Efficient boiling heat transfer copper material and preparation method thereof

Abstract

The invention discloses an efficient boiling heat transfer copper material and a preparation method thereof. The surface of the efficient boiling heat transfer copper material is coated with a porouscopper film; the porous copper film comprises a plurality of copper nanocones; and irregular open micro-cavities distributed among the plurality of copper nanocones communicate with one another to form a porous micro-cavity structure. The preparation method comprises the following steps of: assembling a base material serving as a working electrode, a counter electrode and a weakly alkaline coppersalt electrolyte to form an electrochemical working system, applying a reduction current between the working electrode and the counter electrode, and forming a porous copper film on the surface of thebase material through an electrodeposition reaction. The efficient boiling heat transfer copper material disclosed by the invention has the advantages of higher heat exchange area, far more nucleation sites, more excellent boiling heat transfer performance, a higher boiling heat transfer coefficient, higher critical heat flux density, lower superheat degree of nucleate boiling onset, a simple andconvenient preparation process, easiness in reaction regulation and control and low cost; and the efficient boiling heat transfer copper material is suitable for industrial scale application.

Description

technical field [0001] The invention relates to a structure and a method for enhancing surface heat transfer, in particular to a high-efficiency boiling heat transfer micro-nano porous copper material and a preparation method thereof. Background technique [0002] With the development of miniaturization, integration, and high power of electronic devices, a severe test is put forward for high heat flow heat dissipation. Using existing or developing new micro-nano processing technology to develop micro-nano copper materials with better boiling heat transfer performance has become the focus of current research. In 2008, the team of Professor Peterson of the University of Colorado in the United States used the grazing angle deposition technology to in-situ grow copper nanorod arrays on the surface of copper and confirmed that it has efficient boiling heat transfer performance (Small, 2008, 4, 1084-1088). The surface of copper nanorods prepared by this method has countless micro...

AI Technical Summary

Problems solved by technology

Although this improved processing technology can achieve in-situ growth of copper wires and has excellent boiling heat transfer performance, there are inevitable problems in this processing method: large-area processing cannot be realized due to the limitation of the template, and the processing cost increases with the template area. increase sharply; mechanical tight fit can easily lead to template fragmentation, resulting in uncontrollable processing quality of nanowires; the formed nanowires will randomly form clusters under capillary action, although the microcavities formed by such clusters are beneficial nucleation, but its formation process is uncontrollable

Therefore, how to develop highly efficient boiling heat transfer micro-nano copper materials with real commercial value and its processing technology still face great challenges.

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