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Solution for direct chemical copper plating of aluminum substrate and application method thereof

A technology of chemical copper plating and application method, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve problems such as inapplicability, and achieve the effect of reducing displacement attack

Active Publication Date: 2021-04-02
江苏矽智半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pH in one of its operating examples is at 11-13, which still belongs to the traditional strong alkaline electroless copper plating system, and is not suitable for the electroless copper plating process with photoresist

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] The present embodiment provides a kind of solution that is used for the direct electroless copper plating of aluminum substrate, and the electroless copper solution of 1L comprises following several components:

[0059] Copper salt: 8g / L;

[0060] Sulfite: 20g / L;

[0061] Complexing agent: 10g / L;

[0062] Reducing agent: 10g / L;

[0063] Buffer: 10g / L;

[0064] Corrosion inhibitor: 0.05g / L;

[0065] Surfactant: 0.05g / L;

[0066] Adjust the pH value to 7.0 with acid and alkali, and the balance is water.

[0067] Copper salt is copper sulfate pentahydrate, sulfite is sodium sulfite, complexing agent is disodium edetate, reducing agent is sodium borohydride, buffering agent is ammonium chloride, corrosion inhibitor is imidazoline, surfactant For polyethylene glycol 1000, add an appropriate amount of deionized water, adjust the pH value of the system to 7.0 with sulfuric acid, and make up to 1 liter with water.

Embodiment 2

[0069] The present embodiment provides a kind of solution that is used for the direct electroless copper plating of aluminum substrate, and the electroless copper solution of 1L comprises following several components:

[0070] A solution for direct electroless copper plating on aluminum substrates, 1L of electroless copper solution includes the following components:

[0071] Copper salt: 15g / L;

[0072] Sulfite: 60g / L;

[0073] Complexing agent: 30g / L;

[0074] Reducing agent: 30g / L;

[0075] Buffer: 50g / L;

[0076] Corrosion inhibitor: 0.5g / L;

[0077] Surfactant: 0.1g / L;

[0078] Adjust the pH value to 8.0 with acid and alkali, and the balance is water.

[0079] The copper salt is copper chloride, the sulfite is potassium sulfite, the complexing agent is tetrasodium edetate, the reducing agent is hydrazine hydrate, the buffering agent is sodium phosphate, the corrosion inhibitor is imidazoline, and the surface active The agent is polyethylene glycol 400, adding an app...

Embodiment 3

[0081] The present embodiment provides a kind of solution that is used for the direct electroless copper plating of aluminum substrate, and the electroless copper solution of 1L comprises following several components:

[0082] A solution for direct electroless copper plating on aluminum substrates, 1L of electroless copper solution includes the following components:

[0083] Copper salt: 15g / L;

[0084] Sulfite: 30g / L;

[0085] Complexing agent: 25g / L;

[0086] Reducing agent: 15g / L;

[0087] Buffer: 30g / L;

[0088] Corrosion inhibitor: 0.25g / L;

[0089] Surfactant: 0.075g / L;

[0090] Adjust the pH value to 7.5 with acid and alkali, and the balance is water.

[0091] The copper salt is copper chloride, the sulfite is potassium sulfite, the complexing agent is potassium sodium tartrate, the reducing agent is hydroxylamine sulfate, the buffering agent is ammonia water, the corrosion inhibitor is imidazoline, and the surfactant is polyethylene glycol Alcohol 6000, add an a...

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Abstract

The invention discloses a solution for direct chemical copper plating of an aluminum substrate and an application method thereof. The solution comprises the following components of, in percentage by mass, 5-15 g / L of copper salt, 20-60 g / L of sulfite, 10-50 g / L of complexing agent, 10-30 g / L of reducing agent, 10-50 g / L of buffering agent, 0.05-0.5 g / L of corrosion inhibitor, 0.05-0.1 g / L of surfactant and the balance water, and the copper plating solution is formed by uniformly mixing the components according to the proportion and adjusting the pH value to 7.0-8.0 by using a buffer agent. Thesolution for direct chemical copper plating of the aluminum substrate solves the problem that traditional copper plating corrodes aluminum and the problem that a plating solution attacks photoresist,in the field of wafer-level packaging, vacuum copper plating can be completely replaced, the cost is reduced, and the productivity is improved.

Description

technical field [0001] The invention relates to the technical field of copper plating solutions, in particular to a solution for direct electroless copper plating on an aluminum substrate and an application method thereof. Background technique [0002] There are many surface treatment methods for aluminum substrates. In terms of electroless plating, electroless nickel plating technology is basically used for aluminum substrates. This technology has been developed for many years and has been quite mature, while the process of direct electroless copper plating on aluminum substrates is not common. In the field of semiconductor technology, aluminum lines have long been the main force of metal interconnection in chips. However, with the continuous improvement of the requirements for chip computing efficiency and power consumption reduction, aluminum lines have been difficult to meet such high requirements, so they began to appear in aluminum-based Vacuum copper plating is carrie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40C23C18/18
CPCC23C18/1841C23C18/40
Inventor 王江锋刘可
Owner 江苏矽智半导体科技有限公司
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