Paste adhesive composition and semiconductor device

Abstract

The paste adhesive composition of the present invention contains silver particles and monomers, and the interface between the silver particles disappears due to heat treatment to form a silver particle connection structure. The above-mentioned silver particles include flaky silver particles and spherical silver particles, as follows Under the measurement conditions, the paste adhesive composition was heated from a temperature of 30°C to a temperature of 200°C at a temperature increase rate of 10°C / min, followed by heat treatment at a temperature of 200°C for 60 minutes, and then increased from a temperature of 10°C / min to When the temperature is raised from 200°C to 450°C, followed by heat treatment at 450°C for 10 minutes, the paste adhesive composition after heat treatment at 200°C for 60 minutes is compared to the pasty adhesive composition before the temperature rise. When 100 parts of the weight loss rate of the composition is W1 [%], and 100 parts of the weight loss rate of the paste adhesive composition after heat treatment at a temperature of 450° C. for 10 minutes is W2 [%], (W2-W1) / W2 is not less than 0.20 and not more than 0.90. As measurement conditions, the measurement method is a thermogravimetry (Thermogravimetry-Differetial Thermal Analysis: TG-DTA) apparatus, and the atmosphere is an air atmosphere.

Description

technical field [0001] The present invention relates to a paste adhesive composition and a semiconductor device. Background technique [0002] Paste adhesive compositions used for bonding various components of semiconductor devices and electric and electronic components have conventionally used two types of paste adhesive compositions, namely, an adhesive type and a sintered type. [0003] Adhesive paste adhesive composition is a composition in the form of dispersed conductive metal particles such as silver particles in a liquid thermosetting resin, and the resin is cured by heating to bond the metal particles to exhibit electrical conductivity and thermal conductivity. sex. [0004] In the adhesive paste adhesive composition, the adhesiveness and adhesiveness to the adherend are expressed by curing of the liquid thermosetting resin. In addition, since the paste-like adhesive composition shrinks by curing, the frequency of contact between metal particles becomes higher tha...

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Problems solved by technology

On the other hand, when a sintered paste adhesive composition is used as an adhesive, although a monomer remains between the metal particle connection structure formed by heating and the adherend, the monomer is a trace amount. , so sometimes the adhesion between the metal particle bonded structure and the adherend cannot be obtained sufficiently

Moreover, the adhesion between the adherend and the metal particle connection structure is affected by the type or combination of the metal material and the metal particles constituting the adherend, so the material of the adherend has poor compatibility with the metal particles. , there are cases where the adhesion between the adherend and the metal particle connection structure is weak and peeling occurs between them

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