Flexible TFT device and preparation method thereof

A device and flexible technology, applied in the field of flexible TFT devices and its preparation, can solve the problems of low carrier mobility, achieve low leakage, reduce film cracks, and improve mechanical flexibility
CN111900252APending Publication Date: 2020-11-06GUANGDONG INST OF SEMICON IND TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG INST OF SEMICON IND TECH
Publication Date
2020-11-06

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a flexible TFT device and a preparation method thereof. The flexible TFT device sequentially comprises a flexible substrate, a PI adhesion layer, a gate electrode, a dielectriclayer, a PalphaMS modification layer, a semiconductor layer, an interface modification layer and a source and drain electrode layer, wherein the gate electrode contains PEDOT: PSS, the dielectric layer contains a PDMS-HfO2 hybrid material, and the semiconductor layer contains a lanthanum indium zinc oxide-polytetravinylphenol hybrid material. By adopting the organic and inorganic hybrid system material and the TFT device structure, the problems of film layer cracks, displacement and the like caused by bending of the device are reduced, so that the bending resistance and the stability of the flexible TFT device are improved, and the service life of the flexible TFT device is prolonged.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to the technical field of flexible display, in particular to a flexible TFT device and a preparation method thereof. Background technique

[0002] With the development of new display technologies, flexible displays have attracted widespread attention due to their advantages of thinness, convenience, low manufacturing cost, and bendability. However, in the current technology, component preparation materials and device structures are the key factors that limit the development of flexibility. Therefore, in order to realize a new generation of flexible electronic devices, we must first find new materials with high electrical properties that can cope with mechanical flexibility; secondly, based on these materials to prepare basic unit devices such as diodes and transistors; Device combinatorial integrated logic circuits. In the TFT unit of electronic components, using cheap and large-area thin film deposition technology instead of hig...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More