Supercharge Your Innovation With Domain-Expert AI Agents!

Low thermal conductivity coefficient organosilicon foam material and preparation method thereof

A technology of silicone foam and low thermal conductivity, applied in the field of silicone foam materials, can solve the problems of inability to block heat, low heat insulation efficiency, and inability to effectively shield radiated electromagnetic waves, etc., and achieve high-efficiency foam insulation, good mechanical properties, The effect of reducing thermal conductivity

Inactive Publication Date: 2021-02-05
ZHUZHOU TIMES NEW MATERIALS TECH
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hollow microspheres in it can only isolate heat conduction, and cannot effectively shield the radiated electromagnetic waves generated by the heat source, and cannot prevent heat from being transmitted to the interior of the material through radiation, and the heat insulation efficiency is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Low thermal conductivity coefficient organosilicon foam material and preparation method thereof
  • Low thermal conductivity coefficient organosilicon foam material and preparation method thereof
  • Low thermal conductivity coefficient organosilicon foam material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0044] Above-mentioned organosilicon foam material, its preparation method comprises the following steps:

[0045] (1) Prepare components A and B, and mix components A and B evenly;

[0046] (2) Mix components A and B evenly, put them into the cavity of the mold, and then heat up and foam through a certain program to form the required low thermal conductivity silicone foam material. Preferably, the temperature programming is specifically: the foaming temperature is 50°C-60°C, the foaming time is 10min-30min, the heat treatment temperature is 150°C-160°C, and the heat treatment time is 2h-3h.

Embodiment 1

[0049] The low thermal conductivity silicone foam material of this embodiment includes A component and B component, wherein, A component is mainly prepared from the following raw materials by weight: viscosity is 50Pa.s, vinyl mass fraction is 0.2% Vinyl silicone oil 60g, viscosity 1000mPa.s, vinyl mass fraction 4% vinyl silicone oil 15g, ethylene glycol 5g, modified hollow glass microspheres 15g, chloroplatinic acid 0.2g, 1-alkynyl cyclohexanol 0.02g; Component B is mainly prepared from the following raw materials in parts by weight: 60g of vinyl silicone oil with a viscosity of 50Pa.s and a vinyl mass fraction of 0.2%, 25g of hydrogen-containing silicone oil with a hydrogen content of 0.75%, modified hollow Glass beads 15g.

[0050] The preparation method of the low thermal conductivity silicone foam material of the present embodiment comprises the following steps:

[0051](1) Add tourmaline with a particle size of 150 μm to 20-30 μm hollow glass microspheres of the same qu...

Embodiment 2

[0057] The low thermal conductivity silicone foam material of this embodiment includes A component and B component, wherein, A component is mainly prepared from the following raw materials by weight: viscosity is 10Pa.s, vinyl mass fraction is 0.5% Vinyl silicone oil 65g, viscosity 1500mPa.s, vinyl mass fraction 3% vinyl silicone oil 15g, ethylene glycol 8g, modified hollow ceramic microspheres 12g, chloroplatinic acid 0.2g, 1-alkynyl cyclohexanol 0.02 g; Component B is mainly prepared from the following raw materials in parts by weight: 65g of vinyl silicone oil with a viscosity of 10Pa.s and a vinyl mass fraction of 0.5%, 25g of hydrogen-containing silicone oil with a hydrogen content of 0.75%, modified hollow ceramics microbeads.

[0058] The preparation method of the low thermal conductivity silicone foam material of the present embodiment comprises the following steps:

[0059] (1) Add tourmaline with a particle size of 150 μm to 20-30 μm hollow ceramic microspheres of t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
viscosityaaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a low thermal conductivity coefficient organosilicon foam material and a preparation method thereof. The low thermal conductivity coefficient organosilicon foam material is composed of a component A and a component B. The component A comprises the following raw materials by weight: 70-90 parts of vinyl silicone oil, 0.1-10 parts of a foaming aid, 5-20 parts of modified hollow microspheres, 0.1-1 part of a catalyst and 0.01-0.05 part of an inhibitor. The component B comprises the following raw materials by weight: 60-90 parts of vinyl silicone oil, 10-30 parts ofhydrogencontaining silicone oil and10-20 parts of modified hollow microspheres. The problems that a large amount of filler needs to be added for organosilicon foam heat insulation, and the heat insulation efficiency is low are solved. The prepared organosilicon foam is low in thermal conductivity coefficient, the thermal conductivity coefficient is smaller than 0.02 W / (m*K), the mechanical property is good, the tensile strength is larger than 280 kPa, and the elongation at break is larger than 90%.

Description

technical field [0001] The invention belongs to the technical field of silicone foam materials, and in particular relates to a low thermal conductivity silicone foam material and a preparation method thereof. Background technique [0002] Silicone material is a polymer material with silicon-oxygen bonds as the main body and organic groups as side chains. It has excellent high and low temperature resistance, aging resistance, ozone resistance, electrical insulation and chemical reaction resistance. In addition to the excellent properties of silicone materials, silicone foam materials also have light weight, high elasticity, and good shock and noise reduction performance. It is widely used in aerospace, rail transit, electronic and electrical components, various sealing materials and other fields. [0003] In some professional application fields, such as rail transit and aerospace fields that require high-efficiency heat insulation, higher requirements are put forward for the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K9/02C08K3/38C08K7/28C08K7/24C08J9/00
CPCC08J9/0023C08J9/009C08J9/0095C08J2383/07C08J2483/05C08K9/02C08K3/38C08K7/28C08K7/24
Inventor 颜渊巍秦伟陈彰斌陈琪胡钊熊昌义朱伟高玮
Owner ZHUZHOU TIMES NEW MATERIALS TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com