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Graphene modified phosphate composite adhesive and preparation method and application thereof in high-temperature sensor

A graphene modification and phosphate technology, applied in adhesives, inorganic adhesives, adhesive additives, etc., can solve the problems of thermal conductivity, poor acid and alkali resistance, etc., achieve outstanding corrosion resistance, solve low thermal conductivity, mechanical problems, etc. good performance effect

Inactive Publication Date: 2021-04-02
常州晶泰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the invention: In view of the problems of thermal conductivity and poor acid and alkali resistance existing in the current high-temperature composite binder, the present invention provides a graphene-modified phosphate composite binder and its preparation method and application in high-temperature sensors

Method used

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  • Graphene modified phosphate composite adhesive and preparation method and application thereof in high-temperature sensor
  • Graphene modified phosphate composite adhesive and preparation method and application thereof in high-temperature sensor
  • Graphene modified phosphate composite adhesive and preparation method and application thereof in high-temperature sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Copper hydroxide powder, alumina and graphene slurry were ball milled and mixed at a mass ratio of 1:0.01:0, the ball milling rate was 250r / min, and the time was 5h. The ball milled product was placed in a vacuum drying oven, vacuumed to 0.1 Pa, and kept at 80° C. for 2 hours. The dry product is calcined at high temperature to obtain a powder mixture, and the calcining environment is N 2 atmosphere, the calcination temperature is 800°C, and the calcination time is 5h. The curing agent powder mixture obtained after calcining is mixed evenly with the liquid phosphate adhesive at a mass ratio of 1:1.

[0024] Clean the surface to be bonded, and apply the graphene-modified phosphate composite material evenly on the surface to be bonded, with a thickness of 0.5 mm. Fix the bonding surface, put it into a constant temperature box and let it stand for curing. The curing temperature is 90°C and the curing time is 10 hours.

Embodiment 2

[0026] Copper hydroxide powder, magnesium oxide and graphene slurry (1%wt) were ball milled and mixed at a mass ratio of 1:0.01:0.5, the ball milling speed was 250r / min, and the time was 5h. The ball milled product was placed in a vacuum drying oven, vacuumed to 0.1 Pa, and kept at 80° C. for 2 hours. The dry product is calcined at high temperature to obtain a powder mixture, and the calcining environment is N 2 atmosphere, the calcination temperature is 800°C, and the calcination time is 2h. The curing agent powder mixture obtained after calcining is mixed evenly with the liquid phosphate adhesive in a mass ratio of 1:1.

[0027] Clean the surface to be bonded, and apply the graphene-modified phosphate composite material evenly on the bonding surface, with a thickness of 1mm. Fix the bonding surface, put it into a constant temperature box and let it stand for curing. The curing temperature is 90°C and the curing time is 10 hours.

Embodiment 3

[0029] Copper hydroxide powder, calcium oxide and graphene slurry (1%wt) were ball milled and mixed at a mass ratio of 1:0.01:1, the ball milling speed was 250r / min, and the time was 5h. The ball milled product was placed in a vacuum drying oven, evacuated to 0.1 Pa, and kept at 80° C. for 4 hours. The dried product was calcined at high temperature to obtain a powder mixture, the calcining environment was Ar atmosphere, the calcining temperature was 800° C., and the calcining time was 2 h. The curing agent powder mixture and the liquid phosphate adhesive are mixed evenly in a mass ratio of 1:1.

[0030] Clean up the surface to be bonded, and apply the graphene-modified phosphate composite material evenly on the bonding surface, with a thickness of 0.5mm. Fix the bonding surface, put it into a constant temperature box and let it stand for curing. The curing temperature is 100°C and the curing time is 10 hours.

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Abstract

The invention discloses a graphene modified phosphate composite adhesive as well as a preparation method and application thereof in a high-temperature sensor. The composite adhesive is mainly preparedfrom a curing agent powder mixture and a liquid phosphate adhesive, wherein the curing agent powder mixture comprises a metal hydroxide main material, a metal oxide auxiliary material and graphene slurry, and the mass ratio of the curing agent powder mixture to the liquid phosphate adhesive is 1:(1-3). Firstly, the main material, auxiliary material and graphene slurry are subjected to ball milling and mixing, a curing agent powder mixture is obtained after vacuum drying and high-temperature calcination, and then the curing agent powder mixture is mixed with a liquid phosphate adhesive to obtain a composite adhesive product. During application, the composite adhesive is uniformly smeared on a to-be-bonded surface, and constant-temperature curing is performed. The graphene modified phosphate composite adhesive disclosed by the invention has the characteristics of high bonding strength, high temperature resistance, corrosion resistance, good thermal conductivity and the like, and is suitable for packaging of temperature-resistant elements such as high-temperature sensors and high-temperature thermocouples and bonding of metal materials.

Description

technical field [0001] The invention belongs to the technical field of composite adhesives, and in particular relates to a graphene-modified phosphate composite adhesive, a preparation method thereof, and an application in a high-temperature sensor. Background technique [0002] High-temperature sensors are key core devices in the aerospace field. They are of great value in the realization of aero-engine status monitoring and fault diagnosis, and aircraft structural health monitoring. They are urgent problems in the aerospace field. In the field of aerospace, high-temperature sensors need to be used in a high temperature of 500-800°C, a pressure of 10-100MPa and a low oxygen partial pressure atmosphere of 0-100Pa for a long time, so choosing a suitable high-temperature adhesive is a key issue. It is necessary to ensure the bonding strength under high temperature and high pressure conditions, and it must be suitable for the operating conditions of potting under normal tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J1/00C09J11/04
CPCC09J1/00C09J11/04
Inventor 沈丽明戴鹏吉成王一峰
Owner 常州晶泰新材料科技有限公司