Plate-type integrated coating method and equipment for passivating contact solar cell
A technology for solar cells and coating equipment, applied in circuits, electrical components, semiconductor devices, etc., can solve problems such as affecting the quality of TOPCon cells, lack of stable and reliable silicon targets, and difficulty in manufacturing phosphorus-doped silicon targets, so as to improve the production yield. , the effect of reducing turnover and reducing maintenance costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] refer to figure 1 , the plate-type integrated coating equipment of passivation contact solar cell provided by the present invention, it comprises the PECVD process chamber and the PVD process chamber that are integrally arranged continuously; A heating chamber is also arranged at the inlet end of the PECVD process chamber, and the inlet end of the heating chamber It is docked to the loading chamber, and the inlet end of the loading chamber is connected to the automatic feeding mechanism; an unloading chamber is also provided at the outlet end of the PVD process chamber, and the outlet end of the unloading chamber is connected to the cut-off automatic feeding mechanism. A carrier plate return system is set between the material mechanism; a vacuum isolation cavity is also set between the PECVD process chamber and the PVD process cavity, and the residual gas is evacuated by a molecular pump, and the silicon oxide coating process and the doped non- The crystalline silicon c...
Embodiment 2
[0034] The difference between this embodiment 2 and embodiment 1 is that in this embodiment 2, by replacing the phosphorous-doped silicon target in embodiment 1 with boron-doped silicon target, and replacing phosphine with borane, the silicon The surface of the chip realizes the coating process of the boron-doped amorphous silicon layer.
Embodiment 3
[0036] Based on the above-mentioned embodiment 1 and referring to figure 2, wherein, in step S3, the PVD process chamber includes a plurality of intervals and continuous chambers, and the targets in the plurality of continuous chambers are all rotary pure silicon column targets or phosphorus-doped silicon targets with the same or different concentrations material, the process gas is respectively introduced between the column targets, and Ar and phosphine in multiple consecutive chambers have the same or different flow ratios, so as to produce amorphous silicon films with different phosphorus doping concentrations; wherein, based on multiple When a rotating pure silicon column target or a phosphorus-doped silicon target of the same concentration is used in a continuous chamber, and Ar and phosphine have the same flow ratio, multi-layer films with the same doping concentration are obtained by continuous sputtering coating; Alternatively, based on the use of a rotating pure sili...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

