Two-component high-thermal-conductivity self-leveling pouring sealant as well as preparation method and application thereof

Abstract

The invention discloses a two-component high-thermal-conductivity self-leveling pouring sealant as well as a preparation method and application thereof. The pouring sealant comprises a component A and a component B; the component A is prepared from the following components in parts by weight: 6 to 7 parts of vinyl-terminated silicone oil, 0.1 to 0.3 part of surface treating agent, 90 to 95 parts of heat-conducting filler, 0.05 to 0.15 part of pigment and 0.1 to 0.3 part of platinum catalyst; and the component B is prepared from 3 to 4 parts of vinyl-terminated silicone oil, 0.1 to 0.3 part of surface treating agent, 90 to 95 parts of heat-conducting filler, 2 to 3 parts of terminal hydrogen silicone oil, 0.5 to 1 part of side hydrogen silicone oil and 0.05 to 0.15 part of inhibitor. The heat conductivity coefficient of the pouring sealant reaches up to 4 W / m.K, and the pouring sealant is low in viscosity, good in self-leveling property, excellent in flame retardant property and good in electrical insulation property, shows very good comprehensive performance and is very suitable for being used for pouring electronic modules with efficient heat dissipation requirements; and the raw materials are easily available, and the preparation method is simple and easy to implement and facilitates industrialization.

Description

technical field [0001] The invention belongs to the field of materials, in particular to a two-component high thermal conductivity self-leveling potting glue and its preparation method and application. Background technique [0002] Addition-type silicone potting adhesive has its unique advantages when used in electronic module potting. It is safe and environmentally friendly, does not exotherm during curing, does not release small molecular substances, has good deep curing, low curing shrinkage, and small internal stress. It is suitable for precision electronic components. The damage to the device is small, and the crosslinking density and curing speed are easy to control. LED lighting, automotive, aerospace and other fields. [0003] With the development of the electronics industry, electronic modules tend to be highly integrated, high-power, and miniaturized, which puts forward higher requirements for the thermal conductivity of the potting compound. At present, the ther...

AI Technical Summary

Problems solved by technology

At present, the thermal conductivity of silicone potting products on the market is 0.6-3W / m.K, and the viscosity is 2000-30000mPa.s, which is difficult to fully meet the emerging new energy vehicle battery system, new energy vehicle electronic control system, 5G communication base station system, etc. The industry's high heat dissipation requirements for high thermal conductivity potting compounds

Increasing the filling amount of thermally conductive fillers is an effective way to improve the thermal conductivity of silicone potting adhesives, but increasing the filling amount will lead to poor self-leveling properties, higher viscosity, and poor applicability of the potting adhesive, which cannot meet the potting construction process Require