37results about How to "Simplify the patterning process" patented technology

An optoelectronic display comprising a plurality of pixels, each pixel comprising a plurality of sub-pixels, wherein the optoelectronic display comprises a colour-forming layer which is patterned providing a plurality of discrete colour-forming regions in a two-dimensional array, and wherein an addressing array is provided for addressing the discrete colour-forming regions, at least some of the discrete colour-forming regions having portions which are separately addressable by the addressing array, each portion defining a sub-pixel of the optoelectronic display.

A method for performing a liftoff operation involves printing a liftoff pattern using low-resolution patterning techniques to form fine feature patterns. The resulting feature size is defined by the spacing between printed patterns rather than the printed pattern size. By controlling the cross-sectional profile of the printed liftoff pattern, mask structures may be formed from the liftoff operation having beneficial etch-mask aperture profiles. For example, a multi-layer printed liftoff pattern can be used to create converging aperture profiles in a patterned layer. The patterned layer can then be used as an etch mask, where the converging aperture profiles result in desirable diverging etched features.

A method of fabricating a semiconductor using a fin field effect transistor (FINFET) is disclosed. In a particular embodiment, a method includes depositing, on a silicon substrate, a first dummy structure having a first sidewall and a second sidewall separated by a first width. The method also includes depositing, on the silicon substrate, a second dummy structure concurrently with depositing the first dummy structure. The second dummy structure has a third sidewall and a fourth sidewall that are separated by a second width. The second width is substantially greater than the first width. The first dummy structure is used to form a first pair of fins separated by approximately the first width. The second dummy structure is used to form a second pair of fins separated by approximately the second width.

A method of producing an electron emission device having a low threshold electric field needed to emit electrons without unintentional electron emission includes a first step of preparing a first conductive film, second conductive film, and a material which constitutes an electron emission part connected to the first conductive film, and a second step of setting a threshold electric field strength, which is needed to start electron emission in a situation where a higher electric potential is applied to the first conductive film than that applied to the second conductive film, to a value greater than a threshold electric field strength, which is needed to start electron emission in a situation where a higher electric potential is applied to the second conductive film than that applied to the first conductive film.

A method for forming a pattern includes forming a resist pattern on a printing roll, printing a multi-stepped resist pattern on an etching object layer formed on a substrate by using the printing roll and etching the etching object layer by using the printed resist pattern as a mask.

A method of manufacturing a thin film transistor is capable of enhancing pattern precision of an organic semiconductor layer and simplifying a patterning process. The method includes forming an organic insulating film on a substrate and forming a bank having the first and second concave portions and a third concave portion in the organic insulating film, the third concave portion being formed on the first and second concave portions. The method further includes forming a source electrode and a drain electrode in the first and second concave portions and forming an active layer in the third concave portion, the active layer contacting the source electrode and the drain electrode.

A method of manufacturing a thin film transistor is capable of enhancing pattern precision of an organic semiconductor layer and simplifying a patterning process. The method includes forming an organic insulating film on a substrate and forming a bank having the first and second concave portions and a third concave portion in the organic insulating film, the third concave portion being formed on the first and second concave portions. The method further includes forming a source electrode and a drain electrode in the first and second concave portions and forming an active layer in the third concave portion, the active layer contacting the source electrode and the drain electrode.

This invention relates to a film transistor with a copper lead structure and its manufacturing mehod, which utilizes at least one copper alloy layer and a copper layer to form a grid with multiple metal structures to improve atom arrangement among lattice interfaces and keyed jointing among atoms and reduce resistance values to suppress diffusion of Cu ions after heat process to get better electric conductance of film transistors, besides, when figuring the multiple metal thin layers, it' s only necessary to use single layer of Cu etching liquor to simplify the figuring technology.

An AC light emitting device, in which a plurality of light emitting cells formed on a substrate are flip-bonded to a submount to be driven under an AC power source is disclosed. The light emitting device comprises a first serial array of light emitting cells, and a second serial array of light emitting cells, wherein the second serial array is connected in reverse parallel to the first serial array. Meanwhile, bonding patterns are formed on a submount substrate, and the light emitting cells of the first and second serial arrays are flip-bonded to the bonding patterns. Further, node connecting patterns are formed on the submount substrate, and connect the bonding patterns such that nodes corresponding to each other provided in the first and second serial arrays are electrically connected to each other. Accordingly, it is possible to provide an AC light emitting device which can prevent overvoltage from being applied to light emitting cells in the array to which reverse voltage is applied by bonding patterns and node connecting patterns formed on a submount substrate, thereby protecting the light emitting cells.

A method and apparatus of fabricating a thin film transistor is disclosed, which patterns an ohmic contact layer by a laser patterning process so that it is capable of preventing a semiconductor layer from being damaged, and reducing fabrication time, wherein the method comprises forming a gate electrode pattern on a substrate; forming a gate insulating layer on the gate electrode pattern; sequentially forming a semiconductor layer pattern and an ohmic contact layer pattern on the gate insulating layer; forming source and drain electrode patterns on the ohmic contact layer pattern, wherein the source and drain electrode patterns are provided at a fixed interval therebetween; and removing the ohmic contact layer pattern exposed between the source and drain electrode patterns through the use of laser.

