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A kind of preparation method of damping cloth polishing pad

A polishing pad and damping cloth technology, which can be used in cleaning methods using liquids, chemical instruments and methods, cleaning methods and utensils, etc. The effect of wear resistance and acid and alkali resistance, excellent insulation performance, good mechanical properties

Active Publication Date: 2021-10-22
德阳展源新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing polishing pads are applied on optical glass or sapphire. Due to the limitation of the material of the polishing pad itself, most of the polishing pads will be worn during use, and the conventional bonding method cannot firmly fix the damping cloth and epoxy resin. Plates often separate during use, resulting in insufficient hardness of the hard plate during the polishing stage, which increases the pressure demand of the polishing machine and affects the polishing efficiency
[0004] For example, the invention provides an adsorption pad for sapphire polishing and its preparation method (application number: CN201510357286.3), which provides an adsorption pad for sapphire polishing. The adsorption pad includes a damping cloth layer, Hot-melt adhesive layer and epoxy resin plate layer; the thickness of the damping cloth layer is 0.2-0.4mm, the thickness of the hot-melt adhesive layer is 0.05-0.15mm, and the thickness of the epoxy resin plate layer is 0.15-2.0mm; and the heat Both the melt adhesive layer and the epoxy resin plate layer are provided with a plurality of through holes matching the size of the sapphire substrate to be polished. The invention also provides a method for preparing the adsorption pad, which includes pre-lamination, punching and opening, heating Pressing, cooling and cutting steps; although the damping cloth layer, hot melt adhesive layer and epoxy resin plate layer are set, the thickness of each layer is limited at the same time, and multiple through holes are set to extend the service life of the adsorption pad , and can polish sapphires of different specifications; however, due to the hot-melt adhesive and epoxy resin plate bonded to the damping cloth, when the friction force is too large during the use stage, it is easy to cause the separation of the epoxy resin plate and the damping cloth, resulting in The device is damaged; at the same time, although the production method is provided, due to the certain defects of the commercially available damping cloth itself, the surface of the material cannot be polished well during the grinding stage, resulting in insufficient grinding material

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A preparation method of a damping cloth polishing pad, comprising the following steps:

[0030] S1 Mix the polyurethane premix, adhesive curing agent and silver particles at 93°C, and fully stir to obtain a mixed cured product;

[0031] S2 Pour the obtained mixed cured product into a mold, and control the temperature to gradually decrease from 80°C to 40°C to obtain a gelled cured product;

[0032] S3 After bonding the adhesive surface of the obtained gelled cured product to an epoxy resin plate, after turning over one side, and then extruding through an extrusion die, the extrusion pressure is 4kPa and the extrusion temperature is controlled at 65°C to obtain a rough polishing pad;

[0033] S4 Cut the rough polishing pad horizontally, control the thickness of the gel solidified layer to 0.7mm, and the thickness of the damping cloth layer to 1.3mm, to obtain a thin-layer polishing pad;

[0034] S5 washes the obtained thin-layer polishing pad with acid and alkali, dries...

Embodiment 2

[0043] Change the mixing temperature in step S1 to 90°C, and change the extrusion temperature in S3 to 60°C, change the thickness of the gel solidified layer in S4 to 0.6mm, and the thickness of the damping cloth layer to 1.2mm, and the silver particle The average particle diameter is 15 μm, and all the other formulations and steps are the same as in Example 1.

Embodiment 3

[0045] Change the mixing temperature in step S1 to 95°C, and change the extrusion temperature in S3 to 70°C, change the thickness of the gel solidified layer in S4 to 0.8mm, and the thickness of the damping cloth layer to 1.5mm. The average particle size is 20 μm, and all the other formulations and steps are the same as in Example 1.

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PUM

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Abstract

The invention discloses a preparation method of a damping cloth polishing pad, which comprises the following steps: S1 mixing a polyurethane premix, an adhesive curing agent and silver particles to obtain a mixed cured product; S2 controlling the temperature to gradually decrease from 80°C to 40°C , to obtain a gelled cured product; S3 gelled cured product bonding surface bonding epoxy resin plate, extruded through an extrusion die, to obtain a rough polishing pad; S4 transverse cutting, to obtain a thin-layer polishing pad; S5 acid-base Rinse to obtain a damping cloth polishing pad; S6 color sorting and classification, shearing and packaging storage; the beneficial effects of the present invention are: using polyurethane premix, bonding curing agent and silver particles as raw materials, and simultaneously through step-by-step temperature control, and then Through extrusion, and finally through transverse cutting, acid and alkali washing, grinding and color sorting, a fully wear-resistant and stable bonding damping cloth polishing pad can be obtained.

Description

technical field [0001] The invention relates to the field of preparation of a damping cloth polishing pad, in particular to a preparation method of a damping cloth polishing pad. Background technique [0002] The polishing pad is a polyurethane polishing material with a large number of micropores on the surface, so it is also called polyurethane damping cloth. Polyurethane provides excellent softness, elasticity and wear resistance. The micropores are a good storage place for polishing fluid, so the damping cloth has a very good polishing effect and is usually used in fields that require very high polishing quality, such as optical crystals, Optical glass, sapphire, MPO optical fiber connector, semiconductor silicon wafer, metallographic analysis and other fields. [0003] However, the existing polishing pads are applied on optical glass or sapphire. Due to the limitation of the material of the polishing pad itself, most of the polishing pads will be worn during use, and th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B29C43/00B29C43/18B08B3/02B08B3/08C08L83/06C08L5/04C08L23/08C08K3/08
CPCB08B3/02B08B3/08B24D11/001B29C43/003B29C43/18B29C2043/186C08K2003/0806C08L83/06C08L2205/03C08L5/04C08L23/0853C08K3/08
Inventor 向定艾
Owner 德阳展源新材料科技有限公司