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Semiconductor chip bonding wax cleaning agent as well as preparation method and use method thereof

A semiconductor and cleaning agent technology, which is applied in the manufacture of semiconductor/solid-state devices, the preparation of detergent mixture compositions, chemical instruments and methods, etc., can solve the problems of incomplete cleaning of bonding wax, complex process, and large safety hazards. Achieve the effect of improving cleaning efficiency and thoroughness, simple process, and preventing sticking back

Pending Publication Date: 2021-03-12
DALIAN SANDAAOKE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problems of incomplete cleaning of the bonding wax on the special structure of the semiconductor chip, complicated process and great safety hazards. There are shortcomings and deficiencies in the technology

Method used

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  • Semiconductor chip bonding wax cleaning agent as well as preparation method and use method thereof
  • Semiconductor chip bonding wax cleaning agent as well as preparation method and use method thereof
  • Semiconductor chip bonding wax cleaning agent as well as preparation method and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A kind of semiconductor chip bonding wax cleaning agent, raw material is as shown in table 1:

[0039] Table 1 A semiconductor chip bonding wax cleaning agent component table

[0040]

[0041] The preparation method step of semiconductor chip bonding wax cleaning agent is as follows:

[0042] (1) The cleaning agent is produced in a thousand-level ultra-clean production workshop (open the air purification system, the particle size content is less than 1000 per cubic foot, and the dust particles of 0.5um are less than 1000), and the materials used are above 95%. The ambient temperature is 24-26°C, and the humidity is 40%-60%.

[0043] (2) After the reaction kettle used in production is fully rinsed with pure water and air-dried, the reactor is rinsed twice with ethylene glycol tert-butyl ether, and air-dried for later use (completed before production).

[0044] (3) Add alcohol ether solvent (ethylene glycol tert-butyl ether) in the reaction kettle, then add the abiet...

Embodiment 2

[0049] A kind of semiconductor chip bonding wax cleaning agent, raw material is as shown in table 2:

[0050] Table 2 A semiconductor chip bonding wax cleaning agent component list

[0051]

[0052]

[0053] The preparation method step of semiconductor chip bonding wax cleaning agent is as follows:

[0054] (1) The cleaning agent is produced in a thousand-level ultra-clean production workshop (open the air purification system, the particle size content is less than 1,000 dust particles of 0.5um per cubic foot), and the materials used are above 98%. The ambient temperature is 24-26°C, and the humidity is 40%-60%.

[0055] (2) After the reaction kettle used in production is fully rinsed with pure water and air-dried, the reactor is rinsed with tripropylene glycol methyl ether twice, and air-dried for later use (completed before production).

[0056] (3) Tripropylene glycol methyl ether is added in the reactor, and then the cleaning synergist (Span and Tween composition) of...

Embodiment 3

[0061] A kind of semiconductor chip bonding wax cleaning agent, raw material is as shown in table 3:

[0062] Table 3 A semiconductor chip bonding wax cleaning agent component table

[0063]

[0064] The preparation method step of semiconductor chip bonding wax cleaning agent is as follows:

[0065] (1) The cleaning agent is produced in a thousand-level ultra-clean production workshop (open the air purification system, the particle size content is less than 1000 per cubic foot, and the dust particles of 0.5um are less than 1000), and the materials used are above 90%. The ambient temperature is 24-26°C, and the humidity is 40%-60%.

[0066] (2) After the reaction kettle used in production is fully rinsed with pure water and air-dried, the reactor is rinsed twice with ethylene glycol tert-butyl ether, and air-dried for later use (completed before production).

[0067] (3) In the reactor, first add the calculated amount of tripropylene glycol methyl ether, then add the calcu...

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PUM

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Abstract

The invention belongs to the field of semiconductor chip manufacturing, and discloses a semiconductor chip bonding wax cleaning agent and preparation and use methods thereof. The solvent comprises thefollowing components in percentage by mass: 0-30% of a hydrocarbon solvent; the balance of alcohol ether solvent; 0.5-5% of a cleaning synergist; and 0.05-0.5% of an odor adjusting agent. The invention aims to provide a semiconductor chip bonding wax cleaning agent as well as a preparation method and a use method thereof in order to overcome the defects that bonding wax on a special structure ofa semiconductor chip is not thoroughly cleaned, the process is complex and the potential safety hazard is great, and further overcome the defects in the prior art.

Description

technical field [0001] The invention belongs to the field of semiconductor chip manufacturing, and relates to a semiconductor chip bonding wax cleaning agent and a preparation and use method thereof. Background technique [0002] Before semiconductor chip packaging and testing, it is necessary to coat one side of the functional area with adhesive wax, fix it on the grinding disc under pressure, and perform grinding and polishing operations on the exposed surface of the chip. After grinding and polishing, it is cleaned with bonding wax cleaning agent to restore the intrinsic functional surface of the chip. The main components of the bonding wax used in the industry are fatty acids with long carbon chains, rosin acid and derivatives based on the rosin structure. Industry experts have developed a variety of cleaning agents to clean the bonding wax. [0003] Patent CN 102191141 B discloses a modified hydrocarbon cleaning agent, which solves the disadvantages of low flash point ...

Claims

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Application Information

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IPC IPC(8): C11D1/66C11D1/72C11D1/74C11D1/825C11D3/18C11D3/20C11D3/44C11D3/50C11D11/00H01L21/02
CPCC11D1/667C11D1/72C11D1/74C11D1/825C11D3/18C11D3/187C11D3/43C11D3/50C11D3/2068H01L21/02057C11D2111/22
Inventor 杨同勇李文瀚李磊王堃刘翠琴
Owner DALIAN SANDAAOKE CHEM
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