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Modified MQ resin as well as preparation method and application thereof

A resin and modification technology, applied in the field of potting glue, can solve problems such as oil leakage, achieve the effects of shortening process time, improving efficiency, and reducing dissolution process time

Active Publication Date: 2021-03-30
WANHUA CHEM GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a modified MQ resin and a preparation method aiming at the technical problems such as oil leakage after curing of the existing addition-type silicone rubber potting compound.

Method used

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  • Modified MQ resin as well as preparation method and application thereof
  • Modified MQ resin as well as preparation method and application thereof
  • Modified MQ resin as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] (1) Preparation of hydrogen-containing MQ resin:

[0126] Equipped with stirrer, thermometer, condenser and N 2 In a three-necked flask with an atmosphere, add 208g of tetraethoxysilane, 59g of hexamethyldisiloxane, 5g of tetramethyldisiloxane, 22g of ethanol, 49g of xylene, 0.5g of 98wt% concentrated sulfuric acid, stir for 30min, and then Add 50g of water dropwise, and the dropwise addition is completed in 30 minutes, then raise the temperature to 85°C and react for 1 hour, then heat up and distill to remove ethanol and water, steam until the liquid phase temperature is 130°C, keep it warm for 4.5 hours and then lower it to room temperature; use xylene to extract, wash with water to the pH value 6.0 to 7.0, add anhydrous calcium chloride and dry until clear and transparent, filter to remove salt, and then rotary evaporate at 130°C to obtain solid hydrogen-containing MQ resin powder.

[0127] The hydrogen content of the product was measured by the method for measuring...

Embodiment 2

[0134] (1) Preparation of hydrogen-containing MQ resin:

[0135] In the three-necked flask equipped with stirrer, thermometer, condenser and N2 atmosphere, add tetramethoxysilane 152g, trimethylchlorosilane 80g, tetramethyldisiloxane 4.7g, ethanol 19g, xylene 43g, 0.5g of 38wt% concentrated hydrochloric acid, stirred for 30min, then added dropwise 53g of water, and the dropwise addition was completed in 25min, then the temperature was raised to 80°C for 1.5h, the ethanol and water were distilled off by heating, steamed to a liquid phase temperature of 120°C, and then dropped after 4 hours of heat preservation. to room temperature; extract with xylene, wash with water until the pH value is 6.0-7.0, add anhydrous calcium chloride to dry until clear and transparent, filter to remove salt, and then rotary evaporate to obtain the solid powder of hydrogen-containing MQ resin.

[0136] The hydrogen content of the product was measured by the method for measuring the hydrogen content. ...

Embodiment 3

[0144] (1) Preparation of hydrogen-containing MQ resin:

[0145] In the three-necked flask equipped with stirrer, thermometer, condenser and N2 atmosphere, add tetrapropoxysilane 264g, diphenyltetramethyldisiloxane 106g, tetramethyldisiloxane 4.5g, ethanol 30g , xylene 67g, trifluoromethanesulfonic acid 0.75g, stir for 30min, then dropwise add water 55g, 35min dropwise, then raise the temperature to 75°C and react for 2h, heat up and distill to remove ethanol and water, steam until the liquid phase temperature is 140°C , kept warm for 5 hours and then lowered to room temperature; extracted with xylene, washed with water until the pH value was 6.0 to 7.0, added anhydrous calcium chloride to dry until clear, filtered to remove salt, and then rotary evaporated to obtain a hydrogen-containing MQ resin solid powder.

[0146] The hydrogen content of the product was determined by the hydrogen content determination method. The hydrogen content of the product was 0.039 wt%, and the M / Q...

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Abstract

The invention provides modified MQ resin as well as a preparation method and application thereof, belonging to the technical field of pouring sealants. The modified MQ resin prepared by using the method provided by the invention belongs to solvent-free liquid MQ resin and is environment-friendly and low in VOC, and a process can be simplified. Under the condition that the reinforcing effect is notchanged basically, the method has the advantages that dissolving time for glue preparation is shortened, the time of a dissolving process is shortened, and efficiency is improved; the viscosity of the resin is reduced, the flowability of the resin is improved, potting leveling is more sufficient, and process operation is facilitated; and steric hindrance is reduced, crosslinking and curing are easy, and the process time is further shortened. The modified MQ resin is used in the field of pouring sealants, can effectively solve the problem of oil seepage of the pouring sealants, and prolongs the bonding life of the pouring sealants with base materials.

Description

technical field [0001] The invention relates to a modified MQ resin, a preparation method and application, and belongs to the technical field of potting glue. Background technique [0002] There are many kinds of potting materials, and at present, various synthetic polymers are the most widely used. Among them, epoxy resin, polyurethane elastomer and silicone polymer are the three most widely used polymers. [0003] Potting adhesives can also be used in LED materials, chip packaging materials, solar cell materials, protective coatings in other electronic or electrical industries, casting materials, etc., and can also be widely used in the fields of automotive electronics and household electronics. In the past, epoxy resin was mainly used. The epoxy resin potting material is characterized by small shrinkage, no by-products, and excellent electrical insulation performance. However, due to the limitation of the molecular structure itself, the heat resistance is not high, and i...

Claims

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Application Information

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IPC IPC(8): C08G77/44C08G77/12C08G77/20C09J183/10C09J183/05C09J11/06C09J11/04
CPCC08G77/44C08G77/12C08G77/20C09J183/10C09J11/06C09J11/04C08L2205/02C08K2003/2227C08L83/04C08K5/5435C08K7/26C08K3/22C08K13/04
Inventor 刘志锋封玲珑马伟曹骏高源杨继朋杨慧雅王庆义
Owner WANHUA CHEM GRP CO LTD
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