Two-component high-thermal-conductivity self-leveling pouring sealant as well as preparation method and application thereof

A high thermal conductivity, self-leveling technology, used in adhesives, polymer adhesive additives, non-polymer adhesive additives, etc. Problems such as poor flatness

Active Publication Date: 2021-05-18
广东皓明有机硅材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the thermal conductivity of silicone potting products on the market is 0.6-3W/m.K, and the viscosity is 2000-30000mPa.s, which is difficult to fully meet the emerging new energy vehicle battery system, new energy vehicle electronic control system, 5G communication base station system, etc. The industry's high heat dissipation requirements for high thermal co...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] A two-component high thermal conductivity self-leveling potting glue, including A component and B component prepared by the following steps; when the two-component high thermal conductivity self-leveling potting glue is used, the A component and the B component According to the mass ratio of 1:1 mixed evenly obtained. The parts are all parts by mass.

[0042] (1) Preparation of component A: Vinyl-terminated silicone oil (vinyl-terminated poly(dimethylsiloxane), 100mPa.s, vinyl mass content 1.06±0.03%, model RH-Vi100E, Zhejiang Runhe Organic Silicon New Materials Co., Ltd.) 6.5 parts, surface treatment agent cyclohexylmethyldimethoxysilane 0.2 parts were added to the power mixer in turn, the dispersion frequency was 10Hz, the revolution frequency was 20Hz, stirred for 10 minutes, and then the heat-conducting filler was spherically formed in batches Alumina mixture (50 parts with a median particle size of 80 μm, 30 parts with a median particle size of 12 μm, and 13 parts...

Embodiment 2

[0045] A two-component high thermal conductivity self-leveling potting glue, including A component and B component prepared by the following steps; when the two-component high thermal conductivity self-leveling potting glue is used, the A component and the B component According to the mass ratio of 1:1 mixed evenly obtained. The parts are all parts by mass.

[0046] (1) Preparation of component A: 6.5 parts of vinyl-terminated silicone oil (50mPa.s, vinyl mass content 2.0%, model RH-Vi50E, Zhejiang Runhe Silicone New Material Co., Ltd.), surface treatment agent phenylmethyl Add 0.2 parts of dimethoxysilane into the power mixer in turn, stir at a dispersion frequency of 10 Hz and a revolution frequency of 20 Hz for 10 minutes, and then add thermally conductive filler spherical alumina mixture (40 parts with a median particle size of 60 μm, and 30 parts with a median particle size of 8 μm) in batches. Parts, median particle size 0.5μm (23 parts) 93 parts, black material (carbon...

Embodiment 3

[0049] A two-component high thermal conductivity self-leveling potting glue, including A component and B component prepared by the following steps; when the two-component high thermal conductivity self-leveling potting glue is used, the A component and the B component According to the mass ratio of 1:1 mixed evenly obtained. The parts are all parts by mass.

[0050] (1) Preparation of component A: 6.5 parts of vinyl-terminated silicone oil (70mPa.s, vinyl mass content 1.45±0.15%, model RH-Vi70E, Zhejiang Runhe Silicone New Material Co., Ltd.), surface treatment agent ring Add 0.1 part of hexylmethyldimethoxysilane and 0.1 part of phenylmethyldimethoxysilane into the power mixer in turn, stir for 10 minutes at a dispersion frequency of 10 Hz and a revolution frequency of 20 Hz, and then add thermally conductive filler spherical alumina in batches Mixture (45 parts with a median particle size of 70 μm, 30 parts with a median particle size of 10 μm, and 18 parts with a median pa...

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Abstract

The invention discloses a two-component high-thermal-conductivity self-leveling pouring sealant as well as a preparation method and application thereof. The pouring sealant comprises a component A and a component B; the component A is prepared from the following components in parts by weight: 6 to 7 parts of vinyl-terminated silicone oil, 0.1 to 0.3 part of surface treating agent, 90 to 95 parts of heat-conducting filler, 0.05 to 0.15 part of pigment and 0.1 to 0.3 part of platinum catalyst; and the component B is prepared from 3 to 4 parts of vinyl-terminated silicone oil, 0.1 to 0.3 part of surface treating agent, 90 to 95 parts of heat-conducting filler, 2 to 3 parts of terminal hydrogen silicone oil, 0.5 to 1 part of side hydrogen silicone oil and 0.05 to 0.15 part of inhibitor. The heat conductivity coefficient of the pouring sealant reaches up to 4 W/m.K, and the pouring sealant is low in viscosity, good in self-leveling property, excellent in flame retardant property and good in electrical insulation property, shows very good comprehensive performance and is very suitable for being used for pouring electronic modules with efficient heat dissipation requirements; and the raw materials are easily available, and the preparation method is simple and easy to implement and facilitates industrialization.

Description

technical field [0001] The invention belongs to the field of materials, in particular to a two-component high thermal conductivity self-leveling potting glue and its preparation method and application. Background technique [0002] Addition-type silicone potting adhesive has its unique advantages when used in electronic module potting. It is safe and environmentally friendly, does not exotherm during curing, does not release small molecular substances, has good deep curing, low curing shrinkage, and small internal stress. It is suitable for precision electronic components. The damage to the device is small, and the crosslinking density and curing speed are easy to control. LED lighting, automotive, aerospace and other fields. [0003] With the development of the electronics industry, electronic modules tend to be highly integrated, high-power, and miniaturized, which puts forward higher requirements for the thermal conductivity of the potting compound. At present, the ther...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J11/08
CPCC09J183/04C09J11/04C09J11/06C09J11/08C08L2205/025C08K2003/2227C08L2201/02C08K2201/003C08L83/04C08K7/18C08K3/22C08K3/04C08K5/5419C08K13/04
Inventor 程宪涛吴向荣周东健莫飞梁桢威
Owner 广东皓明有机硅材料有限公司
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