Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of preparation method of ultraviolet curable solder resist ink and its product and application

A technology of solder resist ink and ultraviolet light, applied in the field of ink, can solve the problems of short curing time, insufficient curing, and decreased gloss of ink, and achieve the effect of shortening production cycle, improving curing adequacy, and good printing adaptability

Active Publication Date: 2021-02-19
佛山市鑫正化工有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the curing time of the ink is short and the ink layer is thin, which will also cause poor hardness and serious scratches.
In addition, it is also easy to cause insufficient curing, resulting in a decrease in gloss

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of ultraviolet curable solder resist ink and its product and application
  • A kind of preparation method of ultraviolet curable solder resist ink and its product and application

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0019] In order to solve the above-mentioned technical problems, the first aspect of the present invention provides a preparation method of ultraviolet curing solder resist ink, comprising the following steps: by weight, 40~45 parts of modified epoxy resin, 3~5 parts of UV curing Add monomer, 2~5 parts of photoinitiator, 30~40 parts of filler, 1~3 parts of toner, and 1~2 parts of auxiliary agent into the mixer, stir evenly, grind, disperse, filter, and fill.

[0020] In a preferred embodiment, the preparation method of the UV-curable solder resist ink comprises the following steps: by weight, 40-45 parts of modified epoxy resin, 3-5 parts of UV-curable monomer, Add 2~5 parts of photoinitiator, 30~40 parts of filler, 1~3 parts of toner, and 1~2 parts of additives into the mixer and stir evenly. Control the temperature not to exceed 25°C, then grind and disperse, and inspect the solder mask The fineness of the ink is below 10μm, then filtered and filled.

[0021] In a more pref...

Embodiment 1

[0077] Embodiment 1 of the present invention provides an ultraviolet curable solder resist ink, and its preparation method comprises the following steps: by weight, 40 parts of modified epoxy resin, 3 parts of UV curing monomer, 2 parts of photoinitiator, 30 parts Add 1 part of filler, 1 part of toner, and 1 part of additive into the mixer and stir evenly, control the temperature not to exceed 25°C, then grind and disperse, check that the fineness of the solder resist ink is below 10 μm, then filter and fill to obtain .

[0078] The raw materials for preparing the modified epoxy resin include novolac epoxy resin, acrylic acid, catalyst and polymerization inhibitor.

[0079] The molar ratio of the epoxy novolac resin to acrylic acid is 1:1; the epoxy novolac resin is purchased from Tiantai High-Tech (Guangzhou) Co., Ltd. F51.

[0080] The catalyst is triphenylphosphine; the polymerization inhibitor is p-hydroxyanisole.

[0081] The preparation process of the modified epoxy resi...

Embodiment 2

[0088] Embodiment 2 of the present invention provides a kind of ultraviolet curing solder resist ink, and its preparation method comprises the following steps: by weight, 45 parts of modified epoxy resins, 5 parts of UV curing monomers, 5 parts of photoinitiators, 40 parts Add one part of filler, three parts of toner, and two parts of additives into the mixer and stir evenly, control the temperature not to exceed 25°C, then grind and disperse, check that the fineness of the solder resist ink is below 10 μm, then filter and fill to obtain .

[0089] The raw materials for preparing the modified epoxy resin include novolac epoxy resin, acrylic acid, catalyst and polymerization inhibitor.

[0090] The molar ratio of the epoxy novolac resin to acrylic acid is 1:1; the epoxy novolac resin is purchased from Tiantai High-Tech (Guangzhou) Co., Ltd. F51.

[0091] The catalyst is triphenylphosphine; the polymerization inhibitor is p-hydroxyanisole.

[0092] The preparation process of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
viscosityaaaaaaaaaa
epoxy equivalentaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of inks, and more specifically, the invention provides a preparation method of ultraviolet curing solder resist ink, its products and applications. The first aspect of the present invention provides a preparation method of ultraviolet curing solder resist ink, comprising the following steps: by weight, 40~45 parts of modified epoxy resin, 3~5 parts of UV curing monomer, 2~5 parts of light Initiator, 30~40 parts of filler, 1~3 parts of toner, 1~2 parts of additives are added to the mixer, stirred evenly, ground, dispersed, filtered, and filled. The interaction between the various components improves the curing and drying speed of the ink and the curing adequacy, good gloss, bright colors, and increases the aesthetics of the appearance. At the same time, it has good hardness and solder thermal shock resistance. In the process of circuit board production, it can be used Reduce ink foaming and scratches, good printing adaptability.

Description

technical field [0001] The invention relates to the technical field of inks, and more specifically, the invention provides a preparation method of ultraviolet curing solder resist ink, its products and applications. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. Solder resist ink is the main material used in the production of PCB circuit boards. Its function is to permanently protect the lines on the circuit boards, prevent line oxidation, insulation resistance, high temperature resistance and solder resistance, and protect lines from open or short circuits caused by careless scratches, etc. question. [0003] The new national standard will be introduced in 2...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/107H05K1/02
CPCC09D11/101C09D11/107H05K1/02
Inventor 李标曹志滨沙望波李尧伍军保李发甲杨敬智
Owner 佛山市鑫正化工有限公司