A kind of osp processing method applied to copper-clad ceramic substrate

Abstract

The invention provides an OSP treatment method applied to a copper-clad ceramic substrate, and relates to the technical field of ceramic substrate surface treatment. The OSP treatment method applied to copper-clad ceramic substrates, the method is to add silver nanoparticles to the OSP potion to form an OSP nano-protection film. The OSP nano-protection film contains silver nanoparticles, anionic surfactants, and linear alkyl groups. Phosphoric acid, BTA, linear fatty acids, allyl thiourea, linear alkyl mercaptans, and deionized water. In the present invention, nanoparticles are added to the OSP potion, and it forms a nanocomposite layer together with the OSP film under agitation. Based on the special properties of the nanoparticles, the prepared nanocomposite layer has the properties of corrosion resistance, high temperature oxidation resistance Excellent properties such as anti-corrosion, and can protect nickel, gold, silver, and copper at the same time.

Description

technical field [0001] The invention relates to the technical field of surface treatment of ceramic substrates, in particular to an OSP treatment method applied to copper-clad ceramic substrates. Background technique [0002] High-power semiconductor modules are widely used in electric locomotives, electric vehicles, photovoltaic solar energy and other fields. As high-power modules become more integrated and use more power, the heat generated by semiconductor devices is on the rise. At present, the method of sintering metals with excellent electrical and thermal conductivity and ceramics such as nitrides with good insulating properties to form ceramic circuit boards has been widely used in power semiconductors to solve the heat dissipation problem of power semiconductor devices. [0003] OSP is a process for the surface treatment of printed circuit board (PCB) copper foil that meets the requirements of the RoHS directive. OSP is an organic solder protection film, also know...

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Problems solved by technology

[0005] However, according to the different needs of different customers, the ceramic substrate will have surface treatment methods such as nickel plating, gold plating, silver plating, and bare copper. When H2S, SO2, CO2, NO2 and other gases come into contact with them, even when they are irradiated by ultraviolet light, they are easy to generate corrosion products on the surface, making them discolored and blackened, which will seriously damage the electrical properties of the copper-clad ceramic substrate and damage the soldering performance. The existing OSP potions on the market can only be effective on one or two of the above-mentioned surfaces, and cannot be effective on the same piece of copper-clad ceramic substrate with both bare copper and silver-plated surface treatments.

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