Epoxy adhesive for bonding bridge segments
An epoxy adhesive and segment technology, which is applied in the directions of adhesive, epoxy resin, adhesive type, etc., can solve the problems of poor comprehensive performance and difficulty in meeting the requirements for the use of segment prefabricated sealants.
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Embodiment 1
[0042] A component
[0043] E51 epoxy resin: 34 parts, hydrogenated bisphenol A epoxy resin HE-2025 (Shanghai Complex New Materials Co., Ltd.): 41 parts, 1,2-cyclohexanediol diglycidyl ether: 14 parts, core-shell structure rubber toughener P52 (Germany Wacker): 14 parts, fumed silica: 7 parts, silicon powder: 82 parts, titanium dioxide: 10 parts, glass fiber (10 μm in diameter, 2 mm in length): 5 parts, silane coupling agent KH560 : 1 part, ultraviolet absorber UV328: 0.5 part, antioxidant 1010: 0.4 part, defoamer: 0.2 part.
[0044] B component
[0045] Contains phenolic modified HTDA: 12 parts, phenolic modified hexamethylenediamine: 12 parts, epoxy addition modified TAC: 12 parts, DMP-30: 0.2 parts, fumed silica: 10 parts, silica powder: 21 parts , light stabilizer TINUVIN 292: 0.5 parts, carbon black: 2 parts.
[0046] The above-mentioned components A and B were blended at a mass ratio of 3:1 to obtain an epoxy adhesive.
Embodiment 2
[0048] A component
[0049] Premix MX125 of bisphenol A epoxy resin and core-shell rubber toughening agent (Japan Bell Chemical Co., Ltd., core-shell toughening agent content 25%): 50 parts, hydrogenated bisphenol A epoxy resin EP4080E (Japan Eddie Branch ADEKA): 42 parts, 1,6-hexanediol diglycidyl ether: 10 parts, fumed silica: 8 parts, silicon micropowder: 82 parts, titanium dioxide: 10 parts, carbon fiber (8 μm in diameter, 1.5 in length mm): 5 parts, silane coupling agent 2-(3,4-epoxycyclohexyl) ethyltriethoxysilane (Nanjing Nengde New Materials): 1 part, ultraviolet absorber UV328: 0.5 parts, Antioxidant 1010: 0.4 parts, defoamer: 0.2 parts.
[0050] B component
[0051] Contains phenolic modified HTDA: 12 parts, phenolic modified hexamethylenediamine: 7.2 parts, epoxy addition modified TAC: 16.8 parts, DMP-30: 0.2 parts, fumed silica: 10 parts, silicon micropowder: 21 parts , light stabilizer TINUVIN 770: 0.5 parts, carbon black: 2 parts.
[0052] The above-mentioned...
Embodiment 3
[0054] A component
[0055] E51 epoxy resin: 15 parts, premixed MX154 of bisphenol A epoxy resin and core-shell rubber toughening agent (Nippon Kaneka Co., Ltd., core-shell toughening agent content 40%): 35 parts, hydrogenated bisphenol A Epoxy resin HE-2025 (Shanghai Complex New Materials Co., Ltd.): 40 parts, 1,2-cyclohexanediol diglycidyl ether: 12 parts, fumed silica: 7 parts, silicon powder: 80 parts, titanium dioxide : 12 parts, carbon fiber, basalt fiber (10 μm in diameter, 1 mm in length): 6 parts, silane coupling agent KH560: 1 part, ultraviolet absorber UV329: 0.5 part, antioxidant 1076: 0.4 part, defoamer: 0.2 parts.
[0056] B component
[0057] Contains phenolic modified HTDA: 12 parts, phenolic modified hexamethylenediamine: 7.2 parts, cyanoethylated modified TAC: 16.8 parts, methylimidazole: 0.2 parts, fumed silica: 10 parts, silicon micropowder: 21 parts , light stabilizer TINUVIN 123: 0.5 parts, carbon black: 2 parts.
[0058] The above components A and B ...
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