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Efficient heat conduction gasket and preparation method thereof

A thermally conductive gasket and high-efficiency technology, applied in the field of high-efficiency thermally conductive gaskets and their preparation, can solve the problems of insufficient flexibility and adhesion, poor thermal conductivity, etc., and achieve the advantages of improving thermal conductivity, reducing absorption, and reducing contact thermal resistance. Effect

Pending Publication Date: 2021-04-09
GUANGDONG LEPUTAI NEW MATERIAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a high-efficiency heat-conducting gasket, which effectively solves the problems of poor thermal conductivity and insufficient flexibility and adhesion of existing heat-conducting gaskets

Method used

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  • Efficient heat conduction gasket and preparation method thereof
  • Efficient heat conduction gasket and preparation method thereof
  • Efficient heat conduction gasket and preparation method thereof

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preparation example Construction

[0031] The embodiment of the present invention also provides a method for preparing the above-mentioned high-efficiency heat-conducting gasket, the method comprising the following steps:

[0032] Step 1, add the micron-scale carrier to the nano-scale thermally conductive filler with high thermal conductivity in a weight ratio of 95:5 to 85:15 into the high-speed mixer, and mix and disperse under the condition of a line speed of 40 to 70m / s 5 to 30 minutes to obtain a thermally conductive filler with a composite structure after high-speed dispersion;

[0033] Step 2, placing the high-speed dispersed composite structure heat-conducting filler and the one-dimensional structure-oriented heat-conducting material obtained in step 1 in a vacuum mixer, and vacuuming at 10-50°C for 10-30 minutes , after the air in the system is removed, stop the vacuum treatment;

[0034] Step 3: Mix vinyl polyorganosiloxane, silane coupling agent, terminal hydrogen-containing silicone oil, and cataly...

Embodiment 1

[0038] Step 1, 80 parts of modified spherical alumina (average particle size is 20 μm), 15 parts of modified spherical alumina (average particle size is 5 μm) and 5 parts of modified nano-graphene (average particle size is 200nm) are added respectively into a high-speed mixer (FM-3L, Japan Mitsui Mining Co., Ltd.), and then mix and disperse for 30 minutes at a line speed of 60m / s to obtain a thermally conductive filler with a composite structure after high-speed dispersion;

[0039]Step 2, put the thermally conductive filler of the composite structure obtained in step 1 and 20 parts of carbon fiber (length: 200 μm, diameter: 10 μm) in a vacuum mixer, and vacuumize and stir at room temperature for 30 minutes, and wait for the system to After the air is removed, stop the vacuum treatment;

[0040] Step 3, 25 parts of vinyl polyorganosiloxane (viscosity of 5000CP), 5 parts of terminal hydrogen-containing silicone oil (viscosity of 100CP, hydrogen content of 1%), 1 part of dodecyl...

Embodiment 2

[0043] Step 1, 80 parts of organosilicon microspheres (average particle diameter is 30 μm), 15 parts of organosilicon microspheres (average particle diameter is 5 μm) and 10 parts of modified nano-graphene (average particle diameter is 200nm) are added to the high-speed In the mixer (FM-3L, Mitsui Mining Co., Ltd. of Japan), then carry out mixing and dispersing for 30min at a linear speed of 60m / s to obtain a thermally conductive filler with a composite structure after high-speed dispersion;

[0044] Step 2, put the thermally conductive filler of the composite structure obtained in step 1 and 20 parts of carbon fiber (length: 200 μm, diameter: 10 μm) in a vacuum mixer, and vacuumize and stir at room temperature for 30 minutes, and wait for the system to After the air is removed, stop the vacuum treatment;

[0045] Step 3, 20 parts of vinyl polyorganosiloxane (viscosity of 3000CP), 5 parts of terminal hydrogen-containing silicone oil (viscosity of 50CP, hydrogen content of 1.5%...

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Abstract

The invention discloses an efficient heat conduction gasket, which comprises the following components by weight: 60-100 parts of composite structure heat conduction filler, 5-25 parts of a one-dimensional structure oriented arrangement heat conduction material, 10-40 parts of vinyl polyorganosiloxane, 3-20 parts of terminal hydrogen-containing silicone oil, 0.25-2 parts of a silane coupling agent and 0.01-0.2 part of a platinum catalyst. Specifically, the composite structure heat conduction filler is formed by uniformly coating a microsphere carrier with nanoparticles with high heat conductivity coefficient. According to the product disclosed by the invention, nano particles with high heat conductivity coefficient can be effectively dispersed and uniformly coated on the surface of the microsphere carrier in a high-speed dispersion manner, a three-dimensional network passage capable of quickly conducting heat is formed on the surfaces of the closely packed microspheres, the interface heat resistance is reduced, and the product has a synergistic effect with the carbon fibers arranged in an oriented manner, and the heat conduction efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and in particular relates to a high-efficiency thermal conduction gasket and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of my country's intelligent and automated industries, the integration of electronic components is getting higher and higher, and the heat generated during work is getting higher and higher, resulting in a decrease in the reliability, stability and service life of electronic components. Therefore, the negative impact of heat dissipation problems is becoming more and more serious. The thermal conductivity of traditional thermal interface materials is not high, and the heat dissipation performance is not enough to meet the heat dissipation requirements of higher power and more complex environments. Therefore, it is increasingly urgent to improve the thermal conductivity of thermally conductive material...

Claims

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Application Information

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IPC IPC(8): C09K5/14
CPCC09K5/14
Inventor 孟鸿刘志军刘振国张秋禹陈妍慧佟振双王密马宝光黄维羊辉
Owner GUANGDONG LEPUTAI NEW MATERIAL TECH
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