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Alkenyl-group-containing compound, curable resin composition, and cured object obtained therefrom

A curable resin and compound technology, applied in the direction of organic chemistry, can solve the problems of satisfactory performance, insufficient electrical characteristics, poor reactivity, etc., and achieve the effects of excellent curability, excellent heat resistance, and high reactivity

Active Publication Date: 2020-11-10
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, SiC semiconductors are beginning to be used in trains, air conditioners, etc., and since sealing materials for semiconductor elements are required to have extremely high heat resistance, conventional epoxy resin sealing materials cannot meet this requirement.
[0006] However, in Patent Document 1, a phenolic resin substituted with all acrylic groups is used, so the electrical characteristics are insufficient
In addition, in Patent Document 2, a phenolic resin substituted with allyl groups is used, so the reactivity is poor, and it is difficult to say that the performance is satisfactory from the viewpoint of heat resistance. Properties of materials, curing systems

Method used

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  • Alkenyl-group-containing compound, curable resin composition, and cured object obtained therefrom
  • Alkenyl-group-containing compound, curable resin composition, and cured object obtained therefrom
  • Alkenyl-group-containing compound, curable resin composition, and cured object obtained therefrom

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preparation example Construction

[0087] The production method of the curable resin composition of the present invention can be implemented according to known methods, but is not limited thereto. For example, each component may be merely mixed uniformly, or a prepolymer may be formed. Specifically, by reacting the alkenyl-containing compound represented by the above formula (1) and maleimide in the presence or absence of a catalyst, in the presence or absence of a solvent, The resin is heated to form a prepolymer. Similarly, epoxy resins, amine compounds, maleimide compounds, cyanate compounds, phenolic resins, etc. Resin, anhydride compound and other additives form a prepolymer. For mixing of the components or formation of a prepolymer, for example, an extruder, a kneader, a roll, etc. are used in the absence of a solvent, and a reaction tank with a stirring device, etc. are used in the presence of a solvent.

[0088] The curable resin composition of the present invention is obtained, for example, by unifo...

Embodiment 1

[0104] Add 15.0 mass parts of cyanuric chloride, 40.8 mass parts of toluene, 4.1 mass parts of dimethylformamide, 32.9 mass parts of 2-allylphenol, 67.6 Parts by mass of potassium carbonate was used to raise the internal temperature to 100°C. Carry out reaction at 100 ℃ for 6 hours, carry out natural cooling, then add 200 mass parts of toluene, wash with water, and concentrate under reduced pressure, thus obtained 37.9 mass parts (yield 98%) represented by the following formula (4): The etherification reaction product of cyanuric chloride and 2-allylphenol (AP-CC). The resulting reaction product had a melting point of 110°C.

[0105]

Embodiment 2

[0107] Add 18.4 parts by mass of cyanuric chloride, 50 parts by mass of toluene, 5.0 parts by mass of dimethylformamide, 40.3 parts by mass of 2-(1-propenyl) in a flask equipped with a thermometer, condenser, and stirrer Phenol and 82.9 parts by mass of potassium carbonate were used to raise the internal temperature to 100°C. Carry out reaction at 100 DEG C for 6 hours, carry out natural cooling, then add 200 mass parts of toluene, wash with water, and concentrate under reduced pressure, thus obtained 39.2 mass parts (yield 82%) by the following formula (5) The etherification reaction product of cyanuric chloride and 2-(1-propenyl)phenol (PP-CC).

[0108] The resulting reaction product had a melting point of 131°C.

[0109]

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Abstract

An alkenyl-group-containing compound represented by formula (1). (In formula (1), X represents any organic group; Y represents an alkenyl group, and when more than one Y is present, then the Y's may be the same or different; Z represents a hydrogen atom, a C1-15 hydrocarbon group, or a C1-15 alkoxy group, and when more than one Z is present, the Z's may be the same or different; l is a natural number of 1 to 6; and m and n are each an integer of 0 or larger and satisfy that m+n = 1 to 5, at least one of the l m's being 1 or larger.).

Description

technical field [0001] The present invention relates to an alkenyl group-containing compound, a curable resin composition, and a cured product thereof, which are suitable for use in sealing materials for semiconductor elements, sealing materials for liquid crystal display elements, sealing materials for organic electroluminescent (EL) elements, printed circuit boards, Composite materials for electrical and electronic components such as laminated laminates, lightweight and high-strength structural materials such as carbon fiber reinforced plastics and glass fiber reinforced plastics. Background technique [0002] In recent years, due to the expansion of the field of application of laminated boards on which electric and electronic components are mounted, the required characteristics have become wider and higher. Conventional semiconductor chips are generally mounted on metal lead frames, but semiconductor chips with high processing capabilities such as central processing units...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F212/00C07C43/205C07C43/215C07D251/34C08F234/00
CPCC07C43/215C07D251/34C08F234/00C07C43/205C08F212/00C08F222/40C08F212/22C08L35/04C08G59/4042
Inventor 远岛隆行中西政隆长谷川笃彦松浦一贵
Owner NIPPON KAYAKU CO LTD