Micron-sized spherical silver powder as well as preparation method and application thereof

Abstract

The invention discloses micron-sized spherical silver powder as well as a preparation method and an application thereof. The preparation method comprises the following steps of S1, weighing a reactionbase solution, dissolving a silver source in deionized water to prepare a silver ion-containing solution, dissolving a reducing agent in the deionized water to obtain a reducing agent solution, wherein the concentration range of the silver ions in the silver ion solution is 0.1-2 mol / L; S2, preparing a pH regulating solution, adding the pH regulating solution into the reaction base solution, thesilver ion-containing solution and the reducing agent solution, and regulating the pH value of each solution to be 1-4; S3, adding a dispersing agent into the reducing agent solution, and uniformly stirring; and S4, simultaneously adding the silver ion-containing solution and the reducing agent solution into the reaction base solution in the stirring process at the temperature of 20-50 DEG C, carrying out solid-liquid separation, washing and drying on the reaction solution after the reaction is finished to obtain the micron-sized spherical silver powder. According to the method, the dispersingagent is added into the reducing agent, the morphology and the particle size of the prepared silver powder can be conveniently controlled through the steric hindrance effect of macromolecules in thereaction process, and meanwhile the uniformity of the prepared silver powder is improved.

Description

technical field [0001] The invention relates to a conductive metal powder and a preparation method thereof, in particular to a micron-sized spherical silver powder, a preparation method and an application thereof. Background technique [0002] In recent years, with the rapid development of electronic technology, the research and development of electronic materials has also experienced unprecedented development. Conductive paste is a very important branch of electronic materials. As a main raw material for the preparation of thick film circuits, conductive paste is used It is widely used in the preparation of electrode circuits of various high-end electronic components. Among them, conductive silver paste is used as a basic and key functional material for important conductive connections, electronic packaging and other various electronic components due to its high electrical and thermal conductivity, high chemical stability and unique low-temperature sintering characteristics...

AI Technical Summary

Problems solved by technology

[0004] At present, the most important method for producing silver powder for conductive paste is chemical reduction method, which uses a reducing agent to deposit the metal from the aqueous solution of its salt or complex in the form of powder, but the existing domestic preparation process still has complex operation processes, The shape, particle size and dispersibility of the prepared silver powder cannot meet the needs of subsequent products at the same time, and the silver powder in the conductive paste required in most high-precision electronic products still mainly relies on foreign imports

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