Hot melt adhesive, preparation method thereof and wire head insulation method
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- DONGGUAN NVT TECH
- Publication Date
- 2021-05-11
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Abstract
Description
technical field
[0001] The present application relates to the technical field of wire head insulation, in particular to a hot melt adhesive, a preparation method thereof, and a wire head insulation method. Background technique
[0002] At present, with the vigorous development of small electronic products such as telephone watches, electronic cigarettes, wireless earphones, wireless mice, etc., the application of small batteries is becoming more and more extensive. Many applications. However, since one end of the wire is connected to the positive and negative poles of the battery management system, and the other end is exposed in the non-fixed battery storage tray, it is very easy to contact foreign objects or adjacent conductors when the battery is transported from the battery manufacturer to the host. Direct electrical connection causes a short circuit problem, so that the existing outgoing batteries must be insulated on the exposed wires before shipment.
[0003] There ...