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High-performance medium-temperature cured single-component epoxy structural adhesive and preparation method thereof

An epoxy structural adhesive, a single-component technology, applied in the direction of epoxy resin glue, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of insufficient toughness and short storage time, and achieve Excellent toughness, high bonding strength, and the effect of improving the application range

Pending Publication Date: 2021-04-13
重庆德天汽车新材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing medium-temperature curing epoxy structural adhesives are mainly used for packaging sealing and structural bonding in industries such as electronic printed circuits and medical devices. However, the existing medium-temperature curing single-component epoxy structural adhesives often have insufficient toughness and storage The problem of short time, as the market demand for one-component epoxy adhesive continues to grow, these problems need to be solved urgently

Method used

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  • High-performance medium-temperature cured single-component epoxy structural adhesive and preparation method thereof
  • High-performance medium-temperature cured single-component epoxy structural adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The components and component weights of structural adhesives are shown in the table below:

[0036] component name Parts by mass / Kg NPEL-128 80 NPER-133L 25 102C-5 20 MX-153 33 XA-297 2 DDA5 12 U52M 4 PN-23 1.5 Nano calcium carbonate 20 H18 7 KH-560 4

Embodiment 2

[0038] The components and component weights of structural adhesives are shown in the table below:

[0039] component name Parts by mass / Kg NPES-901 55 622 25 NPER-133L 25 102C-5 20 MX-153 33 XA-290 2 DDA5 12 U52M 4 PN-23 1.5 Nano calcium carbonate 20 H18 7 KH-560 4

Embodiment 3

[0041] The components and component weights of structural adhesives are shown in the table below:

[0042] component name Parts by mass / Kg E44 80 NPER-133L 25 102C-5 20 MX-153 33 CTBN 1.5 DDA5 12 U52M 4 PN-23 1.5 Nano calcium carbonate 20 H18 7 KH-560 4

[0043] Each structural glue of embodiment 1-3 is prepared according to the following method:

[0044] 1) Take epoxy resin, diluent, toughening agent, filler and thixotropic reinforcing agent in proportion, add it to a planetary mixer, and stir at a high degree until it is completely dispersed and uniform;

[0045] 2) Vacuum dehydration at 110°C for 10 minutes, then cool to room temperature, take latent curing agent, accelerator, and coupling agent in proportion, stir at 30°C until completely dispersed, and vacuumize for 30 minutes to obtain Structural glue.

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Abstract

The high-performance medium-temperature cured single-component epoxy structural adhesive comprises the following components in parts by weight: 100 parts of epoxy resin; 0-30 parts of a diluent; 10-15 parts of a latent curing agent; 30-40 parts of a toughening agent; 3-7 parts of an accelerant; 3-7 parts of a thixotropic reinforcing agent; 3-5 parts of a coupling agent; 20-30 parts of filler. The invention also provides a preparation method of the structural adhesive. The preparation method comprises the following steps: 1) proportionally taking the epoxy resin, diluent, flexibilizer, filler and thixotropic reinforcing agent, and uniformly stirring; and 2) carrying out vacuum dehydration in an environment with a temperature of more than 100 DEG C, cooling to room temperature, taking the latent curing agent, the accelerator and the coupling agent in proportion, uniformly stirring in an environment with a temperature of less than 40 DEG C, and carrying out vacuum defoamation to obtain the structural adhesive. The structural adhesive disclosed by the invention is high in toughness, high in bonding strength, long in storage life and capable of resisting high temperature (as high as 280 DEG C) for a short time, and can effectively meet the use requirements of the market on the single-component epoxy structural adhesive.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a high-performance medium-temperature curing one-component epoxy structural adhesive and a preparation method thereof. Background technique [0002] One-component epoxy structural adhesive has the advantages of only one component without metering and mixing, convenient operation, no solvent, environmental protection, good adhesion to various substrates, low curing shrinkage, and environmental resistance. It is widely used in automobile industry, construction manufacturing, electronic communication and other industries. [0003] One-component epoxy structural adhesives are divided into moisture curing type and heat curing type. According to the curing temperature, it can be roughly divided into low temperature (≤80°C) curing type one-component epoxy, medium temperature (80-150°C) curing type one-component epoxy, and high temperature (≥150°C) curing type one-component epoxy. [0004] The...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08C08G59/68C08G59/40
CPCC09J163/00C09J11/04C09J11/08C08G59/686C08G59/4021C08L2201/08C08L2205/035C08L2205/025C08L63/00C08L75/04C08L21/00C08K3/26C08K3/36C08K5/5435C08K13/02
Inventor 陈林项仕勇罗登伟戴宏程
Owner 重庆德天汽车新材料研究院有限公司
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