comp...

Embodiment 2

[0085] The experimental base material in this embodiment adopts copper-clad laminate, and the test sample is prepared according to the technological process in Table 2:

[0086] Table 2

[0087] serial number Process name temperature / ℃ time / min 1 degreasing 35 5 2 pure water wash room temperature 0.5 3 microetch 23 2 4 pure water wash room temperature 0.5 5 Prepreg 35 1 6 Preparation of silver layer 40 4 7 pure water wash room temperature 0.5 8 Preparation of palladium layer 40 15 9 pure water wash room temperature 0.5 10 Preparation of gold layer 70 8 11 pure water wash room temperature 0.5

[0088] Table 2 Process flow 6 The process of preparing the silver layer is as follows: the copper clad laminate obtained in process flow 5 is placed in the chemical silver solution to obtain the silver layer, the pH of the chemical silver solution is 9, and the silver sulfite in...

Embodiment 3

[0092] The experimental substrate in this embodiment adopts copper-clad laminate, and the test samples are prepared according to the process flow in Table 3:

[0093] table 3

[0094] serial number Process name temperature / ℃ time / min 1 degreasing 45 3 2 pure water wash room temperature 0.5 3 microetch 27 1 4 pure water wash room temperature 0.5 5 Prepreg 45 1 6 Preparation of silver layer 70 2 7 pure water wash room temperature 0.5 8 Preparation of palladium layer 70 4 9 pure water wash room temperature 0.5 10 Preparation of gold layer 80 20 11 pure water wash room temperature 0.5

[0095] Table 3 Process 6 The process of preparing the silver layer is as follows: the copper clad laminate obtained in process 5 is placed in the chemical silver solution to obtain the silver layer, the pH of the chemical silver solution is 8, and the silver sulfite in the chemical silver ...

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Abstract

The invention discloses a coating structure and a preparation method thereof. The coating structure comprises a silver layer, a palladium layer and a gold layer which are sequentially arranged on a conducting layer. The coating structure aims to solve the problems that a layer of palladium is deposited on a nickel layer in a deposition manner and then a layer of gold is deposited in a replacementmanner in the existing process, and due to the magnetism of the nickel layer, loss and attenuation are caused during high-frequency and high-speed signal transmission, so that the requirement of high-frequency and high-speed signal transmission cannot be met. The coating structure comprises the silver layer, the palladium layer and the gold layer, does not have magnetism, does not affect high-frequency and high-speed signal transmission, and can protect the conducting layer and provide good weldability, conductivity, corrosion resistance, friction resistance and the like; and the silver layerreplaces gold (precious metal), the cost is remarkably reduced, the palladium layer on the silver surface can effectively prevent the silver layer from being corroded, and the gold layer can play a role in wetting and corrosion resistance.

Description

technical field [0001] The invention belongs to the technical field of surface treatment, and in particular relates to a coating structure and a preparation method thereof. Background technique [0002] In the existing packaging process of electronic industrial parts, nickel palladium gold is widely used in industry as a traditional surface treatment method, which provides excellent gold wire bonding performance, wear resistance and corrosion resistance for the surface of the conductive layer. [0003] With the progress and development of science, mankind has entered the 5G era, which also marks the entry of high-frequency and high-speed packaging of electronic industrial components such as semiconductor packaging, IC substrates, aluminum substrates, ceramic substrates, and printed circuit boards. Nickel palladium gold as The traditional surface treatment process, because of the magnetism of the nickel layer, will cause loss and attenuation of the signal during high-frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/42C23C18/44C23C18/54
CPCC23C18/42C23C18/44C23C18/54C23C28/023
Inventor 刘彬灿黄明起夏建文
Owner 深圳市化讯半导体材料有限公司
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