Metal-cladded laminate plate, and circuit board

A laminated board and metal-clad technology, applied in the direction of circuit substrate materials, metal layered products, printed circuits, etc.

Active Publication Date: 2021-03-09
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although liquid crystal polymers have excellent dielectric properties, there is room for improvement in heat resistance and adhesi

Method used

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  • Metal-cladded laminate plate, and circuit board
  • Metal-cladded laminate plate, and circuit board
  • Metal-cladded laminate plate, and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0158] Examples are shown below, and the features of the present invention will be described more specifically. However, the scope of the present invention is not limited to the examples. In addition, in the following examples, unless otherwise specified, various measurements and evaluations used the following.

[0159] [Measurement of viscosity]

[0160] Viscosity was measured using an E-type viscometer (manufactured by Brookfield, trade name: DV-II+Pro), and the viscosity at 25° C. was measured. The rotational speed was set so that the torque became 10% to 90%, and after 2 minutes had elapsed from the start of the measurement, the value when the viscosity was stable was read.

[0161] [Measurement of Glass Transition Temperature (Tg)]

[0162] Regarding the glass transition temperature, using a dynamic viscoelasticity measuring device (DMA: manufactured by UBM Corporation, trade name: E4000F), from 30°C to 400°C, the temperature increase rate is 4°C / min, and the frequency...

Synthetic example 1

[0187] 312 g of DMAc was placed in a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen gas. 14.67 g of DAPE (0.073 moles) was stirred in the vessel and dissolved in the reaction vessel. Next, 23.13 g of BTDA (0.072 moles) were added. Thereafter, stirring was continued for 3 hours to prepare a resin solution a of polyamic acid having a solution viscosity of 2,960 mPa·s.

[0188] Next, on one side (Rz: 2.1 μm) of an electrolytic copper foil with a thickness of 12 μm, the polyamic acid resin solution a is uniformly applied so that the thickness after curing becomes about 25 μm, and then removed by heating and drying at 120° C. solvent. Furthermore, stepwise heat treatment is performed from 120° C. to 360° C. within 30 minutes to complete imidization. The copper foil was etched and removed using an aqueous ferric chloride solution to prepare a polyimide film a (thermoplastic, Tg: 283° C., CTE: 53 ppm / K, moisture absorption rate: 1.30% ...

Synthetic example 2

[0190] 312 g of DMAc was placed in a reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen gas. 6.60 g of spherical fillers (silicon dioxide, average particle size: 1.2 μm, manufactured by ADMATECHS, “SE4050”) were added to the reaction vessel, and dispersed for 3 hours by an ultrasonic disperser. 14.67 g of DAPE (0.073 moles) was stirred in a vessel and dissolved in the solution. Next, 23.13 g of BTDA (0.072 moles) were added. Thereafter, stirring was continued for 3 hours to prepare a polyamic acid resin solution b (silica content: 10% by volume) having a solution viscosity of 3,160 mPa·s.

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Abstract

A metal-cladded laminate plate which comprises a resin laminate comprising multiple polyimide layers and a metal layer laminated on at least one surface of the resin laminate, wherein the resin laminate satisfies the following requirements: (i) the whole thickness is 40 to 200 [mu]m; (ii) the resin laminate includes a first polyimide layer that comes in contact with the metal layer and a second polyimide layer that is laminated on the first polyimide layer directly or indirectly; (iii) the ratio of the thickness of the second polyimide layer to the whole thickness of the resin laminate is 70 to 97%; and (iv) an E1 value, which is a measure indicating a dielectric property and is calculated in accordance with the equation: E1 = tick mark Epsilon1*TanEpsilon1 [wherein Epsilon1 represents a dielectric constant at 10 GHz as measured with a split-post dielectric resonator (SPDR); and Tan Epsilon 1 represents a dielectric loss tangent at 10 GHz as measured with a split-post dielectric resonator (SPDR)], is less than 0.009.

Description

technical field [0001] The present invention relates to a metal-clad laminate and a circuit board capable of responding to high-frequency increases accompanied by downsizing and high-performance electronic equipment. Background technique [0002] In recent years, with the advancement of miniaturization, weight reduction, and space saving of electronic equipment, flexible circuit boards (flexible printed circuit boards) that are thin, lightweight, flexible, and have excellent durability even after repeated bending (FlexiblePrinted Circuits, FPC)) needs to increase. Regarding FPC, even in a limited space, three-dimensional and high-density installation can be realized, so for example, in electronic devices such as hard disk drives (Hard Disk Drive, HDD), digital video discs (Digital VideoDisk, DVD), mobile phones, smart phones, etc. Its use is gradually expanding in parts such as wiring, cables, and connectors. [0003] In information processing or information communication,...

Claims

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Application Information

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IPC IPC(8): B32B15/088B32B15/08C08G73/10H05K1/03H05K3/38
CPCB32B15/08B32B15/088H05K3/38H05K1/03C08G73/10B32B27/281C08G73/1042C08G73/1075H05K1/0346
Inventor 须藤芳树铃木智之安达康弘
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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