A display device includes a light-emitting diode including a first conductivity-type semiconductor, an active layer, and a second conductivity-type semiconductor; a first voltage line to which a first voltage is applied; a second voltage line to which a second voltage is applied; a first transistor including a source electrode electrically connected to the first voltage line and a drain electrode electrically connected to a first electrode of the light-emitting diode and to the first conductivity-type semiconductor; a second transistor including a drain electrode electrically connected to a gate electrode of the first transistor and a source electrode electrically connected to a data line to apply a data signal; a capacitor electrically connected to the gate electrode of the first transistor and the first electrode; and a third transistor including a source electrode electrically connected to the second voltage line and a drain electrode electrically connected to the first electrode.

An exemplary embodiment of the present invention relates to roll imprint that simplifies a substrate patterning process by simultaneously performing a process for imprinting a pattern to a coating layer and a process for curing the pattern.

A roll imprinting apparatus according to an exemplary embodiment of the present invention performs an imprinting process on a transferred substrate. The roll imprinting apparatus includes: a pattern roll imprinting a pattern formed in the surface thereof to the substrate while rotating; and a press roll pressing the substrate while rotating in the opposite side of the pattern roll, interposing the substrate therebetween, and the pattern roll includes a cylinder and a UV lamp. The cylinder is formed of a transparent material and has an inner space formed thereinside and the pattern provided in the external surface thereof, and has a ultraviolet (UV) ray block layer selectively formed in the patterned portion or a portion

A method of manufacturing a transparent pattern printed steel plate includes forming a printed paint film layer by jetting transparent ink onto at least one surface of a steel plate, and curing the printed paint film layer with ultraviolet light to form a cured printed paint film layer. Further, a method of manufacturing a transparent pattern printed steel plate includes preparing a steel plate having a color painted film layer formed on at least one surface thereof, forming a printed paint film layer by jetting transparent ink onto the color painted film layer, and curing the printed paint film layer to form a cured printed paint film layer.

A method for fabricating a hole pattern in a semiconductor device includes forming a first organic layer over an etch layer, forming a first inorganic layer pattern over the first organic layer, etching the first organic layer using the first inorganic layer pattern as an etching barrier, forming a second organic layer over the first organic layer, forming a second inorganic layer pattern over the second organic layer, where the second inorganic layer pattern crosses the first inorganic pattern, etching the first and second organic layers using the second inorganic layer pattern as an etching barrier, and etching the etch layer using the etched first and second organic layers as an etch barrier to form a hole pattern.

Provided is an organic electro-luminescence display device. The organic electro-luminescence display device includes: a first electrode, a first charge transport pattern, an organic emission pattern, a second charge transport pattern, and a second electrode. The first charge transport pattern is formed on the first electrode, and the organic emission pattern is on the first charge transport pattern. The second charge transport pattern is formed on the organic emission pattern, and includes an insoluble material. The second electrode is formed on the second charge transport pattern.

The invention discloses a method for manufacturing an interconnection structure containing air gaps. The method includes: forming a first sacrificial layer on a substrate; forming a metal interconnection line in the first sacrificial layer; depositing and etching a second sacrificial layer to form a narrow-end-up peak structure which is connected with a sacrificial medium of the first sacrificial layer; depositing a first medium layer and removing the first medium layer of the upper surface of the second sacrificial layer so as to form a releasing opening at the top of the peak structure; removing sacrificial media of the first sacrificial layer and the second sacrifical layer; and depositing a second medium layer to form the air gaps. By the method, sealing integrity of the air gaps can be guaranteed and the interconnection structure has a larger process window.

The embodiment of the invention provides a wireless communication structure, a display panel and wireless communication equipment, and the wireless communication structure comprises a loop structure which comprises a first connection end, a second connection end and a coil body, and at least part of the coil body is connected between the first connection end and the second connection end; and the antenna is connected to the coil body. According to the embodiment of the invention, the antenna is connected to the coil body of the loop structure, so that the loop structure and the antenna can be arranged in a limited space, the optical performance of a display screen can be better ensured, the preparation efficiency of the wireless communication structure can be improved, and the preparation cost can be reduced.

A method for patterning a surface of a substrate includes applying a liquid on the surface of the substrate, wherein an apparent viscosity of the liquid depends on a field strength applied to the liquid; applying a field to the liquid, wherein a field strength of the applied field is spatially varied in the liquid in a direction parallel to the surface of the substrate, thereby generating a spatially varied apparent viscosity distribution in the liquid in response to the applied field; and patterning the surface of the substrate by subjecting the surface to a surface modifying process, while maintaining the field and using portions of the liquid having apparent viscosities higher than a predetermined value as a mask; wherein the surface modifying process comprises removing material of the surface of the substrate and/or depositing material on the surface of the substrate.