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Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same

A resin composition, prepreg technology, applied in metal layered products, printed circuits, printed circuit parts, etc., can solve the problems affecting the water absorption rate of the final cured product, achieve excellent heat resistance, improve crosslinking density, low The effect of water absorption

Active Publication Date: 2020-11-20
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, these compounds all contain hydroxyl groups, which will affect the water absorption and other properties of the final cured product.

Method used

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  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same
  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same
  • Resin composition, and prepreg, insulating film, metal foil-clad laminate and printed circuit board having same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0101] Synthesis Example 1: Synthesis of Dicyclopentadienyl Active Ester Compound

[0102] Take dicyclopentadienol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly, at the temperature of 60°C, feed nitrogen at the same time, add tetrabutylammonium bromide catalyst, and then slowly drop in the concentration of 20% aqueous sodium hydroxide solution, reacted for 4 hours, then added p-aminophenol, continued the reaction for 2 hours, after the reaction was completed and washed several times, dried for 5 hours under vacuum at 105°C to obtain the dicyclopentadiene The base active ester compound is denoted as active ester A.

Synthetic example 2

[0103] Synthesis Example 2: Synthesis of Tricyclopentadienyl Active Ester Compound

[0104] Take tricyclopentadienol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly. 20% sodium hydroxide aqueous solution, reacted for 4 hours, then added p-aminophenol, continued to react for 2 hours, and after the reaction was completed, after several washings, dried for 5 hours under vacuum at 105°C to obtain the tricyclic Pentadienyl active ester compound, denoted as active ester B.

Synthetic example 3

[0105] Synthesis example 3: Synthesis of naphthyl active ester compound

[0106] Take naphthol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly, under the temperature condition of 60°C, feed nitrogen gas at the same time, add tetrabutylammonium bromide catalyst, and then slowly drop hydrogen with a concentration of 20% Sodium oxide aqueous solution was reacted for 4 hours, then p-aminophenol was added, and the reaction was continued for 2 hours. After the reaction was completed, after several washings, it was dried for 5 hours under vacuum at 105°C to obtain the naphthyl active ester compound. For the active ester C.

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PUM

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Abstract

The invention provides a resin composition, which has high glass transition temperature, high peel strength, low coarsening degree, low dielectric loss, high heat resistance, low water absorption andgood dielectric property compared with the existing resin composition. The invention also provides a prepreg, an insulating film, a metal foil-clad laminated board and a printed circuit board which are prepared by using the resin composition.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition with high adhesion, low roughness, high heat resistance, low water absorption and good dielectric properties and a prepreg, insulating film, Metal clad laminates, and printed circuit boards. Background technique [0002] In recent years, the focus of the printed circuit board market has shifted from computers to communications, especially mobile terminals such as smartphones and tablet computers. Therefore, HDI boards for mobile terminals are the main point of PCB growth. Mobile terminals represented by smartphones drive HDI boards to be denser and thinner. According to literature reports, in the future, the line width / spacing L / S (Line and Space) of PCB boards will be required to reach 10 / 10 μm or less. Therefore, the Ra value (average roughness) of the laminated insulating layer needs to reach 300nm Or less, the cohesiveness reaches above 0.6kgf...

Claims

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Application Information

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IPC IPC(8): C08G59/56C08J5/24C08L63/00B32B17/04B32B15/14B32B7/12B32B15/20B32B17/06B32B33/00H05K1/03
CPCC08G59/56C08G59/5033C08J5/24B32B5/02B32B15/14B32B7/12B32B15/20B32B17/061H05K1/0353B32B2262/101B32B2260/021B32B2260/046B32B2307/306B32B2457/08B32B2307/204C08J2363/00
Inventor 崔春梅何继亮戴善凯陈诚肖升高
Owner SHENGYI TECH SUZHOU