Novel FBAR filter and preparation method thereof
A filter, a new type of technology, applied to electrical components, impedance networks, etc., to reduce energy loss, reduce stress, and suppress clutter
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Embodiment 1
[0038] A new type of FBAR filter, which is formed by cascading n resonators, n is a positive integer and n≥1; as Figure 9 As shown, the resonator includes a support substrate 106, an air cavity support layer 105, a bottom electrode 104, a seed layer 103, a piezoelectric thin film structure layer 102, a top electrode 107, and a bottom electrode lead 108; the air cavity support layer There are two 105, respectively laminated on the support substrate 106, the bottom electrode 104 is respectively connected to the two air cavity support layers 105, the bottom electrode 104, the air cavity support layer 105 and the support substrate 106 form a cavity; The seed layer is stacked on the bottom electrode 104 and the air cavity support layer 105 ; the piezoelectric film structure layer 102 and the top electrode 107 are stacked on the seed layer 103 in sequence; the bottom electrode lead 108 is connected to the bottom electrode 104 .
[0039] The supporting substrate 106 is a silicon sub...
Embodiment 2
[0048] A preparation method of a novel FBAR filter, the specific preparation method is as follows:
[0049] (1) if figure 2 As shown, take a preparation substrate 110, the preparation substrate 110 can be a substrate material of silicon, silicon carbide, sapphire, glass, metal or organic polymer;
[0050] (2) if image 3 As shown, the groove 101 is etched on the prepared substrate 110 by an etching method;
[0051] (3) if Figure 4 As shown, the piezoelectric thin film structure layer 102 is prepared by chemical vapor deposition or sputtering in the groove 101. The piezoelectric thin film structure layer 102 is a single crystal or polycrystalline aluminum nitride material, and can also be ZnO, PZT, etc. Materials with electrical properties, the thickness of the piezoelectric film structure layer 102 is between 0.02 and 10 microns.
[0052] (4) if Figure 5 As shown, the seed layer 103 and the bottom electrode 104 are prepared by chemical vapor deposition or sputtering or...
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