Packaging structure of a silicon carbide Vienna rectifier half-bridge module
A packaging structure and silicon carbide technology, which is applied in the direction of output power conversion devices, structural parts of conversion equipment, electric solid devices, etc., can solve the problem of high-frequency applications that limit the switching speed of power modules, large peak voltages of switching tube chips, and limitations Converter operating frequency and other issues to achieve the effect of reducing coupling, reducing common source inductance, and reducing influence
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[0031] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. It is worth noting that the words indicating orientation or positional relationship, such as "upper", "lower", "left", "right", "middle", etc., are all based on the orientation or positional relationship shown in the drawings, and are only for description present invention, rather than limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0032] To achieve the above object, an embodiment of the present inventio...
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