Neutral tin additive and preparation method and application thereof

A tin additive and neutral technology, applied in the field of neutral tin additive and its preparation, can solve the problems of large pollution and strong acidity of the plating solution, etc.

Inactive Publication Date: 2020-12-18
南通麦特隆新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The plating solution used in the traditional pickling and tin plating process is a sulfuric acid system, which has simple components and low cost, but at the same time, the plating solution is highly acidic and pollutes heavily, so it is gradually replaced by the plating solution of methanesulfonic acid system
[0003] At present, there are few tin plating additives suitable for methanesulfonic acid system, and most of them have the characteristics of strong acidity; and acidic additives will have certain dangers in production, transportation and use, so a neutral Tin plating additives are of great significance, which can not only reduce the danger and pollution caused by acidity, but also produce excellent electroplating effects

Method used

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  • Neutral tin additive and preparation method and application thereof
  • Neutral tin additive and preparation method and application thereof
  • Neutral tin additive and preparation method and application thereof

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preparation example Construction

[0063] The second aspect of the present invention provides the preparation method of the neutral tin additive, comprising the following steps: adding a buffering agent into water, mixing evenly, adding a wetting agent and a dispersant, and continuing to mix evenly; then adding a complexing agent, stirring Uniform; finally add pH regulator, stir evenly, that is.

[0064] The third aspect of the present invention provides the application of the neutral tin additive in the field of electroplating.

[0065] The fourth aspect of the present invention provides a kind of tin plating liquid, and its preparation raw material comprises: tin methanesulfonate 200-500g / L, above-mentioned neutral tin additive, solvent is water; Described tin methanesulfonate and neutral tin The volume ratio of the tin additive is 1:(5-15).

[0066] The fifth aspect of the present invention provides a method for preparing the above-mentioned tin plating solution, comprising the following steps: adding neutr...

Embodiment 1

[0071] Embodiment 1 provides a kind of neutral tin additive, comprises the following components by weight percentage: wetting agent 0.06%, dispersant 0.10%, complexing agent 28.0%, pH adjusting agent 12.2%, buffering agent 2.6%, water Make up the balance.

[0072] The wetting agent is dodecyl dimethyl benzyl ammonium chloride; the dispersant is zwitterionic n-propionate sodium salt, purchased from Shenzhen Xinaoyuan Technology Co., Ltd.; the complexing agent is methyl The combination of sulfonic acid and sodium gluconate has a weight ratio of 1:1; the pH regulator is sodium hydroxide; and the buffer is boric acid.

[0073] The preparation method of the neutral tin additive comprises the following steps: adding a buffering agent into water, mixing evenly, adding a wetting agent and a dispersant, and continuing to mix evenly; then adding a complexing agent, stirring evenly; finally adding a pH regulator, stirring Evenly, that is.

Embodiment 2

[0075] Embodiment 2 provides a kind of neutral tin additive, comprises the following components by weight percentage: wetting agent 0.01%, dispersant 0.02%, complexing agent 20%, pH adjusting agent 10%, buffering agent 1%, water Make up the balance.

[0076] The wetting agent is dodecyl dimethyl benzyl ammonium chloride; the dispersant is zwitterionic n-propionate sodium salt, purchased from Shenzhen Xinaoyuan Technology Co., Ltd.; the complexing agent is methyl The combination of sulfonic acid and sodium gluconate has a weight ratio of 1:1; the pH regulator is sodium hydroxide; and the buffer is boric acid.

[0077] The preparation method of the neutral tin additive comprises the following steps: adding a buffering agent into water, mixing evenly, adding a wetting agent and a dispersant, and continuing to mix evenly; then adding a complexing agent, stirring evenly; finally adding a pH regulator, stirring Evenly, that is.

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Abstract

The invention relates to the field of electroplating, and particularly relates to a neutral tin additive and a preparation method and application thereof. The neutral tin additive at least comprises the following components of, by weight, 0.01-0.3% of a wetting agent, 0.02-0.5% of a dispersing agent, 20-35% of a complexing agent, 10-15% of a pH regulator, 1-5% of a buffering agent and the balancewater. According to the neutral tin additive and the preparation method and application thereof, through the synergistic effect of all the components, the transparency and stability of electroplatingliquid are improved; the electroplating effect is good, the performance of a tin plating solution is stable, the service time is long, a plating layer is uniform and high in finish degree, the surfacefinish degree of the plating layer is good, the plating layer is uniform, and the bonding strength is high; the tin plating solution is high in stability, not prone to turbidity and long in service time, sediments are fine, the weldability and the smoothness are good, the stability of the electroplating liquid is good, the uniformity of a plating film is good, color changing is avoided during high-temperature backflow, and the electroplating liquid in a high-temperature area does not corrode the plating layer; and the neutral tin additive is suitable for all fields, especially resistors, array type chip modules and the like.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a neutral tin additive and its preparation method and application. Background technique [0002] Tin plating and its alloys are coatings with good solderability and certain corrosion resistance, and are widely used in electronic components, printed circuit boards and other fields. At present, the tin plating process includes acid tin plating and alkaline tin plating. Among them, acid tin plating has a higher application range because of its lower power consumption and higher plating efficiency. The plating solution used in the traditional pickling and tin plating process is a sulfuric acid system, which has simple components and low cost, but at the same time, the plating solution is highly acidic and polluted, and is gradually replaced by a methanesulfonic acid system plating solution. [0003] At present, there are few tin plating additives suitable for methanesulfonic acid syste...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/32
CPCC25D3/32
Inventor 王承国陆建辉袁军华
Owner 南通麦特隆新材料科技有限公司
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