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Low-viscosity thermosetting polyimide resin as well as preparation method and application thereof

A polyimide resin and thermosetting technology, applied in the field of polymer materials, can solve the problems of poor manufacturability, high viscosity of thermosetting polyimide resin, limited application, etc., and achieve cheap price, good thermal stability and wide application foreground effect

Pending Publication Date: 2021-04-27
长春长光宇航复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problems of high viscosity, poor manufacturability and limited application of thermosetting polyimide resin in the prior art, and provide a low-viscosity thermosetting polyimide resin and its preparation method and application

Method used

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  • Low-viscosity thermosetting polyimide resin as well as preparation method and application thereof
  • Low-viscosity thermosetting polyimide resin as well as preparation method and application thereof
  • Low-viscosity thermosetting polyimide resin as well as preparation method and application thereof

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preparation example Construction

[0052] The preparation method of low-viscosity thermosetting polyimide resin of the present invention, step is as follows:

[0053] Step 1. Under the condition of maintaining the temperature at 10-15°C and continuous stirring, add the solvent containing the dibasic anhydride to the solvent containing the diamine dropwise. After the addition is completed, stir and react for 10-12 hours to obtain polyamide acid solution;

[0054] Step 2. Under the condition of maintaining the temperature at 20-25°C and continuous stirring, add the solvent dissolved in monobasic acid anhydride to the polyamic acid solution obtained in step 1. After the addition is completed, stir and react for 10-15 hours to obtain the active radical Group-terminated polyamic acid solution;

[0055] Step 3: Add a water-carrying agent to the active group-terminated polyamic acid solution prepared in Step 2, first heat the reaction system to 140-160°C for 6-8 hours, take out the excess water generated by the react...

Embodiment 1

[0067] Low viscosity thermosetting polyimide resin, the structural formula is as follows:

[0068]

[0069] Wherein, A is the following structure, or one of the isomers of the following structure:

[0070]

[0071] B is the following structure, or one of the isomers of the following structure:

[0072]

[0073] C is the following structure, or one of the isomers of the following structure:

[0074]

[0075] The preparation method of above-mentioned low-viscosity thermosetting polyimide resin:

[0076] Step 1. Dissolve 0.2mol of 4,4'-diaminodiphenyl ether in 160mL of dimethylacetamide in the reaction device, keep the temperature at 12°C and keep stirring at 40rpm, and add to the reaction device at a rate of 10mL / min Add dropwise a mixed solution of 0.1mol 3,3',4,4'-biphenyltetracarboxylic dianhydride and 120mL dimethylacetamide, after the dropwise addition, stir and react for 12 hours to obtain a polyamic acid solution;

[0077] Step 2. Fully dissolve 0.2 mol of ...

Embodiment 2

[0085] Low viscosity thermosetting polyimide resin, the structural formula is as follows:

[0086]

[0087] Wherein, A is the following structure, or one of the isomers of the following structure:

[0088]

[0089] B is the following structure, or one of the isomers of the following structure:

[0090]

[0091] C is the following structure, or one of the isomers of the following structure:

[0092]

[0093] The preparation method of above-mentioned low-viscosity thermosetting polyimide resin:

[0094] Step 1. Dissolve 0.2mol of 4,4'-diaminodiphenylmethane in 160mL of dimethylacetamide in the reaction device, keep the temperature at 12°C and keep stirring at 40rpm, and proceed to the reaction at a rate of 10mL / min Add dropwise a mixed solution of 0.1mol pyromellitic dianhydride and 120mL dimethylacetamide into the device, after the dropwise addition is completed, stir and react for 12 hours to obtain a polyamic acid solution;

[0095] Step 2. Fully dissolve 0.2 m...

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Abstract

The invention relates to low-viscosity thermosetting polyimide resin as well as a preparation method and application thereof, and belongs to the technical field of high polymer materials. The technical problems that in the prior art, thermosetting polyimide resin is large in viscosity, poor in manufacturability, limited in application and the like are solved. The structural formula of the low-viscosity thermosetting polyimide resin is shown as a formula I in the specification. The thermosetting polyimide resin has the advantage of low melt viscosity, and can be well combined with reinforcing fibers. Meanwhile, the thermosetting polyimide resin has good heat resistance and has a wide application prospect in the field of high-temperature-resistant fiber composite materials. The thermosetting polyimide resin disclosed by the invention is reasonable in synthetic route, simple in process and easily available in raw materials, and has important popularization and application values.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a low-viscosity thermosetting polyimide resin and its preparation method and application, in particular to the application of the low-viscosity thermosetting polyimide resin as a fiber-reinforced composite material matrix resin. Background technique [0002] Polyimide refers to a class of heat-resistant polymer materials containing imide rings in the main chain. It has excellent thermal properties, mechanical properties, radiation resistance and dielectric properties, and plays an important role in high-temperature resistant resin materials. status. [0003] Polyimides are divided into two categories: thermoplastic and thermosetting polyimides. Thermoplastic polyimide refers to the polyimide whose main chain is a linear structure. It can be produced by molding, extrusion, injection and other processing molding technologies. It is mainly used in aerospace, n...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/04
CPCC08G73/1071C08G73/1067C08G73/1039C08G73/1014C08J5/04C08J2379/08
Inventor 商伟辉卜凡哲林再文邹志伟姜昊
Owner 长春长光宇航复合材料有限公司
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