Polycarbonate/polyester alloy as well as preparation method and application thereof

Abstract

The invention relates to a polycarbonate / polyester alloy as well as a preparation method and application thereof. The alloy is prepared from the following raw materials in percentage by mass: 60%-85%of bisphenol A polycarbonate, 12%-35% of polyester resin with the refractive index of 1.5+ / -0.1 and the glass-transition temperature of from 60 DEG C to 100 DEG C, 1%-5% of a compatilizer, 0.1%-5% ofan ester exchange inhibitor and 0.1%-3% of a light diffusion agent with the refractive index of 1.35-1.49, wherein the polyester resin is selected from PET resin and / or PETG resin. Due to the existence of a low-Tg polyester chain, the thermal deformation temperature of the alloy is reduced by 15-45 DEG C, and the alloy is beneficial to processing and is not easy to warp; by adding a transesterification inhibitor and the compatilizer, the alloy inherits the transparency of bisphenol A type PC and keeps high light transmittance; and by adding a light diffusion agent, the haze of the alloy can beimproved.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polycarbonate / polyester alloy and its preparation method and application. Background technique [0002] LED (Light Emitting Diode) is a light-emitting diode. LED light sources are favored because of low energy consumption, low heat, environmental protection, and long life. They will replace traditional incandescent lamps and energy-saving lamps and become the fourth-generation lighting source. At the same time, due to its excellent performance, it also has potential application value in many other aspects, including signal indication, green display, special lighting and so on. [0003] However, there are still many areas to be improved in existing LEDs. For example, one of the most fatal shortcomings of LEDs is its point light source characteristics. Specifically, compared with traditional light sources, LED chips emit concentrated and intense light, which will lead to uneven ...

AI Technical Summary

Problems solved by technology

Occurs in three stages: before the gate is solidified, the plastic cooling process stage and the free shrinkage of the product after demolding. At present, the warping deformation can be reduced by increasing the mold temperature and rapidly changing the mold temperature (see patent CN208375920U). But doing so will increase the cost

It can be seen that it is difficult to make bisphenol A-based PC take into account the advantages of high light transmittance, high haze, low cost and low warpage

[0013] At present, the LED light diffusion plate adopts the method of combining volume diffusion and surface diffusion, that is, the dual method of light diffusion particles and surface microstructure is used to achieve the purpose of high light transmittance and high haze, and the surface microstructure is mostly complex. Geometric three-dimensional structures, such as pyramids, microlenses, etc. At the same time, the light diffusion plate is developing towards thinner and thinner, which is more likely to cause warping and deformation of the part. The molding technology requires higher and higher requirements. The thermal deformation of the material is reduced by polyester alloy temperature is necessary

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