Inverted pyramid auxiliary texturing additive and its application
An inverted pyramid, additive technology, applied in sustainable manufacturing/processing, final product manufacturing, post-processing details, etc., can solve problems such as severe cutting line marks and affecting copper catalytic ability.
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Embodiment 1
[0023] (1) Prepare an inverted pyramid auxiliary texturing additive, and configure 1% of silver ions, 6% of sodium citrate, 8% of ethylenediaminetetraacetic acid, and 10% of fluosilicic acid to 75% of In deionized water, the inverted pyramid auxiliary texturing additive is prepared after mixing evenly; the silver ion is silver nitrate;
[0024] (2) adding the inverted pyramid auxiliary texturing additive into the acidic texturing liquid, and after mixing evenly, the inverted pyramid texturing liquid is obtained; the volume ratio of the inverted pyramid auxiliary texturing additive to the acidic texturing liquid is 0.006: 1000. The acidic texturing solution contains copper ions with a concentration of 0.1 mmol / L, fluoride ions with a concentration of 10 mol / L and an oxidant with a concentration of 0.1 mol / L, and can oxidize silicon in the silicon wafer to silicon oxide and copper ions. Oxidized to copper ions.
[0025] (3) Texturing the surface of the silicon wafer with the i...
Embodiment 2
[0027] (1) Prepare an inverted pyramid auxiliary texturing additive, and configure 2% of silver ions, 10% of sodium citrate, 1% of ethylenediaminetetraacetic acid, and 6% of fluosilicic acid to 81% of In deionized water, the inverted pyramid auxiliary texturing additive is prepared after mixing evenly; the silver ion is silver fluoride;
[0028] (2) adding the inverted pyramid auxiliary texturing additive into the acidic texturing liquid, and after mixing, the inverted pyramid texturing liquid is obtained; the volume ratio of the inverted pyramid auxiliary texturing additive and the acidic texturing liquid is 0.01: 1000. The acidic texturing solution contains copper ions with a concentration of 100.0 mmol / L, fluoride ions with a concentration of 5 mol / L and an oxidant with a concentration of 3 mol / L, and can oxidize silicon in the silicon wafer to silicon oxide and oxidize copper. for copper ions.
[0029] (3) Texturing the surface of the silicon wafer with the inverted pyra...
Embodiment 3
[0031] (1) Prepare an inverted pyramid auxiliary texturing additive, and configure 3% of silver ions, 5% of sodium citrate, 10% of ethylenediaminetetraacetic acid, and 3% of fluosilicic acid to 79% by mass. In deionized water, the inverted pyramid auxiliary texturing additive is prepared after mixing evenly; the silver ion is silver sulfate;
[0032] (2) adding the inverted pyramid auxiliary texturing additive into the acidic texturing liquid, and after mixing evenly, the inverted pyramid texturing liquid is obtained; the volume ratio of the inverted pyramid auxiliary texturing additive to the acidic texturing liquid is 0.06: 1000. The acidic texturing solution contains copper ions with a concentration of 200.0 mmol / L, fluoride ions with a concentration of 0.5 mol / L and an oxidant with a concentration of 5 mol / L, and can oxidize silicon in the silicon wafer to silicon oxide and copper ions. Oxidized to copper ions.
[0033] (3) Texturing the surface of the silicon wafer with...
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