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Integrated method for hydrophobic modification of copper surface

A hydrophobic modification and copper surface technology, which is applied to surface polishing machine tools, machine tools suitable for grinding the edge of workpieces, metal processing equipment, etc., can solve the problem of difficult quantitative control of friction, so as to improve utilization rate and avoid environmental pollution. Pollution, the effect of simple preparation process

Active Publication Date: 2020-11-03
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is not easy to quantitatively control the friction generated between the abrasive and the metal substrate. Therefore, how to construct the microstructure of the copper-based surface by mechanical grinding and thereby construct a hydrophobic surface is a technical problem.

Method used

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  • Integrated method for hydrophobic modification of copper surface
  • Integrated method for hydrophobic modification of copper surface
  • Integrated method for hydrophobic modification of copper surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A kind of binary low surface energy material of hydrophobic film on copper surface, by 0.10g silicon dioxide (SiO 2 ), 10 mL of dodecyltrimethoxysilane (DTMS).

[0048] Take the bare copper sheet of the same specification and soak it in the mixed solution of 0.10g of silicon dioxide and 10mL of dodecyltrimethoxysilane (DTMS) as the control group.

[0049] Such as figure 1 As shown, it is a schematic diagram of assembling the experimental device. The experimental device includes a centrifuge tube 1 containing a solution 2 and a copper electrode sheet 3. The copper sheet is polished by a rotary grinding device. Each centrifuge tube There is a copper plate inside.

[0050] Using the above-mentioned rotary grinding experimental device, the hydrophobic modification method of copper surface is as follows:

[0051] (1) Rinse the surface of the copper substrate twice with ethanol and deionized water respectively with the pure copper electrode sheet, so that there is no resid...

Embodiment 2

[0057] A kind of binary low surface energy material of hydrophobic film on copper surface, by 0.10g silicon dioxide (SiO 2 ), 10 mL of dodecyltrimethoxysilane (DTMS).

[0058] Take the bare copper sheet of the same specification and soak it in the mixed solution of 0.10g of silicon dioxide and 10mL of dodecyltrimethoxysilane (DTMS) as the control group.

[0059] Such as figure 1 As shown, it is a schematic diagram of assembling the experimental device. The experimental device includes a centrifuge tube 1 containing a solution 2 and a copper electrode sheet 3. The copper sheet is polished by a rotary grinding device. Each centrifuge tube There is a copper plate inside.

[0060] Using the above-mentioned rotary grinding experimental device, the hydrophobic modification method of copper surface is as follows:

[0061] (1) Rinse the surface of the copper substrate twice with ethanol and deionized water respectively with the pure copper electrode sheet, so that there is no resid...

Embodiment 3

[0067] A kind of binary low surface energy material of hydrophobic film on copper surface, by 0.10g silicon dioxide (SiO 2 ), 10 mL of dodecyltrimethoxysilane (DTMS).

[0068] Take the bare copper sheet of the same specification and soak it in the mixed solution of 0.10g of silicon dioxide and 10mL of dodecyltrimethoxysilane (DTMS) as the control group.

[0069] Such as figure 1 As shown, it is a schematic diagram of assembling the experimental device. The experimental device includes a centrifuge tube 1 containing a solution 2 and a copper electrode sheet 3. The copper sheet is polished by a rotary grinding device. Each centrifuge tube There is a copper plate inside.

[0070] Using the above-mentioned rotary grinding experimental device, the hydrophobic modification method of copper surface is as follows:

[0071] (1) Rinse the surface of the copper substrate twice with ethanol and deionized water respectively with the pure copper electrode sheet, so that there is no resid...

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Abstract

The invention discloses an integrated method for hydrophobic modification of a copper surface. The integrated method comprises the following steps of cleaning a copper sheet; placing a copper sheet ina low-surface-energy solution to be soaked, and then conducting drying; and conducting grinding, specifically, only rotary grinding needs to be carried out through a rotary grinding device, and adopted grinding materials comprise one or more of carborundum, quartz sand and walnut shells. According to the integrated method, a microstructure is constructed on the metal surface through friction between a copper metal matrix and the grinding materials in the rotary grinding device, and the microstructure is the basis of hydrophobic modification of the copper metal surface. A binary composite solution prepared in a manner that a silicon dioxide solution and a dodecyl trimethoxy silane solution or a stearic acid ethanol solution are introduced into the microstructure of the metal surface achieves the condition that a hydrophobic film is generated on the copper surface by a disposable mechanical rotation method for the first time. An electrochemical experiment is carried out in simulated seawater, a result shows that the method has good protection capability on pure copper metal, the optimal corrosion inhibition rate is 99.8%, and copper and alloys of the copper in the seawater can be effectively protected.

Description

technical field [0001] The invention belongs to the technical field of hydrophobic modification of copper surfaces, and in particular relates to an integrated method for hydrophobic modification of copper surfaces. Background technique [0002] Hydrophobic surfaces have outstanding application advantages in the field of metal corrosion protection because of their unique wettability. Reducing the surface energy of the substrate and regulating the surface microstructure are the two most important aspects of the hydrophobic modification of the metal surface. However, at this stage, people often choose fluorine-containing low surface energy substances. As we all know, fluorine-containing substances are not only expensive, but also cause great pollution to the ecological environment, which does not conform to the concept of green chemistry; Spinning methods, etc., but these methods are complicated to operate and cannot be applied to the hydrophobic modification of copper metal ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B31/02B24B31/12
CPCB24B31/02B24B31/12
Inventor 张大全吴盼盼高立新沈昊祎
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER