A kind of method of mildew-proof modification of soybean-based adhesive
An adhesive and modified technology, applied in the direction of adhesives, adhesive types, protein adhesives, etc., can solve the problems of affecting storage period and use effect, poor emulsion stability, attenuation of anti-mold effect, etc., and achieve long-term anti-mold effect Stable, strong loss resistance, long storage period effect
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Embodiment 1
[0024] (1) Take 100g of ionized water, 1g of alkaline lignin, 0.5g of 2,2'-dihydroxy-5,5'-dichlorodiphenylmethane, 1g of formaldehyde, 0.1g of phenol, and Methyl ammonium bromide 0.5g; Make the lignin microspheres of load antifungal agent by above-mentioned technique;
[0025] (2) Dissolve 30g of soybean powder in 68g of water, add 2g of alkali for treatment, and obtain soybean gel emulsion;
[0026] (3) Add 30g of epoxy resin and 5g of curing agent to the bean glue emulsion, and stir evenly;
[0027] (4) Add 10 g of lignin microspheres loaded with antifungal agent prepared in step (1) to obtain a modified bean gum emulsion.
Embodiment 2
[0029] (1) Take 100g of ionized water, 2.5g of alkaline lignin, 0.5g of 2,2'-dihydroxy-5,5'-dichlorodiphenylmethane, 1.5g of formaldehyde, 2.5g of phenol, hexadecane Trimethyl ammonium bromide 2.5g; Obtain the lignin microsphere of load antifungal agent by above-mentioned technique;
[0030] (2) Dissolve 10g of soybean powder in 89.5g of water, add 0.5g of alkali for treatment, and obtain soybean gel emulsion;
[0031] (3) Add 10g of epoxy resin and 0.5g of curing agent to the bean glue emulsion, and stir evenly;
[0032] (4) Add 5 g of antifungal-loaded lignin microspheres prepared in step (1) to obtain a modified bean gum emulsion.
Embodiment 3
[0034] (1) Take 100g of ionized water, 5g of alkaline lignin, 5g of 2,2'-dihydroxy-5,5'-dichlorodiphenylmethane, 3g of formaldehyde, 5g of phenol, cetyltrimethyl Ammonium bromide 5g; Obtain the lignin microsphere of load antifungal agent by above-mentioned technique;
[0035] (2) Dissolve 15g of soybean flour in 84.5g of water, add 1g of alkali for treatment, and obtain soybean gel emulsion;
[0036] (3) Add 20g of epoxy resin and 2.5g of curing agent to the bean glue emulsion, and stir evenly;
[0037] (4) Add 1 g of antifungal agent-loaded lignin microspheres prepared in step (1) to obtain a modified bean gum emulsion.
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